Tongfu Microelectronics raises 4.4 billion yuan to expand production.
Recently, Tongfu Microelectronics Co., Ltd. (stock code: 002156, hereinafter referred to as " Tongfu Microelectronics ") released a feasibility analysis report on the use of funds raised from the issuance of A-shares to specific targets in 2026. The company plans to raise no more than 4.4 billion yuan, focusing on capacity improvement in core areas such as memory chips, automotive electronics, wafer-level packaging, high-performance computing and communications.
Tongfu Microelectronics plans to invest 888 million yuan to build a capacity expansion project, which will add 849,600 wafers of memory chip packaging and testing capacity annually upon completion. Currently, the self-reliance and controllability of the semiconductor industry has risen to a national strategy, and multiple policy documents are promoting breakthroughs in core technologies in the integrated circuit field, creating a favorable environment for domestic substitution of memory chips. With the expansion of fields such as AI, smart terminals, and new energy vehicles, the market demand for high-bandwidth, high-capacity storage products is surging. The Chinese memory chip market reached 460 billion yuan in 2024 and is expected to exceed 550 billion yuan in 2025. Tongfu Microelectronics already possesses full coverage capabilities for mid-to-high-end FLASH and DRAM products in the memory packaging and testing field, and has core technologies in wafer thinning and high-stack packaging. This capacity expansion will further consolidate its industry advantages. The project is implemented by Tongfu Tongke (Nantong) Microelectronics Co., Ltd., with a construction period of 3 years. The investment project filing certificate has been obtained, and the environmental impact assessment is underway.
Tongfu Microelectronics plans to invest 888 million yuan to build a capacity expansion project, which will add 849,600 wafers of memory chip packaging and testing capacity annually upon completion. Currently, the self-reliance and controllability of the semiconductor industry has risen to a national strategy, and multiple policy documents are promoting breakthroughs in core technologies in the integrated circuit field, creating a favorable environment for domestic substitution of memory chips. With the expansion of fields such as AI, smart terminals, and new energy vehicles, the market demand for high-bandwidth, high-capacity storage products is surging. The Chinese memory chip market reached 460 billion yuan in 2024 and is expected to exceed 550 billion yuan in 2025. Tongfu Microelectronics already possesses full coverage capabilities for mid-to-high-end FLASH and DRAM products in the memory packaging and testing field, and has core technologies in wafer thinning and high-stack packaging. This capacity expansion will further consolidate its industry advantages. The project is implemented by Tongfu Tongke (Nantong) Microelectronics Co., Ltd., with a construction period of 3 years. The investment project filing certificate has been obtained, and the environmental impact assessment is underway.
