The world's first, independently developed! The new generation of C2W&W2W hybrid bonding equipment is about to be released!.
The world's first C2W&W2W dual-mode hybrid bonding equipment independently developed by Qinghe Wafer Group - SAB 82CWW series is about to debut! This is a technological revolution that subverts tradition, a dual evolution of "continuing Moore's Law" and "going beyond Moore's Law"!
As semiconductor manufacturing processes approach the physical limit of 1nm, the continuation of Moore's Law faces huge challenges. The industry urgently needs to find new breakthroughs through the two paths of "More Moore" and "More than Moore". Whether it is 3D stacking technology to improve integration density or heterogeneous chip integration to expand functional boundaries, hybrid bonding technology has become an irreplaceable core technology. However, the traditional technology route has long faced the difficult choice between W2W (wafer to wafer) and C2W (chip to wafer): W2W pursues extreme efficiency but has high yield risk, while C2W is flexible and innovative but has low mass production efficiency.
On March 11, witness a new milestone in semiconductor bonding technology!
The SAB 82CWW series will break the technical boundaries between W2W and C2W and usher in a new era of "dual-mode parallelism"! This device not only solves the "choose one of two" dilemma that the industry has long faced, but also injects powerful momentum into AI chips, HBM storage, Micro-LED display, 3D NAND and other fields with ultra-high precision, intelligent technology and efficient production capacity, empowering future technological development!
As semiconductor manufacturing processes approach the physical limit of 1nm, the continuation of Moore's Law faces huge challenges. The industry urgently needs to find new breakthroughs through the two paths of "More Moore" and "More than Moore". Whether it is 3D stacking technology to improve integration density or heterogeneous chip integration to expand functional boundaries, hybrid bonding technology has become an irreplaceable core technology. However, the traditional technology route has long faced the difficult choice between W2W (wafer to wafer) and C2W (chip to wafer): W2W pursues extreme efficiency but has high yield risk, while C2W is flexible and innovative but has low mass production efficiency.
On March 11, witness a new milestone in semiconductor bonding technology!
The SAB 82CWW series will break the technical boundaries between W2W and C2W and usher in a new era of "dual-mode parallelism"! This device not only solves the "choose one of two" dilemma that the industry has long faced, but also injects powerful momentum into AI chips, HBM storage, Micro-LED display, 3D NAND and other fields with ultra-high precision, intelligent technology and efficient production capacity, empowering future technological development!
