It is all based on the Nikkei article about SMIC increasing 7nm production at SMSC. Look, I posted the satellite pictures of the fab here (post #445), SMSC basically doubled their floorspace recently. The fab has been under US sanctions for quite some time already and isn't supposed to be getting advanced tools from the West. Yet they doubled the floorspace. It must be for something.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Recently there was a push to add more statistics and mathematical analysis to social science to make it more fair and unbiased.
This did not happen.
Instead statistics and math modeling got more subjective and biased.
At the end of the day it probably doesn’t matter too much because China’s semiconductor strategy is that of an open stratagem. If it could be inconvenienced or stopped by a few leaks then it isn’t sustainable anyway.
That was nice of DigiTimes to quote me
Let's keep the thread on topic guys, no use to keep wasting pages talking about these stooges.
JCET Accelerates Construction of Automotive Chip Advanced Packaging Flagship Factory
JCET Group has recently confirmed that, following the approval of the capital increase for its subsidiary, JCET Automotive Electronics (Shanghai) Co., Ltd., the first round of RMB 1.551 billion was received on February 22nd. This supports the construction of JCET’s first intelligent and lean lighthouse factory for automotive chip advanced packaging.
The automotive industry demands increasingly sophisticated chip solutions. Dedicated production lines and zero-defect standards are quickly becoming essential prerequisites for achieving industry excellence. In response to evolving market dynamics and customer expectations, JCET is orchestrating unified planning and operations within its automotive electronics business, delivering comprehensive solutions across various applications in the sector. To better cater to the needs of its global clientele, the JCET Automotive Chip Back-end Manufacturing Base was initiated in August 2023 in Lingang, Shanghai. Momentum has accelerated since then, and the infrastructure is now poised for comprehensive construction. Equipment entry is expected in the first half of 2025.
Leveraging JCET’s rich R&D capabilities and resources, the project also includes a pilot line dedicated to automotive chip manufacturing in China. It focuses on fully automated assembly and packaging solutions for processor chips used in future automotive core components, along with complete packaging solutions for power modules of new energy vehicle core components. Through innovative solutions, the pilot line lays a solid foundation for the project to become a flagship factory.
Simultaneously, JCET is meeting diverse customer demands by developing highly cost-competitive, environmentally friendly, and premium metal frames that comply with the stringent regulations for high-quality vehicles. The company has also implemented a fully traceable solution spanning the entire product process. The aforementioned pilot line has already obtained multiple national patents. In 2024, it is slated to complete the implementation and verification of existing innovations, continue collaboration with industry chain partners, and explore new materials and process solutions.
The JCET Automotive Chip Back-end Manufacturing Base will serve major domestic and international customers. The project is garnering significant interest from key players, including OEMs, Tier 1 suppliers and IC suppliers. Strategic cooperation agreements have already been secured with several prominent partners.
The automotive industry demands increasingly sophisticated chip solutions. Dedicated production lines and zero-defect standards are quickly becoming essential prerequisites for achieving industry excellence. In response to evolving market dynamics and customer expectations, JCET is orchestrating unified planning and operations within its automotive electronics business, delivering comprehensive solutions across various applications in the sector. To better cater to the needs of its global clientele, the JCET Automotive Chip Back-end Manufacturing Base was initiated in August 2023 in Lingang, Shanghai. Momentum has accelerated since then, and the infrastructure is now poised for comprehensive construction. Equipment entry is expected in the first half of 2025.
Leveraging JCET’s rich R&D capabilities and resources, the project also includes a pilot line dedicated to automotive chip manufacturing in China. It focuses on fully automated assembly and packaging solutions for processor chips used in future automotive core components, along with complete packaging solutions for power modules of new energy vehicle core components. Through innovative solutions, the pilot line lays a solid foundation for the project to become a flagship factory.
Simultaneously, JCET is meeting diverse customer demands by developing highly cost-competitive, environmentally friendly, and premium metal frames that comply with the stringent regulations for high-quality vehicles. The company has also implemented a fully traceable solution spanning the entire product process. The aforementioned pilot line has already obtained multiple national patents. In 2024, it is slated to complete the implementation and verification of existing innovations, continue collaboration with industry chain partners, and explore new materials and process solutions.
The JCET Automotive Chip Back-end Manufacturing Base will serve major domestic and international customers. The project is garnering significant interest from key players, including OEMs, Tier 1 suppliers and IC suppliers. Strategic cooperation agreements have already been secured with several prominent partners.
Seems to me that those Chinese people inside China do not understand something here.
This is a fight.
This is still a fight, and in a fight, you have to try to kick their teeth in.
That is how China went wrong in the past.
Not today.
You kick their teeth in.
