Chinese semiconductor thread II

[tokenanalyst]

Maskless Lithography company CFMEE Officially Listed on the Main Board of the Hong Kong Stock Exchange​

On June 26, Xinge Microelectronics (688630.SH) officially listed on the Main Board of the Hong Kong Stock Exchange, stock code: 09630.HK. China International Capital Corporation (CICC) served as the sole sponsor and global coordinator for this Hong Kong IPO, raising over HK$3 billion. This is a landmark IPO project in the Hong Kong semiconductor equipment sector for 2026, marking the official start of a new chapter for the leading domestic direct-write lithography company with its "A+H" dual capital platform.

This listing on the Hong Kong Stock Exchange's main board marks a significant milestone in Xinge Microelectronics' development and represents a new starting point for the company's global expansion and integration with global industry and capital resources. Standing on this new development track, Xinge Microelectronics will leverage its A+H dual capital platform advantages to continue its deep cultivation of core micro-nano direct-write lithography technologies. It will closely follow the global semiconductor industry upgrade and domestic substitution trends, continuously strengthening its technological barriers, expanding application boundaries, and deepening industry collaboration. With its robust equipment capabilities, Xinge Microelectronics will promote high-quality development across the industry chain and steadily move towards its goal of becoming a globally leading micro-nano manufacturing equipment company.​

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[tokenanalyst]

Microguide Nano showcases its high-end ALD equipment at the 2026 Atomic-Level Manufacturing Innovation and Development Conference​

Recently, the 2026 Atomic-Level Manufacturing Innovation and Development Conference was grandly opened in Changchun, Jilin Province. Atomic-level manufacturing is a strategic high ground for future industries. Jiangsu Micro-Nano Technology Co., Ltd. ( hereinafter referred to as Micro-Nano, as a leading domestic ALD technology company and the vice chairman unit of the Atomic-Level Manufacturing Innovation and Development Alliance, made a strong appearance at the exhibition with a number of atomic layer deposition equipment, showcasing China's innovative strength in high-end micro-nano equipment with atomic-level precision deposition technology.

The company's newly launched iTomic® SPX series spatial atomic layer deposition system differs from traditional furnace tube ALD and sequential monolithic ALD, balancing mass production capacity with thin film quality. Designed for 3D NAND/DRAM High-K dielectric thin film deposition, it provides an effective process technology solution for memory devices . This spatial ALD equipment features atomic-level precision control, thin film coverage, and uniformity of ultra-thin film thickness. Its technology and equipment specifications have reached top-tier levels in China, successfully achieving domestic substitution.

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[tphuang]

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吾拾微电子 syas its bonding equipment is used by nearly all domestic compound semi clients and 12-inch bonding tools have secured volume orders. This includes 3D stacking & advanced packaging bonding, Optical Chips small-size bonding and memory supercycle preparation and targets bonding tools for advanced memory packaging like 3D NAND stacking, HBM and 3D DRAM.

 

[tokenanalyst]

A new generation of domestically produced TPU has been released: 1792 TOPS!​

Domestic AI chip manufacturer Zhonghao Xinying officially launched its next-generation, fully self-developed TPU (Tensor Processing Unit) chip, "Xuyu," alongside the Taize 2.0 intelligent computing platform.

A single "Xuyu" chip delivers 1792 TOPS (8-bit inference) and 896 TFLOPS (mixed-precision floating-point). This represents a 3x increase in performance compared to its predecessor, "Shana." Despite the performance boost, power consumption is reduced by 50% compared to traditional chips with similar capabilities (rated at 600W per chip). Features optimized tensor logic for large models, expanded registers, and large on-chip cache to address memory access latency and the "memory wall" problem.


Taize 2.0 Computing Platform

A standard node consists of 2 CPUs and 8 "Xuyu" TPUs, delivering 7.168P of mixed-precision computing power. It consumes only 80% of the energy of traditional GPU servers. At a cluster Scale its supports massive scaling with a self-developed inter-chip protocol, allowing a single supernode to directly connect up to 2,048 "Xuyu" chips. This supports trillion-parameter model training and massive concurrent inference. Natively supports mainstream frameworks like PyTorch, vLLM, and SGLang, and is adapted for major models including Qwen, DeepSeek, GLM, and MiniMAX, enabling easy migration for developers.

The chip is specifically optimized for the 2026 shift toward MaaS (Model as a Service), where pricing is based on word/token output rather than hourly compute rental. It addresses pain points in ultra-large models, long-context handling, and high-concurrency AI agent interactions. Supports private deployment with frameworks like OpenClaw, ensuring data privacy for enterprise digital employees and automated tasks.

The entire technology stack—from IP cores and instruction sets to compilation tools—is independently developed, ensuring security compliance for government, finance, and power grid sectors. The unit construction cost of Taize 2.0 is only 60% of overseas high-end alternatives, significantly lowering barriers for green, low-carbon intelligent computing centers.

