AI is embarrassingly parallel and thus you can substitute a powerful AI chip with a large number of less powerful chips. But the main bottleneck for China is still the lack of EUV. Without EUV they will get further and further behind as US companies produce less than 1 nm chips while China is stuck at 7nm with very low yield 5nm production due to lack of EUV.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
hmm, that's not how things work.
I would really hope that this forum understand by now that AI vs EUV is a pointless argument and that Western investment banks probably aren't fully up to date on Chinese chip consumption.
Not necessary, is bit complicated than that, EUV is not a replacement for chip architecture and packaging scaling. but they are getting there.
Also there will probably not be below 1nm process, double patterning with EUV is already insane expensive, QP would be prohibitive with EUV, my guess is that chip manufacturing would go 3D integrated.
Ironically the first "1nm" chip was a 32bit RISC processor on Sapphire from Fudan Univ. Didn't even required EUV, Just pure ALD and ALE.