Preventing oxide precipitation in selective wet etching of Si3N4 for 3D-NAND structure fabrication: The role of bubbles.
Abstract
Selective wet etching of Si3N4 is a critical process in the fabrication of 3D-NAND structures; however, it faces a oxide precipitation problem that significantly deteriorates the remaining structure morphology. A recent study by Kim et al.(Kim et al., 2022 [1]) showed that generating CO2 bubbles during the wet etching process efficiently solves the precipitation problem in the fabrication of a 128 multi-layer 3D-NAND structure. In this study, we numerically investigated the multiscale diffusive transport of oxides in the etching process via three different simplified simulations at different scales to reveal the underlying mechanism. We found that mass transport within the multilayer structures alone cannot contribute to the oxide precipitation behavior. Macroscopic transport from the wafer-etchant interface to the bulk must be considered since it contributes to a high oxide concentration at the wafer-etchant surface, which further increases the concentration within the trenches, leading to the precipitation problem. Through the conjecture oxide transport simulation, we found that the large bubbles generated from the reaction agitate the surrounding liquid and dramatically reduce the oxide concentration at the wafer-etchant surface by one order of magnitude, thereby solving the precipitation problem. Our findings clearly explain the experimental results reported by Kim et al. and will further benefit the development of process-intensification technologies in wet etching.
Dinglong Co., Ltd.: Currently, it has developed 13 high-end wafer photoresist products, and 5 photoresist products have been sent to clients for sample delivery.
Dinglong's recent investor relations activity record shows that the company's layout has a relatively low localization rate and high technical difficulty. At the same time, KrF/ArF photoresist products account for a large proportion of the wafer photoresist market. Currently, it has developed There are 13 high-end wafer photoresist products, and 5 photoresist products have been sent to customers for sampling, and the market feedback is positive.
The company's layout of wafer photoresist business has the following advantages: 1. At the upstream supply chain end, the company has profound accumulation of organic synthesis and polymer synthesis technologies, special functional monomers, resins, and photoacid generation for KrF/ArF photoresists. Agents, etc. have been domestically produced or prepared independently; 2. In terms of formula development, the company has mature development experience in photoresist PSPI for OLED display and packaging photoresist, which helps the company develop and deliver products in a relatively short period of time. Sample verification; 3. In terms of industrialization construction, the company has rich experience in the industrialization of semiconductor materials and has simultaneously carried out industrialization layout. It has reserved multiple key photoresist mass production equipment in advance, and the construction of large-scale production lines is rapidly advancing. It is expected that in 2024 It will be completed in the fourth quarter of the year; 4. In terms of downstream customers, the company has a deep understanding of the underlying logic of stable supply at the customer end, and has established a good customer relationship with downstream customers—domestic mainstream wafer fabs, which provides support for the development and verification of the company's new products. and provide strong support for future mass production introduction.
With a total investment of 1.1 billion yuan, Tuojing Technology plans to invest in the construction of a "high-end semiconductor equipment industrialization base construction project"
Tuojing Technology (PIOTECH) announced its investment in the construction of a "high-end semiconductor equipment industrialization base construction project" and changed the use of part of the raised funds to invest in the project.
Specifically, the company's board of directors agreed to invest in the construction of a "high-end semiconductor equipment industrialization base construction project." The project is implemented by the company and its wholly-owned subsidiary Tuojing Chuangyi. The total investment in the project is approximately 1.1 billion yuan, of which the company's investment amount is approximately is 380 million yuan, and Tuojing Chuangyi’s investment amount is approximately 720 million yuan. The company plans to reduce the total investment commitment of the first-time investment project "Advanced Semiconductor Equipment Technology Research and Development and Improvement Project" by 200 million yuan, and at the same time reduce the funds raised from the over-raised investment project "Semiconductor Advanced Process Equipment Research and Development and Industrialization Project" A total investment of 50 million yuan has been committed, and a total of 250 million yuan of the above-mentioned reduced raised funds will be invested in the "high-end semiconductor equipment industrialization base construction project". The remaining project funds of 850 million yuan will be raised by the company and Tuojing Chuangyi themselves.
According to disclosures, the construction period of the project is expected to be 4 years. Talking about necessity, Tuojing Technology believes that the project will support the future industrialization needs of the company's PECVD, SACVD, HDPCVD and other high-end semiconductor equipment products by building a high-end semiconductor equipment industrialization base, thereby meeting the expansion needs of integrated circuit manufacturing production lines. It is conducive to promoting the development of integrated circuit equipment technology and is of great significance to the implementation of the national development strategic plan. In addition, this project will provide supporting conditions for the mass production of existing research and development results, new processes and new products, which will help enhance the company's core competitiveness and consolidate the company's leading position in the industry.