The researchers working on it are saying they can get it down to as low as 14A/1.4nm node.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
antiterror13
Brigadier
wowww, interesting. Wondering with 6x multi patterning what is the impact to the yield ? But I guess still okay considering how expensive EUV is and is banned to China
Did it say what lithography machine is used to get to 1.4nm with 6x multi patterning ?
Does DUV yield issues fixes and predictability transfer over to EUV fabrication flow?
And one of the buyer is Intel, so with gov't subsidies they can buy TSMC Arizona FAB for pennies with excess money for share buy back, Wonderful....lol NO wonder wall street is so bullish on Intel, they know something that we don't.
6 days ago — Considering Intel stock costs roughly $42 today, that's a huge vote of confidence. Chowdhry's price target implies this $182 billion company ...
Missing:
I think we discussed this stuff in the first semi conductor thread. One would almost say Taiwan's TSMC is paying its tribute to its master without getting more in return etc etc etc...
But i think its save to say that intel stock price will get a nice boost post 2025.
anything is theoretically possible, but getting consistent results is a lot harder. I'd spend far less time hoping that 4x or 6x remove the need to use EUV and wait for more realistic progressional areas.
YMTC showcasing QLC SSD X3-6070 with 4000x R/W life, on par with TLC
YMTC showcasing QLC SSD X3-6070 with 4000x R/W life, on par with TLC
So instead of Ghost City, Ghost Factory?
Lets see, Raymondo said that she could stop China fabs from making chips with just an order and the biggest equipment maker are AMAT, LAM and KLA all from the US, in theory etching, deposition, implantation, CMP, cleaning and metrology makes the bulk of tools in a fab, so in theory the US just only needed to tell their companies to stop servicing their tools, they dont need their lapdogs and they did that in 2022. So their sanctions are not working, either China is servicing these tools themselves or the share of domestic made tools in higher end processes is higher that most D.C. pundits think and they are hoping/copeing that ASML is the only thin rope that keep China from making high end chips on their own.
SMEC investor Q&A
For AI, they are investing in developing 55nm high efficiency power management chip platform (55nm BCD?) for AI datacenters
For BCD, 55nm is their 2nd gen product. not sure if their HVIC platform includes more than just BCD
They are growing SiC production line and BCD production line.
A new generation of IGBT will start production in 2nd half of this year. Should improve revenues
They have developed SiC chip/module, BCD and VCSEL tech
focuses on AI datacenter, wind/solar/storage usage, smart grid and such. A lot of IGBT/SiC MOS demand
They have 4500V IGBT ready for grid. Now with pwer chip product covering 12V-6500V
Their SiC is used in main inverter, OBC, DC/DC system, auxiliary system in NEVs
Their automotive partners include BYD, NIO, Li Auto and XPeng
ACM Research Shanghai is expanding their semiconductor equipment layout in 2024.
Shengmei Shanghai continues to optimize and refine existing equipment, and enriches product categories through extension development. In addition to cleaning equipment, AMC Shanghai is also actively expanding its product portfolio in semiconductor electroplating equipment, semiconductor copper polishing equipment, advanced packaging wet-process equipment, vertical furnace tube equipment, front-end coating and development (Track) equipment, and plasma enhanced chemistry. Expand layout in fields such as vapor deposition (PECVD) equipment.
In the field of semiconductor electroplating equipment, Shengmei Shanghai independently developed Ultra ECP map, an IC front-end copper interconnect copper plating technology targeting the 28nm technology node.
In terms of advanced packaging wet-process equipment, AMC Shanghai currently has the most complete range of advanced packaging wet-process equipment lines in the world, such as cleaning, wet etching, glue coating, development, degumming, electroplating and polishing equipment (such as electropolishing) ), etc. have been used in many large client production lines.
In the field of vertical furnace tube equipment, the products developed by Shengmei Shanghai mainly include low-pressure chemical vapor deposition furnaces, oxidation annealing furnaces, alloy furnaces and atomic layer deposition furnaces. It is understood that in 2023, Shengmei Shanghai will further develop plasma atomic layer deposition technology based on the Ultra Fn vertical furnace equipment platform, combined with the previously launched differentiated thermal atomic layer deposition furnace technology (Ultra FnA) with independent intellectual property rights. Deposition vertical furnace Ultra FnA. This ALD furnace tube technology provides better step coverage and shortens ALD cycle times to increase equipment output.
Shengmei Shanghai expects vertical furnace tube equipment to contribute significantly to revenue in 2024. In addition, ACM Shanghai is accelerating the verification of Track and PECVD equipment and the development of new customers. It is expected that Track equipment and PECVD equipment will begin to contribute revenue in large quantities by 2025.
In the field of front-end glue coating and development (Track) equipment, its front-end glue coating and development Ultra Lith TM Track equipment is an equipment used in the 300 mm high-output front-end integrated circuit manufacturing process. In the field of plasma enhanced chemical vapor deposition (PECVD) equipment, its Ultra Pmax TM PECVD equipment is equipped with differentiated cavity layout, gas distribution device and chuck design with independent intellectual property rights, which can provide better film uniformity and more optimized Film stress and less grainy properties.
