Chinese semiconductor thread II

[tokenanalyst]

The Gaoxin Zhongke Semiconductor Materials and Precision Coated Parts Industrialization Base Commences Construction​

According to news from Wujiang Development Zone, the groundbreaking ceremony for the Gaoxin Zhongke Semiconductor Materials and Precision Coated Parts Industrialization Base and R&D Center project was held on June 29. This project is an important strategic move for Gaoxin Zhongke to establish itself in Wujiang and plan for medium- and long-term development.

It is reported that Gaoxin Zhongke has been deeply involved in the semiconductor industry for eleven years, focusing on three core businesses: intelligent manufacturing of core semiconductor components, special precision coating technology, and self-developed coating materials. The production base and R&D center projects that commenced construction this time are strategic core projects for Gaoxin Zhongke, based on the trend of domestic substitution and laying out its medium- and long-term development. They are also key projects for establishing a foothold in Wujiang and empowering the development of new semiconductor productivity in the region. The project plans to create an integrated intelligent manufacturing plant and a professional scientific and technological innovation R&D platform, building intelligent and digital precision coating production lines and material R&D laboratories. Upon completion, it will establish an integrated industrial chain encompassing materials, processing, and coating, with an annual production capacity of over 100,000 core semiconductor components and precision coated parts, and is expected to generate an additional 600 million yuan in annual sale.

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[tokenanalyst]

Qili Semiconductor secures 100 million yuan in financing to expand its 2.5D/3D advanced packaging platform.​

Qili Semiconductor (Shaoxing) Co., Ltd. has successfully secured over 100 million yuan in its A1 round of financing, led by Shanghai Zhangjiang Group with participation from several other investment institutions. The capital will be strategically allocated to construct a comprehensive one-stop 2.5D/3D Chiplet advanced packaging platform, accelerate the development of TSV and InFO mid-line production facilities, and expand back-end manufacturing capacity. This investment aims to bolster high-end R&D efforts and innovate materials and processes, positioning the company to better serve the growing demands of the AI and high-performance computing (HPC) sectors.

The company leverages over two decades of expertise in advanced packaging R&D and industrialization, offering full-process capabilities that span design, simulation, materials, and mass production. Qili Semiconductor has established significant technical milestones, including the mass production of 12TB/s bandwidth products and ongoing development of solutions reaching 32-48TB/s, alongside advanced thermal management systems capable of handling kilowatt-level heat flux densities. Their multi-physics collaborative design and stress control technologies have enabled large-scale heterogeneous integration with a yield rate exceeding 98% for large-size chiplet packaging, currently supporting ultra-large 815mm² AI computing chips.​

With this new funding, Qili Semiconductor plans to increase its annual production capacity for large-size AI chip chiplet packages from 2 million to 3 million units. The company will further solidify its market position by completing its full-process service capabilities for 2.5D/3D advanced packaging and deepening ecosystem cooperation within the industry chain. By continuing to iterate on chiplet and heterogeneous integration technologies, Qili Semiconductor aims to accelerate the large-scale deployment of advanced packaging solutions, thereby providing critical infrastructure support for the rapidly expanding AI computing power industry.​

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[tokenanalyst]

AIN Semiconductor Successfully Delivers High-End Ion Implantation Equipment to Overseas Customers​

Based on in-depth technological development, AIN Semiconductor empowers global chip manufacturing. Recently, AIN Semiconductor's self-developed high-end ion implanter completed assembly and verification and was successfully delivered to an overseas partner. This overseas delivery is a microcosm of the company's steady progress in its global expansion and also reflects the overseas customer's recognition of the company's technological strength and product quality in ion implantation equipment

Ion implanters are core and critical equipment in the semiconductor industry, with extremely high requirements for equipment precision, operational stability, and process compatibility. Our company is deeply committed to the independent research and development of ion implantation machines and core components. Leveraging the technological expertise of our interdisciplinary, highly educated R&D team, we continuously refine the core performance of our equipment, striving to meet international advanced standards.



The equipment delivered this time is equipped with a number of self-developed core components and proprietary process technologies. The overall performance of the machine has reached the international advanced level, and it is highly compatible with the customer's production line process requirements, providing reliable hardware support for the stable mass production of the customer's semiconductor production line.Meanwhile, the company has a complete global service system that can provide domestic and foreign customers with full-cycle support services such as solution customization, on-site commissioning, long-term operation and maintenance, and technology iteration, so as to build a deep and trusting long-term cooperative relationship with professional and long-term services.With steady progress overseas and unwavering commitment to excellence, AIN Semiconductor's overseas deliveries have solidified the brand's international competitiveness. Moving forward, we will continue to focus on the core track of ion implantation equipment, deepen our independent technological innovation, steadily expand into the global market, and empower global semiconductor industry partners with high-end, self-developed equipment.​

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[tokenanalyst]

AMEC participates in the establishment of a 3 billion yuan semiconductor industry fund.​

Advanced Micro-Fabrication Equipment (Shanghai) Co., Ltd. announced that its wholly-owned subsidiary, Zhongwei Lingang, is participating in the establishment of a new private equity fund named Shanghai Zhiwei Lingfeng Venture Capital Partnership, involving a related-party transaction with Zhiwei Capital and other external investors. The fund, tentatively targeting RMB 3 billion in total fundraising subject to adjustment, will see Zhongwei Lingang subscribe for up to RMB 1.47 billion as a limited partner, representing no more than a 49% equity stake. Meanwhile, Zhiwei Capital will act as the general partner and fund manager with a minimum contribution of RMB 30 million, while remaining shares remain open for institutional investment.