Zhonghao Xinying, founded in 2018 by former Google TPU expert Yang Gongyifan, has already deployed its previous generation "Shana" chip in major projects with Shenzhen Unicom, Tianjin Mobile, Taiji Computer, and various universities. The new "Xuyu" chip aims to expand this footprint further into the AI agent and large-model infrastructure market.​

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[tokenanalyst]

Shenzhou Co., Ltd.'s IPO application on the Science and Technology Innovation Board has been accepted, aiming to raise 2.522 billion yuan and deepen its focus on core semiconductor components​

Jiangsu Shenzhou Semiconductor Technology Co., Ltd.'s Initial Public Offering (IPO) application on the Shanghai Stock Exchange's Science and Technology Innovation Board was officially accepted by regulators. Backed by Guotai Haitong Securities as its sponsor, the company plans to raise approximately 2.522 billion yuan from this offering. Shenzhou specializes in developing core components for advanced semiconductor process equipment, specifically focusing on high-end plasma power supply systems. These systems are critical technologies utilized in essential processes such as etching and thin film deposition within the semiconductor manufacturing chain, positioning the company as a key player in China's efforts to build an independent domestic supply ecosystem for chip production tools.

The significance of Shenzhou's IPO lies in its potential to disrupt a market historically dominated by international giants from the United States and Japan, which have long held a monopoly on advanced plasma power systems with limited domestic alternatives available. By leveraging the capital raised, the company intends to significantly increase investment in research and development for next-generation semiconductor processes while addressing specific upgrade requirements of its downstream customers. This strategic expansion aims not only to accelerate the localization of key semiconductor equipment within China but also to enhance national capabilities in catching up with global leaders in advanced chip manufacturing technology, thereby reducing reliance on foreign imports and strengthening the domestic high-tech industry's resilience.

Jiangsu Shenzhou Semiconductor Technology Co., Ltd. is a China-based, globally-oriented high-end semiconductor equipment company. Shenzhou provides highly competitive high-end equipment and high-quality services to the integrated circuit and broader semiconductor industries, as well as the medical industry. Its products and services are applied in high-tech industrial fields such as semiconductor etching equipment, chemical thin film equipment, ion implantation equipment, physical vapor deposition equipment, and medical magnetic control systems. Guided by Shenzhou's spirit of innovation, teamwork, and win-win cooperation, the company has achieved significant breakthroughs in new product development, technological innovation, product optimization, and market access, winning the trust and support of numerous customers and suppliers, and becoming a significant force in the international radio frequency and magnetic control equipment industry.

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[tokenanalyst]

Zhongdao Optoelectronics' IPO application on the Science and Technology Innovation Board has been accepted, with plans to raise 1.8 billion yuan to invest in wafer and mass testing equipment production lines.​

The Shanghai Stock Exchange disclosed that the IPO application of Zhongdao Optoelectronic Equipment Co., Ltd. on the Science and Technology Innovation Board was accepted, with a planned fundraising of approximately RMB 1.8 billion, which will be used for the construction of production and R&D centers in Wuhan and Zhaoqing and related capacity expansion projects.

The company's main business is the research, development, production and sales of front-end quality inspection equipment for flat panel displays and semiconductor wafers. Its products are mainly used in the defect detection and yield control stages of wafer manufacturing and display panel production.

According to publicly disclosed information, the fundraising projects mainly focus on the construction of quality inspection equipment and related process platform capabilities, including the expansion of wafer inspection and display inspection equipment production lines, which will enhance the company's product coverage and production capacity in the field of high-end inspection equipment.

Industry insiders believe that semiconductor quality inspection equipment is one of the key links in wafer manufacturing. Currently, this field is still dominated by overseas manufacturers, and there is a large space for domestic substitution. Related companies are in the stage of continuous introduction and capacity expansion.

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[tokenanalyst]

CIOMP ALD method for Multilayer Mirrors. Usually are done using sputtering.

 

[tokenanalyst]

CIOMP ALD method for Multilayer Mirrors. Usually are done using sputtering.
View attachment 177413

My guess is that this should a new type of ALD tool that allows interlace layers of Mo and Si in the same chamber. Given that is ALD, the uniformity has to be insane, atom level, compared with Ion Beam Sputtering and also reduce the need for Ion Beam Polishing. the downside is that has to be slower.

 

[tphuang]

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BYD promoting its BF4002 CMOS for robo cleaner/sweepers. Says to be more light sensitive and produce lower noise than competitors.

 

[sunnymaxi]

China chip material makers battle Japan rivals for $73 Billion market.​

Guangyuan New Material has recently started shipping T-Glass including Panasonic Holdings and Resonac Holdings. Japanese company Nittobo has enjoyed almost total control of the global market for T-glass up until recently.

"We have our own patents and employ different production technologies than Nittobo," said Li Zhiwei, chairman of Guangyuan New Materials. "While there is still a gap between us and Nittobo, our technological advancements have accelerated in recent years."

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