Chinese semiconductor thread II

[tokenanalyst]

With a total investment of 2.5 billion yuan, the Yipas New Materials project was signed and landed in Heshan.​

the AI high-speed copper clad laminate and packaging substrate project of Yipas New Materials was officially signed and launched in Heshan City. The project has a total investment of 2.5 billion yuan and focuses on the independent research and development and production of core products such as BT copper clad laminate, ABF-like film, and AI high-speed copper clad laminate , providing key material solutions for the fields of IC packaging, AI computing power communication high-speed transmission, and LED display packaging.

As a national high-tech enterprise and a provincial-level specialized and innovative enterprise in Guangdong Province, IPAS has established its headquarters in Guangzhou Huangpu Knowledge City and invested in two subsidiaries in Heshan, Jiangmen: Jiangmen IPAS and Jiangmen Jiabai. These subsidiaries serve as production bases for BT substrates, AI computing power high-speed transmission substrates, ABF-like encapsulation films, and thermally conductive films, continuously providing high-quality products to various substrate and PCB companies in the downstream IC semiconductor packaging field, AI computing power communication high-speed transmission field, and Mini-Micro LED and other display packaging fields.

According to official news from IPAS, the company plans to expand its R&D and production of AI high-speed copper-clad laminates and packaging substrates (BT copper-clad laminates and ABF-like films) in Heshan City in Phase II. This project boasts advanced technology, independent innovation, and huge market potential, and can achieve import substitution for "bottleneck" substrates used in high-end intelligent manufacturing. The project is expected to have a total investment of 2.5 billion yuan, with an initial investment of 1 billion yuan and an annual output value of approximately 1.4 billion yuan upon reaching full production capacity; the second phase plans to invest 1.5 billion yuan, with an annual output value of approximately 1.6 billion yuan upon reaching full production capacity.

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[tokenanalyst]

The Hefei New Station High-end Optical Film Production Base has been completed!​

According to reports, the Xinzhan High-end Optical Film Production Base project, which has now been completed and accepted, is located at the northwest corner of the intersection of Jiudingshan Road and Huaihai Avenue. It covers an area of approximately 70 acres and has a total construction area of approximately 76,000 square meters. The main construction content includes 7 multi-story factory buildings and 1 comprehensive supporting building.
According to relevant sources, optical films, as an important component of functional film materials, are key to achieving high-definition, high-contrast image displays. "Optical films play a crucial role in the screens of electronic devices such as mobile phones, computers, and televisions."
Once the project is officially completed and operational, it will help attract, settle, and grow membrane material projects in the sub-sectors of the new materials industry, accelerate the construction of a new display industry ecosystem, and provide growth space for high-quality enterprises.
Currently, the Xinzhan High-tech Zone has attracted a large number of membrane material companies, including Xinmei Materials, Guofeng New Materials, Xiandao Thin Film, and Changyang Technology, forming a complete membrane industry chain with significant scale advantages. The environment for the growth of the membrane industry is very fertile. According to statistics, from January to September 2025, the new materials industry in the zone achieved an output value of 6.867 billion yuan, and is expected to exceed 9 billion yuan annually. It is accelerating the construction of a new display industry ecosystem and striving to create a world-class new display industry cluster.

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[tokenanalyst]

Efficient Mask Optimization for DMD-Based Maskless Lithography Using a Genetic–Hippo Hybrid Algorithm.​

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Abstract​

Mask optimization is a critical technique for enhancing imaging performance in digital micromirror device (DMD)-based maskless lithography. Conventional algorithms, however, often suffer from slow convergence and limited adaptability, particularly when handling complex multi-feature mask patterns. To address these challenges, this study proposes a hybrid Genetic–Hippo Optimization (GA-HO) algorithm that integrates the global exploration capability of the Genetic Algorithm (GA) with the local exploitation efficiency of the Hippocampus Optimization (HO) Algorithm. The approach employs grayscale modulation for adaptive mask optimization and introduces a global–local cyclic search mechanism to balance exploration and exploitation throughout the optimization process. Simulation results demonstrate that the GA-HO hybrid algorithm achieves a more pronounced improvement in overall optimization performance compared with the standard GA. In complex multi-line mask optimization, the standard GA achieves approximately a 18% enhancement in optimization accuracy, whereas the GA-HO algorithm achieves around a 30% improvement. Moreover, the GA-HO algorithm exhibits a smoother convergence curve, greater stability, and superior robustness. The hybrid method effectively suppresses linewidth variations and corner distortions caused by optical proximity effects (OPE), maintaining high imaging fidelity and stable optimization outcomes even under challenging mask conditions. Overall, the proposed GA-HO framework demonstrates excellent efficiency, adaptability, and precision, providing a reliable and high-performance solution for DMD-based maskless lithography. This work offers a strong theoretical and algorithmic foundation for advancing high-resolution, high-efficiency, and low-cost micro/nanofabrication technologies, highlighting the potential of heuristic hybrid optimization strategies for practical lithography applications.​

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