Chinese semiconductor thread II

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tokenanalyst

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Anfu Technology is establishing a joint venture with Hangzhou Huashengmai and core management teams to specifically target the R&D, verification, and industrialization of core components for semiconductor lithography light sources. This initiative directly addresses a critical "chokepoint" in domestic chip manufacturing: lithography light sources act as the "heart" of lithography machines but have long been monopolized by overseas suppliers such as ASML. By localizing these components, the venture aims to break foreign technical and after-sales restrictions, secure supply chain resilience for Chinese wafer fabs, and provide foundational support for fully domestic DUV lithography systems targeting 28nm and mature process nodes.

Technically, deep ultraviolet (DUV) lithography light sources rely on ArF or KrF excimer laser technology to generate 193-nanometer or 248-nanometer wavelengths for precise circuit patterning on silicon wafers. These highly complex systems integrate advanced optics, high-voltage power supplies, precision mechanics, and specialized gas management, demanding exceptional operational stability and reliability. Due to their intensive use in semiconductor fabrication, over 70% of the internal components require replacement or professional maintenance every six to twelve months; without this rigorous upkeep, entire lithography machines cannot sustain normal operation.

This consumable nature creates a highly lucrative and resilient commercial landscape. China currently operates approximately 1,500 existing DUV lithography machines, generating an estimated ¥10–20 billion annually just in the spare parts and maintenance replacement cycle. When combined with steady domestic machine installations, the incremental market adds another ¥3–5 billion per year. To capture this demand, the joint venture will build four integrated R&D and manufacturing centers covering precision machining, optical integration, electronic control systems, and special ceramics, starting with precision machining in its first phase. This dual-market approach (existing equipment upkeep plus new installations) offers strong anti-cyclical viability and high margins, positioning the venture to play a pivotal role in China’s semiconductor self-reliance push while driving commercial scalability for Anfu Technology’s optoelectronics expansion.
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I didn't find too much information about this company so take this with a grain of salt. Looks like that there is another DUV Lithography light source company in the supply chain, for now the most well known company is Beijing RSLaser Opto-Electronics, the company has accumulated enough pedigree to be one the few companies in the world to build this kind of lithography light source subsystems, the 3rd company in the world to be exact. You know you are dealing with a decent company when you can get research papers and university collaborations.

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The issue is that no one knows if China lithography current supply chain would be like ASML, exclusive to one frontend lithography company or would be a open ecosystem. You have the first companies of the project 02 like Gouwang Optical from CIOMP, RSLaser, U-Precision and others.

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Outside that group some entrants maybe MLOptic, this company for light sources, many of the nanopositioning companies and others that can jump to make wafer stages. That open the doors to some I-line lithography steppers companies that I posted here. It also helps China in maintaining their current fleet of ASML machines if the Match ACT is passed and signed.
 
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tokenanalyst

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Shengmei Shanghai reported operating revenue of RMB 1.476 billion, a year-on-year increase of 13.06%.​

Shengmei Shanghai's core new product, the high-temperature single-piece SPM, is entering a volume-driven growth phase. Wang Jian stated that the new generation of cleaning products is still in the stage of gradual revenue release, but this temporary fluctuation does not affect the company's confidence in the long-term development of the cleaning business. He revealed that the company's high-temperature single-piece SPM product line is gradually entering a volume-driven growth phase. It is expected that by the end of this year, a total of 15 to 20 units will be delivered to multiple clients.

It is reported that Shengmei's independently developed high-temperature monolithic SPM solution exhibits excellent particle control performance. At 15 nanometers. Under the particle standard, a control level of less than 15 particles can be achieved. "Many customers worldwide have shown strong interest in the company's SPM products. This product line is expected to continue to expand its market share in the coming years," Wang Jian said.

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Electroplating furnace tubes and other upstream equipment were ACM Shanghai's fastest-growing business segment this quarter, primarily driven by continued breakthroughs in the electroplating business. In the fourth quarter of 2025, the company delivered the world's first panel-level horizontal electroplating equipment supporting 515×510 mm panel sizes to its customers and continued to advance customer cooperation and order backlog.

Wang Jian stated that the company has currently deployed two mainstream panel size platforms, 515×510 mm and 310×310 mm, to meet the technical needs of different customers. The company anticipates that with the smooth progress of client verification for the 515×510 mm panel size equipment, the equipment is expected to gradually enter the mass production order stage. Meanwhile, the 310×310 mm panel size equipment will also continue to advance more client verification work this year.

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Regarding vertical furnace tubes, the company's related equipment is currently undergoing validation at multiple customers, covering key application areas such as LPCVD, oxidation furnaces, thermal ALD, PEALD, and ultra-high temperature annealing. The company expects the furnace tube business to gradually increase its revenue contribution in subsequent quarters of 2026.

