Chinese semiconductor thread II

[tokenanalyst]

Haier doubles down on Mini/Micro LED technology​

According to Display Insider, Haier intensively promoted its Mini/Micro LED layout in June and July.In terms of Mini LED, Haier not only completed the launch of its Mini LED high-end product matrix in the Philippines, but also reached a strategic upgrade with Abenson, the largest local channel partner. The two parties will work together to accelerate the penetration of the high-end TV market.Data shows that Haier's business in the Philippines has been growing rapidly for eight consecutive years, with revenue up 21% year-on-year (TV category up 58%) in the first five months of 2025. The flagship True Color Pro series is equipped with micron-level Mini LED backlight, which achieves high contrast and brightness through zoned light control, and integrates 4K HDR and smart home compatibility, consolidating high-end competitiveness.


In terms of Micro LED, Qingdao Haier Multimedia and Chenxian Optoelectronics signed a strategic cooperation agreement in June, aiming to accelerate the large-scale application of TFT-based Micro LED technology in the display field. The core cooperation focuses on the exploration of high-end commercial displays and TV sets.

Based on Chenxian's TFT-based Micro LED core technology, the two parties will prioritize the high-end commercial display market and integrate diversified solutions including traditional LED to quickly enhance Haier's commercial display product strength and market coverage. In the next three years, they plan to launch a variety of customized products. Together, they will develop Micro LED TV sets, plan to create differentiated experiences in home theaters, professional displays, and ultra-high-definition audio and video scenes, and open up future TV growth space.To ensure the implementation of the strategy, the two parties have established a regular coordination mechanism, carried out in-depth cooperation around product planning, brand linkage and channel construction, and jointly promoted the process of technology commercialization.

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[tokenanalyst]

Xindong Micro: Building an independent ecosystem for domestic semiconductor electroplating equipment to help HBM technology reduce costs and increase efficiency.​

At the 2025 Jiwei Semiconductor Conference in Shanghai, Xindong Micro (Shanghai Xindongwei Semiconductor Technology) unveiled groundbreaking advancements in domestic semiconductor electroplating equipment, positioning itself as a pivotal player in reducing costs and accelerating efficiency for High-Bandwidth Memory (HBM) technology. By localizing critical processes and fostering an integrated ecosystem, the company has slashed HBM production costs by 50%, directly supporting China’s AI chip ambitions.

- Building a Domestic Ecosystem for Electroplating Technology

• End-to-End Localization: Xindong Micro’s "equipment + chemical solution" model eliminates reliance on foreign suppliers. This includes:
  • Fully Automatic ECD/ECP Series: Developed with 100% domestic intellectual property (IP), achieving parity with global leaders like Lam Research and Applied Materials.
  • Modular Design: Core components (e.g., plating chambers, fluid systems) are modular, enabling rapid reconfiguration for diverse applications (e.g., TSV filling, Cu pillar formation).
  • IP Protection: Over 100 patents cover electroplating devices, chemical formulations, and process controls, creating a technical moat.
• Collaborative R&D Model: Partnering with domestic material suppliers (e.g., Shanghai Xinyang) and end-users (e.g., SMIC, Huawei HiSilicon) to co-develop processes. This breaks the "black box" secrecy of foreign technologies and shortens R&D cycles from quarters to days.

- Technological Breakthroughs in Electroplating Equipment​

• GSW/G3 Series Maturity:
  • 300mm Wafer Compatibility: Supports R&D and mass production for advanced nodes (≤7nm), with sub-5μm uniformity and defect density <0.1/cm².
  • Process Flexibility: Semi-automated/fully automated recipes for Cu, Ni, Co, and alloy plating, tailored for HBM, RF devices, and SiC power modules.
• Next-Gen G4 Series: Under development, targeting sub-2μm linewidths and high-aspect-ratio TSV filling (aspect ratios >10:1) for HBM4 and beyond.
• Performance Metrics:
  • Metal thickness uniformity: ±2% across 300mm wafers.
  • Plating rate: Up to 5μm/min for Cu, matching international benchmarks.

- Cost Reduction for HBM Manufacturing​

• TSV Electroplating Challenges: In HBM stacks, TSVs (Through-Silicon Vias) enable vertical interconnects but account for ~30–40% of total manufacturing costs. Xindong Micro’s localized solution addresses this:
  • Domestic Chemicals: Reduces material costs by 50% (vs. imported alternatives like Enthone or MacDermid).
  • Localized Equipment: Cuts procurement costs by 50% (vs. Lam Research’s 3M+ tools). - **After-Sales Efficiency**: Saves 50% in maintenance and logistics (no tariffs, faster service). - **Total Savings**: Single-wafer cost drops from ¥643 (imported solution) to ¥325, enabling scalable HBM production for AI chips like Huawei’s Ascend or Biren’s BR100. Mitigates risks from U.S. export controls on advanced equipment, ensuring continuity for China’s 150B semiconductor market.