This venture capital initiative is classified as a related-party transaction because Zhongwei Lingang holds a 45% stake in Zhiwei Capital, which is ultimately controlled by a current senior executive of the listed company. Although the board of directors has already approved the proposal, it must still be submitted to the shareholders' meeting for formal ratification before any establishment process can commence. Once operational, the fund will focus on semiconductor projects and other strategic emerging industries using an equity investment model with installment funding based on project progress; notably, the company explicitly excludes guarantees or joint liability for repayment, setting a tentative seven-year duration that may be adjusted through negotiation depending on performance outcomes.

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[tokenanalyst]

Hangzhou Investment Promotion Bureau

Hangzhou enters the lithography industry​

Hangzhou has strategically entered China’s lithography industry by focusing on new materials, particularly photoresists. While other major cities like Shanghai and Beijing concentrate on complete machine R&D, Hangzhou aims to support the domestic supply chain where it is most vulnerable. This strategic pivot was highlighted when the city hosted the prestigious "Shiyin Lithography Industry Conference" for the first time, moving it from its traditional locations to signal its ambition to become a central hub for collaborative innovation and resource aggregation in this niche but vital sector.

The core of this initiative is the establishment of a dedicated industrial park for lithography new materials within the Hangzhou Airport Economic Demonstration Zone. This zone is being transformed from a logistics hub into a source of cutting-edge technology, offering specialized infrastructure such as public pilot workshops, third-party testing platforms, and shared precision instruments. By providing these resources, Hangzhou addresses the high costs and verification barriers that have historically hindered small and medium-sized enterprises, enabling faster iteration and "on-machine verification" of domestically produced materials.

Hangzhou leverages significant comparative advantages to support this leap, including a robust foundation in the new materials industry, which is one of its nine pillar sectors with a scale of 100 billion yuan. The city benefits from strong academic resources, such as Zhejiang University’s State Key Laboratory of Silicon Materials, and a thriving ecosystem in AI and advanced packaging that provides immediate downstream applications. Furthermore, the Airport Economic Zone offers unique policy benefits and global connectivity, positioning it as an ideal gateway for building a global lithography industry ecosystem.

To fuel this development, Hangzhou has mobilized substantial financial resources, including a 10 billion yuan national-level service trade fund and various government-guided industry funds. The newly established "Runmiao" fund alliance further amplifies investment capabilities for individual projects. This strong financial and infrastructural support has already yielded results, with the city engaging in deep negotiations with 42 potential companies during the recent conference, laying a solid foundation for the imminent implementation of new projects and the acceleration of domestic substitution in the lithography supply chain.​

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[tokenanalyst]

Leuven Instruments' IPO application on the Science and Technology Innovation Board has been accepted by the Shanghai Stock Exchange. The company plans to raise 2.5 billion yuan to expand production and R&D, strengthening the competitiveness of domestically produced semiconductor equipment.​

Jiangsu Leuven Instruments has officially had its initial public offering (IPO) application accepted by the Shanghai Stock Exchange’s Science and Technology Innovation Board (STAR Market), with plans to raise 2.5 billion yuan. The company has demonstrated rapid financial growth during its reporting period, with operating revenue leaping from 207 million yuan in 2023 to 699 million yuan in 2025. However, reflecting the heavy research and development costs inherent to the semiconductor equipment industry, the company has not yet achieved profitability, reporting net losses of 115 million, 210 million, and 212 million yuan over the three-year span, respectively.

The capital raised from the IPO will be strategically invested in two core projects to boost both research and manufacturing capabilities. The company will build an R&D headquarters in Lingang, Shanghai, to tap into the region's tech talent and ecosystem, alongside a manufacturing base in Pizhou, Jiangsu, to scale up production. Leuven Instruments specializes in front-end semiconductor process equipment, offering a comprehensive product matrix anchored by ion beam shaping/deposition equipment and inductively coupled plasma (ICP) etching systems. These are supplemented by chemical vapor deposition (CVD) and metal contamination detection (VPD) equipment, serving a wide array of logic, memory, power, and display manufacturing applications.

Strategically, Leuven Instruments has established a strong competitive barrier through its proprietary technologies and localized service capabilities. Many of its core products have passed baseline certifications from leading industry customers and successfully achieved import substitution, benchmarking against international leaders. By expanding its capacity through this IPO, the company aims to fill critical domestic gaps in high-end ion beam and etching equipment, ultimately accelerating the self-sufficiency and resilience of China's integrated circuit supply chain.​

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