Chinese semiconductor thread II

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Online Measurement Method of Ion Beam Processing Removal Function Based on Convolution Effect Correction​


Recently, the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, published a research paper entitled "Investigating a corrective online measurement method for the tool influence function in millimeters spot-sized ion beam figuring" in *Light: Advanced Manufacturing *. The first author is Researcher Haixiang Hu, the second author is Master's student Meng Bian, and the corresponding authors are Haixiang Hu, Wa Tang, and Peng Ji. This research proposes a high-precision online measurement method for the removal function based on convolution effect correction, used for online, rapid, and accurate calculation of small beam diameter removal functions in ion beam processing. For removal functions with a half-width at half-maximum (FWHM) of 0.5 mm to 1 mm, the calculation accuracy can be controlled to around 3%. This technique has been successfully applied to the precision shaping of large-aperture aspherical surfaces, reducing the RMS surface shape error from 1.7 nm to 0.4 nm in the spatial wavelength range of 15 mm to 3.6 mm.

The ultra-high brightness and high coherence X-ray beams generated by next-generation synchrotron radiation sources and X-ray free-electron laser devices provide revolutionary tools for exploring the nanostructures and fundamental processes of matter. As a core optical component, the surface accuracy of the X-ray mirror directly determines the beam focusing performance and imaging quality. Correcting surface errors in the spatial wavelength range of 1 mm to 10 mm places extremely high demands on the characteristics of the processing tools. Ion beam processing technology, with its highly flexible removal function, demonstrates significant advantages in addressing this problem. When the beam diameter of the removal function is reduced to the millimeter or even sub-millimeter level, this portion of the surface error can be effectively eliminated.

Accurate measurement of the small-beam-diameter removal function is crucial in this process. Especially during long-term processing of large-aperture mirrors, not only is a precise removal function required, but also real-time monitoring, evaluation, and compensation for its stability are essential to ensuring processing precision. However, experimental measurement methods cannot achieve this: removal function data can only be obtained after processing, causing fluctuation compensation to be delayed until the next reshaping cycle. Furthermore, auxiliary processes such as vacuuming and testing further increase time costs. Therefore, achieving high-precision online measurement of the small-beam-diameter removal function is a core prerequisite for improving the accuracy and efficiency of ion beam processing.

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Lenovo: Long-term memory chip supply contract signed​

Lenovo announced that it had signed a long-term memory chip supply contract to ensure a stable chip supply should artificial intelligence demand drive up memory prices.

Lenovo Chairman and CEO Yang Yuanqing said after releasing the financial report: "We have signed optimal contracts with major component suppliers to ensure sufficient supply next year."

Global memory chip prices are rising as data center operators need to build artificial intelligence servers. Chipmakers such as Samsung Electronics have shifted production capacity to high-bandwidth memory (HBM) for AI chipsets, leading to tighter supplies of chips for less common applications such as smartphones, computers, and gaming devices.

Yang Yuanqing stated that adjusting prices is a natural way to cope with cost fluctuations. The shortage and price increase of components such as memory, flash memory, and solid-state drives will not be a short-term phenomenon and will remain so throughout the next year. However, Lenovo will have a better ability to cope with this situation than its competitors.

According to data from the London Stock Exchange Group (LSEG), Lenovo's total revenue for the July-September quarter rose 5% year-on-year to $20.5 billion, exceeding analysts' expectations of $20.3 billion. Lenovo's PC, tablet, and smartphone business lines contributed over 70% of total revenue in the second quarter, growing 11.8% year-on-year. Its Digital Infrastructure Group (including its AI server business) saw revenue growth of 24%, but recorded an operating loss of $118 million due to investments in expanding its AI capabilities.​
 
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Gowin Semiconductor showcases its full range of 22nm FPGA products at ICCAD 2025​


Gowin Semiconductor Technology Co., Ltd. (hereinafter referred to as "Gowin Semiconductor"), a leading FPGA chip supplier in China, attended the 2025 Integrated Circuit Development Forum (Chengdu-Chongqing) and the 31st Integrated Circuit Design Industry Exhibition (ICCAD 2025). During the exhibition, Gowin Semiconductor showcased its comprehensive 22nm full-series FPGA products and solutions.

At this exhibition, Gowin Semiconductor showcased its 22nm FPGA product family, covering logic densities from 15K to 138K. Internally, these products integrate high-bandwidth CPHY and DPHY hard cores, high-speed SerDes hard cores, PCIe 3.0 hard cores, and ADC modules for temperature and voltage monitoring. The products also boast abundant DSP and BRAM resources. With their diverse high-bandwidth interfaces and ample resources, Gowin's 22nm products are widely used in automotive electronics, video imaging, industrial control, communications, and consumer electronics.

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PopularScience said:
China uses groundbreaking desktop-sized EUV light source to make 14-nanometre chips

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Is not a chip company per se but a EUV light source manufacturer, they are making some sort of Free Electron Laser EUV light sources, basically excimer lasers to mercury lamps compared with current EUV light sources. Remain to be see how they integrated this to a lithography machine.
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Toujing Technology's second Shanghai plant has commenced production, positioned as a high-end, modern semiconductor industrial park.​


Tuojing Technology primarily engages in the research, development, production, sales, and technical services of semiconductor-specific equipment. Tuojing Technology main products include plasma-enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment, sub-atmospheric pressure chemical vapor deposition (SACVD) equipment, high-density plasma-enhanced chemical vapor deposition (HDPCVD) equipment, ultra-high aspect ratio trench filling (Flowable CVD) equipment, and three-dimensional integration (W2W/D2W hybrid bonding) equipment, as well as related metrology equipment. These products are mainly applied in high-end technology fields such as integrated circuit wafer manufacturing, advanced memory and advanced packaging, HBM, MEMS, Micro-LED, and Micro-OLED displays.

According to reports, Tuojing Technology, a leader in semiconductor thin-film deposition and 3D integration equipment, is pioneering new paths for industry development. Tuojing Technology's Shanghai Plant 2 is positioned as a high-end, modern semiconductor industrial park, with its engineering workshops achieving the highest domestic standard of Level 10 cleanliness, setting it apart from other industrial park projects. Upon completion, the project will become a crucial link in the integrated circuit industry chain of the Lingang New Area, providing solid hardware support for the clustered development of the regional integrated circuit industry and contributing to the creation of a complete semiconductor industry ecosystem.

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