Chinese semiconductor thread II

tphuang

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China's first 5nm full-featured space computing chip released.​


Ningbo-based Gravity Electronics Technology Co., Ltd. officially released China's first full-featured MR (Morphological) computing chip, the "G-X100," at the 2025 Space Computing Industry Conference . Simultaneously, they launched "Extreme Domain," a full-stack space computing solution for ecosystem partners . Wang Shuang, co-founder and CMO of the company, stated that this is China's first 5nm full-featured space computing chip , making Gravity the world's only provider of a full-stack space computing solution .

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What is exactly the point of this chip? They have chips that can do 200 TOPS. And you can't even fab this domestically.
 

tokenanalyst

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Scalable and reproducible sub-5 nm manufacturing for next-generation devices.​

Abstract​

The capability to consistently manufacture structures with sub-5 nm features has greatly accelerated scientific advancements in nanoscience and nanotechnology. However, most current methods are serial processes that are time-consuming and impractical for large-scale manufacturing at sub-5 nm level. The challenge of achieving scalable and reproducible production of sub-5 nm structures poses a significant hurdle for both foundational research and commercial implementations. In this review, we explore some representative sub-5 nm fabrication strategies, focusing on approaches that facilitate scalable and reproducible manufacturing. We highlight the most promising techniques such as extreme ultraviolet lithography, electron beam lithography, directed self-assembly and atomic layer lithography that hold potential breakthroughs in both research and industry, based on criteria such as resolution, scalability, reproducibility and their applicability in optical fields such as surface-enhanced spectroscopies, terahertz science, and nonlinear optics, as well as in electronic fields such as quantum devices, molecular devices and memory devices. The evolution of scalable and reproducible sub-5 nm manufacturing methods will ultimately revolutionize next-generation devices, encompassing quantum technologies, neuromorphic computing chips, and the mass production of integrated circuits.

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swcc

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The data he got this from was from one of the video testing one of the showcase device in a huawei offline store, it's also the one where the steel nomad light score 950 come from, taking scores from a device that's essentially under stress(On nonstop, bad heat dissipation(device stand), people benchmarking it nonstop) make the score suffers, also the one where he get the cpu scores(1780, 5321) are outdated(there's (1824, 5701), (1721, 5802)), if we take the 1824 5701 and apply 15% performance loss for single core and 25% for multi core(both of these(15 and 25) are relatively conservative, the one i shared before says performance loss 35% for multi core) we get ~2097 and ~7126(the one in his graphics was 6500-6700 multi core and 1780 single core(doesn't even give any compensation for the performance loss btw, it;s also 1780 in his pre conversion graphic) then single core is slightly better(~2%) than 8 gen 2, multi core is 3% behind 8 gen 3, if you take performance loss 35% for multi core it becomes ~7696(~4% more than 8 gen 3)
 
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