Chinese semiconductor thread II
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Semiconductor laser chip manufacturer Huachen Xingguang completed RMB 200 million A++ round of financing
Zhejiang Huachen Xingguang Technology Co., Ltd. announced the successful completion of nearly 200 million yuan in A++ round of financing. This round of financing will be mainly used for the research and development of new products and market expansion, and further promote the company's technological innovation and business expansion in the field of semiconductor lasers.
Founded in September 2021, Huachen Xingguang is a high-tech enterprise focusing on the research and development and manufacturing of semiconductor laser products. The company adopts the IDM (integrated device manufacturing) model to provide comprehensive semiconductor laser product solutions for high-power lasers, optical communication lasers, and 3D sensing. At present, Huachen Xingguang has a wholly-owned subsidiary for optical chip FAB manufacturing in Wuxi City, Jiangsu Province, and an optical chip packaging and testing subsidiary in Quzhou City, Zhejiang Province, forming a complete industrial chain from research and development to production.
Zhejiang Huachen Xingguang Technology Co., Ltd. announced the successful completion of nearly 200 million yuan in A++ round of financing. This round of financing will be mainly used for the research and development of new products and market expansion, and further promote the company's technological innovation and business expansion in the field of semiconductor lasers.
Founded in September 2021, Huachen Xingguang is a high-tech enterprise focusing on the research and development and manufacturing of semiconductor laser products. The company adopts the IDM (integrated device manufacturing) model to provide comprehensive semiconductor laser product solutions for high-power lasers, optical communication lasers, and 3D sensing. At present, Huachen Xingguang has a wholly-owned subsidiary for optical chip FAB manufacturing in Wuxi City, Jiangsu Province, and an optical chip packaging and testing subsidiary in Quzhou City, Zhejiang Province, forming a complete industrial chain from research and development to production.
The groundbreaking ceremony of Xinyuan Micro's high-end wafer processing equipment industrialization innovation road project was grandly held
The groundbreaking ceremony for the Xinyuanwei high-end wafer processing equipment industrialization innovation road project were held at the Xinyuanwei Innovation Road plot. Lv Zhicheng, deputy secretary of the Shenyang Municipal Party Committee and mayor, Yan Zhanfeng, secretary of the Hunnan District Party Committee, Ren Lihui, district mayor, shareholder guests, representatives of cooperative units, company leaders and employee representatives witnessed the new starting point of Xinyuanwei's rapid development at the scene.
This has been circulating around today. Not sure is real or not. It says “China’s domestically developed EUV machine, utilizing laser-induced discharge plasma (LDP) technology—distinct from the LPP approach employed by ASML—is currently undergoing testing at Huawei’s Dongguan facility. Trial production is slated for Q3 2025.”
This has already been posted, and it's not an EUV lithography machine or part of one, but an interferometer for calibrating EUV optics. AKA it's part of the tooling for manufacturing EUV machines and a good indicator that China is at very least close to a finished product, but it's not the product itself