Leadership & R&D Strength​

• R&D Pipeline:
  • Advanced Processes: Focus on CoWP (Cobalt Wrap Plug) for back-end-of-line (BEOL) metallization and electroless Ni/Au for MEMS packaging.
  • Sustainability: Developing low-PG (propylene glycol) and water-recycling chemistries to meet China’s green manufacturing goals.

Industry Recognition & Future Outlook​

• Jiwei Semiconductor Exhibition: Xindong Micro’s InnovaSYS series attracted partnerships from ASE Group (packaging) and Luxshare Precision (EV chips).
• Awards: Honored at the Industrial Chain Breakthrough Ceremony for enabling domestic substitution in electroplating.
• Global Competitiveness: Xindong Micro’s localized HBM solution rivals Samsung’s HBM3E and SK Hynix’s HBM3 stacks, potentially reshaping the 2.5B HBM market.

1. Secured Supply Chains: Avoids U.S. sanctions on tools like Lam’s SABRE 3D.
2. Accelerated R&D: Enables rapid iteration for next-gen nodes (e.g., 3nm GAAFETs).

As global demand for HBM surges (CAGR 25% through 2030), Xindong Micro’s ecosystem model offers a replicable framework for China’s semiconductor industry to achieve technological sovereignty.

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[LanceD23]

Do you really think Chinese companies are designing chips that they cannot manufacture domestically? Of course not. Continued access to the EDA software serves as a catalyst for Chinese software companies to catch up and then take the lead. Just like Tesla, Apple, etc. did for the Chinese market.

I am talking from US perspective.

Huawei been designing using its own tool.
Catching up to EDA is easier than hardware because alot of the EDA tools are open sourced. China can just build on top of them.

 

[CMP]

I am talking from US perspective.

Huawei been designing using its own tool.
Catching up to EDA is easier than hardware because alot of the EDA tools are open sourced. China can just build on top of them.

From the US perspective, it's literally as simple as whether to leave money on the table or not. As a general rule in business, you never leave money on the table unless a politician/laws gets in your way such that you have no choice. And even then, you see how often rogue actors in the private sector find ways around it. I.e., a seemingly legitimate domestic/allied nation business entity becomes the customer on paper but ends up being just the first stop for the product in question.

 

[Michael90]

Yeah, well, you cannot underestimate the stupidity of the Trump administration or the USs inflated ego.
Not too unlike some other nations who used to think they were protected by God himself.

It’s a by partisan US policy accepted by both democrats and republicans and even large part of US public dude. For you to think it’s just a Trump thing is wrong. China has been publicly designated as the US main threat/enemy/rival this century and it will remain that way unless China collapses or stop growing, give in to US demands, give up moving up the value chain etc. That’s the only way you can avoid confrontation and hostilities. So expect such measures to continue and get even more worse not better. It’s realpolitik nothing personal against China particularly. Even if India were to grow to chinas level then they too will be treated the same way , no doubt about that.
remember when the Soviet Union was the US number 1 enemy and rival and the US even allied with China against the soviets? That’s how politics works, it’s all about interests. Since 2 tigers can’t share the same mountain, one will eventually need to give way.

 

[supersnoop]

Haier doubles down on Mini/Micro LED technology​

According to Display Insider, Haier intensively promoted its Mini/Micro LED layout in June and July.In terms of Mini LED, Haier not only completed the launch of its Mini LED high-end product matrix in the Philippines, but also reached a strategic upgrade with Abenson, the largest local channel partner. The two parties will work together to accelerate the penetration of the high-end TV market.Data shows that Haier's business in the Philippines has been growing rapidly for eight consecutive years, with revenue up 21% year-on-year (TV category up 58%) in the first five months of 2025. The flagship True Color Pro series is equipped with micron-level Mini LED backlight, which achieves high contrast and brightness through zoned light control, and integrates 4K HDR and smart home compatibility, consolidating high-end competitiveness.
View attachment 155519

In terms of Micro LED, Qingdao Haier Multimedia and Chenxian Optoelectronics signed a strategic cooperation agreement in June, aiming to accelerate the large-scale application of TFT-based Micro LED technology in the display field. The core cooperation focuses on the exploration of high-end commercial displays and TV sets.