ACM Research Shanghai delivered its first PECVD silicon carbonitride equipment to a leading semiconductor manufacturer. This equipment has completed process specification verification at ACM Research Shanghai's Lingang laboratory and has now been shipped to the client for final verification. Regarding Track, in September 2025, the company delivered a high-capacity KrF process Track equipment to a major customer. This equipment has a capacity exceeding 300 wafers per hour and is expected to enter the mass production verification stage in 2026.
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tokenanalyst

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breakthrough in domestically produced 8-inch silicon carbide devices​


The third-generation semiconductor leapfrog research team at the Shenzhen Pinghu Laboratory announced that, relying on its independently built 8-inch silicon carbide pilot platform, it has successfully developed a 750V trench-type SiC JFET device, achieving breakthroughs in key processes and device performance. The relevant technical indicators have reached the international advanced level , and the team has overcome key process problems that have long restricted product consistency and large-scale manufacturing, providing new technical support for the independent development of high-end silicon carbide power devices in China.

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It is understood that this research and development achievement was entirely based on the 8-inch SiC pilot platform independently built by the Pinghu Laboratory, making it one of the few domestic achievements to independently develop a complete 8-inch trench SiC JFET process. The device has a breakdown voltage exceeding 920V, meeting the requirements of 750V high-voltage DC applications; its specific on-resistance is as low as 0.75mΩ·cm², demonstrating significant advantages in reducing conduction losses and increasing system power density.

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tokenanalyst

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Jingsheng Mechanical & Electrical: Relying on its self-developed MPCVD equipment and processes, it has achieved stable preparation of high-quality diamond materials.​


Jingsheng Mechanical & Electrical stated on its interactive platform that the company has long focused on technological innovation in semiconductor material growth and processing. Diamond crystal, also known as diamond, is hailed as the "ultimate semiconductor" material due to its ultra-wide bandgap, high carrier mobility, high breakdown electric field, high thermal conductivity, and excellent chemical stability and mechanical properties. It can operate efficiently under extreme conditions and solve many bottleneck problems faced by traditional semiconductor materials. Relying on its self-developed MPCVD equipment and processes, the company has achieved stable preparation of high-quality diamond materials and focuses on developing diamond heat sinks for chip heat dissipation and window materials for optical systems. Simultaneously, it has built a large-size diamond production line, continuously driving industrial innovation and promoting the development of the company's new materials business. In the future, the company will continue to explore technologies and develop products, actively promoting solutions for diamond materials in a wider range of extreme environments to support the development of cutting-edge technology industries.

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gotodistance

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CXMT Could Match Micron's Memory Manufacturing Capacity as Early as 2026


China셲 ChangXin Memory Technologies (CXMT) is rapidly expanding its production capacity, much like other memory manufacturers. However, the growth rate of this Chinese company is so steep that it could reach a production capacity on par with Micron봮ne of the three titans of the memory industry봞s early as this year (2026).


These projections come from a report published by Citrini Research, which highlights the growth prospects of the Chinese market. If these predictions hold true, China could become the world's second-largest producer of DRAM modules.


According to the report, based on CXMT's current plans, the manufacturer is expected to reach a monthly production capacity of approximately 350,000 wafer starts per month (WSPM) by the end of 2026. This figure is remarkably close to the 375,000 WSPM that Micron is projected to produce over the same period.


Looking ahead to the next few years, CXMT셲 production capacity is projected to grow exponentially, potentially reaching up to 950,000 WSPM by 2030. Achieving this milestone would significantly narrow the gap between CXMT and industry leaders like Samsung Electronics and SK Hynix, bringing China's total DRAM production capacity to 1.41 million WSPM.
Chinesespace program


뱢 DRAM Production Capacity Outlook (in Thousands of WSPM)


(Projections for 2026, 20272029, and 2030)


  • CXMT: 350 ➡ 950
  • JHICC: 60 ➡ 120
  • Micron: 375 ➡ (Future Outlook)
  • Samsung: 720 ➡1,140 ~ 1,450
  • SK hynix: 590 ➡ 1,180
  • Swaysure: ➡140
  • XMC (YMTC Subsidiary): 50 ➡ 50 ➡ 200

쩃 How CXMT's Growth Impact Other Chinese Memory Manufacturers


According to the Citrini Research report, the Chinese government is reportedly pressuring CXMT to share its memory manufacturing technology with other domestic semiconductor firms.


Consequently, companies like JHICC (Fujian Jinhua), Swaysure, and XMC (a subsidiary of YMTC) stand to benefit. The report notes that these companies either already possess DRAM production capabilities or are expected to acquire them in the near future.


Unsurprisingly, Chinese authorities aim to ease domestic component shortages, a situation that continues to impact various industries... (The rest of the text is omitted)



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