If you have a solution that industrial policy needs the government will find a way to fund you.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
RISC-V AIoT SoC SpaceMIT K1 has reached 100k in sales. Sales seem to be picking up at faster pace. It's seen great adoption in the past 6 month.
I personally have not tried this myself, but if you want to try it out, looks like Sipeed has a board for it.
Breaking through 8N! The purity of SiC powder of this company breaks the industry record
Zhongyi Chuangxin announced that it has successfully broken through 8N in the purity of silicon carbide powder, and the purity of powder has been increased to 8N8 (99.9999998%), setting a new global industry record.
Zhongyi Chuangxin announced that it has successfully broken through 8N in the purity of silicon carbide powder, and the purity of powder has been increased to 8N8 (99.9999998%), setting a new global industry record.
That's a huge win. I have to imagine the decision was only finalized relatively recently as a small piece of the broader trade deal.
And then there's
This is excellent. Lawfare them into oblivion as payback for them effing with Chinese firms.
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Xinpengwei expects revenue of 630 million yuan in the first half of this year, and its net profit is expected to increase by about 104% year-on-year
Xinpengwei released its H1 performance forecast, saying that it expects to achieve operating income of about 630 million yuan in the first half of 2025, an increase of about 176 million yuan compared with the same period last year, a year-on-year increase of about 38%. It is expected that the net profit attributable to the parent company's owners in the first half of 2025 will be about 90 million yuan, an increase of about 46 million yuan compared with the same period last year, a year-on-year increase of about 104%.
It is also expected that the net profit attributable to the owners of the parent company after deducting non-recurring gains and losses in the first half of 2025 will be approximately RMB 70 million, which will increase by approximately RMB 24 million compared with the same period last year, a year-on-year increase of approximately 53%.
NAURA releases 12-inch advanced low-pressure chemical vapor silicon deposition vertical furnace equipment
Recently, NAURA officially released the SICRIUS PY302 series 12-inch low-pressure chemical vapor silicon deposition vertical furnace equipment. This equipment is aimed at amorphous silicon and polycrystalline silicon thin film deposition technology in the field of high-end logic chips and memory chips, and has successfully overcome the three major technical bottlenecks of high aspect ratio structure filling, high flatness film growth and compatibility with low-temperature processes, marking that NAURA continues to make key technological breakthroughs in the field of high-end semiconductor equipment.
Today, as 3D integrated chip manufacturing becomes mainstream, the increase in the number of stacked layers brings higher aspect ratio requirements, which makes vertical structure filling challenging. Traditional filling processes are prone to produce holes, which can lead to device failure. The SICRIUS PY302 series equipment achieves bottom-up defect-free filling and ensures high step coverage through its low-pressure reaction chamber technology and multi-zone independent high-precision temperature control system. This technological breakthrough provides a solid guarantee for the mass production needs of leading companies such as logic chips and memory chips.
In high-end chip gate manufacturing, achieving high flatness of thin films is a key challenge. The SICRIUS PY302 series equipment uses a fully independently designed all-quartz chamber and a high-precision temperature-controlled heater, combined with a gas flow field and thermal field collaborative control algorithm to control the film thickness uniformity and surface roughness at the atomic level, significantly improving the electrical stability of transistors. At the same time, the equipment integrates a variety of silicon source precursors and realizes advanced process functions such as in-situ cleaning, in-situ etching, and multi-element doping, thereby significantly reducing the defect rate of the device.
Shenzhen has introduced 10 measures to promote the high-quality development of the semiconductor and integrated circuit industries
Recently, the "Shenzhen Municipal Measures on Promoting the High-quality Development of the Semiconductor and Integrated Circuit Industry" (hereinafter referred to as the "Measures") was issued and implemented, and a "Sai Mi Industry Private Equity Fund" with a total scale of 5 billion yuan was established to support the optimization and quality improvement of the entire industrial chain with a combination of "policy + capital". It is understood that the "Measures" revolves around the core goal of "strengthening the chain, stabilizing the chain, and supplementing the chain", and proposes 10 specific support measures from the aspects of breakthroughs in high-end chip products, strengthening chip design tape-out support, accelerating the promotion and application of EDA tools, breakthroughs in core equipment and supporting components, breakthroughs in key manufacturing packaging materials, improving the level of high-end packaging testing, and accelerating the maturity of compound semiconductors.
The "Several Measures" proposes to give full play to the decisive role of the market in allocating resources and the market status of enterprises, guide the connection between upstream and downstream of the industrial chain through inclusive policies such as supporting R&D, special funding, and promotion and application, and promote the formation of a stable and efficient coordinated development mechanism. The "Several Measures" emphasizes that the advantages of the new national system should be brought into play in key core areas, government guidance should be strengthened, market vitality and social creativity should be continuously stimulated, investment in scientific and technological innovation should be increased, and the roles of government, market, and society should be organically combined.
In order to strengthen the financial guarantee, the Shenzhen Semiconductor and Integrated Circuit Industry Investment Fund "Sai Mi Industry Private Equity Fund" with a total scale of 5 billion yuan has completed the industrial and commercial registration in May. According to the relevant person in charge of the Shenzhen Development and Reform Commission, the fund will mainly invest in Shenzhen's semiconductor and integrated circuit key projects, leading enterprises in the sub-segments, and projects that play a major role in improving the industrial chain, and strive to build a localized industrial chain supply chain that is "independent, controllable, efficient, and closely matched."
Shenzhen is a major city in the development of China's integrated circuit industry, and has formed advantages in the entire integrated circuit industry chain. In the first half of 2025, the scale of Shenzhen's integrated circuit industry reached 142.4 billion yuan, a record high for the same period in history, an increase of 16.9% year-on-year.
Chief Scientist of Yangtze Memory: China's 3D flash memory chips have achieved leapfrog development
Recently, at the 2025 graduate graduation ceremony of Peking University the chief scientist of Yangtze Memory and Peking University alumnus, said that China's three-dimensional flash memory chip technology has achieved leapfrog development from scratch, from lagging behind to catching up.
According to information, Yangtze Memory Technologies Co., Ltd. was established in July 2016. It is a memory IDM company integrating chip design, manufacturing, packaging and testing, and system solution products. It mainly provides 3D NAND flash memory wafers and particles, embedded storage chips, and consumer-grade and enterprise-grade solid-state drives and other products and solutions to global partners. They are widely used in mobile communications, consumer digital products, computers, servers and data centers.
In 2014, Yangtze Memory's 3D NAND flash memory project was officially launched; in October 2017, Yangtze Memory successfully designed and manufactured China's first 3D NAND flash memory through a combination of independent research and development and international cooperation; in April 2020, Yangtze Memory announced the successful development of two third-generation TLC/QLC products, among which the X2-6070 model, as the first third-generation QLC flash memory, had the industry's highest I/O speed, the highest storage density and the highest single-chip capacity at the time of its release.
In addition, YMTC's current retail storage brand - Zhitai, whose products mainly include solid-state drives, mobile solid-state drives and memory cards, all use YMTC's original particles based on the innovative architecture of Jingzhan® Xtacking®.