Based on Chenxian's TFT-based Micro LED core technology, the two parties will prioritize the high-end commercial display market and integrate diversified solutions including traditional LED to quickly enhance Haier's commercial display product strength and market coverage. In the next three years, they plan to launch a variety of customized products. Together, they will develop Micro LED TV sets, plan to create differentiated experiences in home theaters, professional displays, and ultra-high-definition audio and video scenes, and open up future TV growth space.To ensure the implementation of the strategy, the two parties have established a regular coordination mechanism, carried out in-depth cooperation around product planning, brand linkage and channel construction, and jointly promoted the process of technology commercialization.

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Is Chenxian (Visionox) also the supplier for Hisense? They claimed "breakthrough" affordability, which was 100K+ USD instead of 150K+ for Samsung...

I suppose you can spin that as 33% less... you can buy a nice car with those savings!

On the more serious side, if there are more companies getting into micro LED, then perhaps true commercialization is close.

 

[tokenanalyst]

Ruichuang Microelectronics brought the world's first SWLP infrared detector and other products to Wuhan Optical Expo.​

The 2025 Wuhan Optical Expo (the 20th "China Optics Valley" International Optoelectronics Expo) opened on May 15 at the China Optics Valley Science and Technology Exhibition Center . Ruichuang Microelectronics brought multiple . At the opening ceremony of the first launch and first exhibition of representative innovative achievements , the world's first SWLP infrared detector OHLE3123 was released, and a keynote speech on "SWLP Technical Characteristics and Future Product Applications" was delivered at the third special release conference of optoelectronic frontier technology and industrial achievements .

First launch and exhibition activities
The "First Launch and First Exhibition" event of Wuhan Optical Expo released ten cutting-edge products, and the OHLE3123 infrared detector was selected. OHLE3123 is a long-wave infrared detector based on vanadium oxide (VOx) microbolometer technology, using SWLP (super wafer level packaging) technology . The array is 384x288, the pixel pitch is 12μm, the NETD<40mK, the power consumption is <65mW, the response band is 8-14μm, and the product weight is <0.6g. It has the characteristics of ultra-small size, ultra-light weight, high-quality imaging, and easy integration. OHLE3123 is suitable for a variety of application scenarios, such as outdoor night vision, industrial temperature measurement, security monitoring, and civilian industry drones.


About SWLP technology topic sharing
In the keynote speech, we elaborated on the technical features and future product applications of SWLP in detail. The speech introduced the technical features of SWLP from the current status of packaging technology and the pain points of product applications: full-scene coverage, efficient integration efficiency, lightweight design and multi-field application. SWLP technology greatly reduces the industry entry threshold, allowing more companies to independently develop and manufacture movement modules, and promote the popularization of cutting-edge infrared technology in a wider range. Currently, the first product OHLE3123 using SWLP technology has been mass-produced.

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[tokenanalyst]

Total investment of 2 billion! Luwei Optoelectronics' high-generation and high-precision photomask project laid the foundation stone​

On July 5, 2025, the groundbreaking ceremony of the high-generation and high-precision photomask project of Xiamen Luwei Optoelectronics Co., Ltd. was grandly held in Xiang'an District, Xiamen. The project is invested and constructed by Shenzhen Luwei Optoelectronics Co., Ltd., with a total construction area of 53,740 square meters. The total investment is planned to be 2 billion yuan to build a high-end photomask production line, focusing on the research and development of high-precision photomasks for AMOLED/LTPO/LTPS of G8.6 and below. The start of construction of this strategic project marks a milestone in China's "neck-stuck" key material field of high-end photomasks, injecting strong momentum into the independent and controllable new display industry chain.

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[LanceD23]

Running into a wall??
TSMC hesitant to use ASML High NA high cost of $380 million each.
Samsung couldnt find customers for texas fab.

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The explosion of Nvidia AI and ChatGPT is based on the onset of 5nm. Big improvement from 7nm to 5nm.

But from 5nm to 3nm the improvement is not as good.

Seems like 5nm is a must have and anything after is marginal and maybe not needed due to cost.

 

[interestedseal]

长期致力于极紫外光刻技术及相关装备的研发。2015年至今，先后承担国家级、省市级和企业项目十余项，科研到款三千余万元，发表学术论文10余篇，获得授权专利7件。2023年，成功研发了国内首台面向高端芯片研制系统的大型超高真空多靶磁控溅射镀膜系统，研发设备镀制的光学薄膜的各项技术指标超过了德国顶尖镀膜系统厂商研制的设备，达到了国际先进水平，实现了近2500万元进口设备的国产化替代，并已初步实现量产。研发设备成功交付给我国半导体产业的龙头企业，有力地促进了我国半导体产业在高端芯片研发方面的发展。

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UHV magnetron sputtering coater commercialized, which is on par with Leybold Nessy coater for EUV Mo/Si multiplayer film.
Btw CUST is not highly ranked (outside of top 100 in China), so pretty amazing a professor there could get this much funding

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