It could be that they are sub-system manufacturer and SMEE the integrator. But whatever sub-system they are building combines optics and motion sub-systems.
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Chinese semiconductor thread II
- Thread starter vincent
- Start date
The pellicles is a huge deal like you mentioned, most people are completely oblivious to it.There is a lot of information that you never see in the news or in think tank websites. Let suppose you found a government website for the finalization of a project for ultrapure fluid particle control sub-system that says it goes in a immersion lithography machine used in a 14nm process node. That means IMO that they have systems in production for a 28nm process node and they want to move into a more advanced process node and pretty much like ASML that means upgrading the machines. And that also tells that China domestic lithography machines are probably modular so they only have to upgrade the sub-system instead of the entire machine.
Is the same with EUV. The fact that they already moving in pellicles tells me that they have EUV masks that they want to protect from contaminants in some sort of production system that goes beyond the simple pattern lab testing.
Last time I checked it was just patents, has there been anything else happening in that regard?
In 2020 and 2021 the consensus by stooges, including some guys here was that Huawei was finished, 28nm was a hard cap, as more ASML scanners got banned. YMTC was condemned to an 128L hard cap in NAND, all SMIC and YMTC tools should had been ossified by now and so on. Is safe to said that what the news says is not even the tip of the iceberg and what we post here is just the tip iceberg. The level secrecy in China semiconductor industry is almost reaching military levels and is blindsiding a lot of stooges in the US.
How Huawei keeps advancing in chip production? How their patterned M1 metal pitch at the same level of Intel? How they are maintaining their banned "imported" tools? How they are able to advance in 3DNAND? 3DRAM? Or as a guy put it when Huawei announced its Tau´s law. How the hell they were able to make high precision bonding tools? How they advanced so quickly <his words>?
How Huawei keeps advancing in chip production? How their patterned M1 metal pitch at the same level of Intel? How they are maintaining their banned "imported" tools? How they are able to advance in 3DNAND? 3DRAM? Or as a guy put it when Huawei announced its Tau´s law. How the hell they were able to make high precision bonding tools? How they advanced so quickly <his words>?
its seems to be a collaboration between China research institution and China domestic mask fabrication companies to get these delicate films as soon as possible.The pellicles is a huge deal like you mentioned, most people are completely oblivious to it.
Last time I checked it was just patents, has there been anything else happening in that regard?
take a look at just the AI demand on server side and consumer side. the models are doubling in size every year for the next few years. So the most recent DDR5 pricing was 19k RMB for 64 GB -> that's $85 per 2 GB. Let's say we get to a more reasonable level of $15 per 2 GB. In a few years, CXMT will be up to 7m wafers per year. That is 15834m GB assuming 80% yield & 48mm2 die size for 2GB. If we go by $15 per 2 GB -> $120B in revenue per year.
What is your bearish case for server DRAM? That it will get to $8 per 2GB long term?
CXMT is going to have so much cash to expand its DRAM capacity and the entire Chinese AI supply chain is dependent on CXMT, not Huawei. Huawei uses the same AI supply chain that everyone else uses. Piotech hybrid bonding, SMIC logic die, the huge PCB supply chain, shengyi CCL, JCET for high bandwidth memory.
The most innovative AI stack design right now all require customized DRAM from CXMT.
I actually posted three times saying that Korea cut production!!
if i remember correctly, i think some people sued those chipmakers in the US court regarding supply?I actually posted three times saying that Korea cut production!!