Chinese semiconductor thread II

tokenanalyst

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Shanghai Institute of Optics and Fine Mechanics makes progress in vibration measurement using large-aperture Fizeau interferometers


Recently, the research team led by Professor Liu Shijie at the Optical Detection and Characterization Center of the High-Power Laser Components Technology and Engineering Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, has made progress in the research of vibration-resistant measurement technology for large-aperture, high-resolution interferometers. The relevant findings, titled " Three-step iteration-based vibration-resistant measurement technique for large-aperture high-resolution interferometers," have been published in *Optics and Lasers in Engineering *.

While the traditional three-step least squares iterative method ( TIA ) can achieve vibration compensation and wavefront recovery in interferometric measurements, it suffers from significant drawbacks such as high computational load and low processing efficiency when applied to large-aperture, high-resolution testing scenarios. To address this technical bottleneck, the research team proposed a three-step iterative vibration-damping phase recovery technique ( VibeResPhase ). This method innovatively separates vibration parameter identification and wavefront phase recovery into separate modules, significantly optimizing the computational logic while ensuring measurement accuracy.

The research team conducted experimental verification on a Φ600mm Fizeau interferometer , demonstrating that the VibeResPhase method improves measurement efficiency by more than 8 times compared to the traditional TIA method . This technology balances measurement accuracy and computational speed, is suitable for large-aperture, high-resolution wavefront vibration measurement scenarios, and provides strong support for the precise measurement of wavefront errors of large-aperture optical components in complex environments.

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tokenanalyst

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Qinghe Crystal's magnesium-doped lithium niobate thin films: facilitating independent control of core materials in quantum technology and opening up new pathways for the recycling of scarce resources.​


Qinghe Crystal (Qinghe Epistar) announced a major technological breakthrough in magnesium-doped lithium niobate thin films (MgO:TFLN), a core material for quantum photonic chips. By using self-developed, high-end bonding equipment, the company not only achieved premium wafer-level quality but also solved a critical industry bottleneck: the ability to recycle scarce lithium niobate wafers multiple times without losing performance.

The independently developed bonding process eliminates voids, interface damage, and stress, ensuring the high consistency required for quantum devices. Qinghe Crystal has successfully recycled these scarce wafers more than three times. Testing confirms that recycled wafers perform identically to virgin materials in electro-optic coefficients and optical loss. This "multiple lives for a single wafer" technology significantly lowers production costs, shortens processing cycles, and drastically reduces China's reliance on imported high-purity niobium resources. MgO:TFLN is known as the "cornerstone of quantum photonic chips" and is highly sought after for quantum communication, LiDAR, and next-generation high-speed optical modules (800G to 3.2T).
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As global demand for quantum tech and high-speed optical communications surges, the thin-film lithium niobate modulator market is projected to reach 3 billion yuan by 2031 (with a massive 271% CAGR from 2029-2031). By combining equipment self-sufficiency with material recycling, Qinghe Crystal is positioning itself to drive the mass production of these chips and secure China's self-reliance in core quantum technology materials.

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tokenanalyst

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Chingwo Chip Wins 2026 Atomic-Level Manufacturing Innovation Award​


Qinghe Crystal (Qinghe Epistar) won the third prize in the Application Solutions Track of the 2026 Atomic-Level Manufacturing Innovation Competition. The award recognizes the company's independent breakthrough in atomic-level surface treatment technology, specifically highlighted by its newly developed "super-atomic beam TRIM equipment."

Key Technological Highlights of the TRIM Equipment:
  • Ultra-Precision Capabilities: Designed for atomic-level processing, the equipment performs surface polishing, film thickness trimming, and surface shape adjustment. It is crucial for working with superhard materials (like diamond), complex optics, and semiconductor thin films.​
  • Non-Destructive Processing: Unlike traditional charged single-ion beams, it uses a novel neutral superatomic beam. This eliminates electrostatic accumulation, deep lattice damage, and surface contamination.​
  • Zero-Defect Bonding Foundation: It achieves extreme flatness (uniformity reaching 1σ < 1nm), which maximizes the van der Waals contact area during semiconductor bonding, fundamentally preventing voids and cracks.​
  • Mass Production Ready: Supports 12-inch wafers, automated loading/unloading, and features high beam intensity (≥100μA) to meet the stability requirements of high-yield mass production.​
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Evolved from Qinghe's deep expertise in semiconductor bonding, this equipment solves critical bottlenecks in atomic-level manufacturing. It is a landmark achievement for China's goal of technological self-reliance, providing essential "root technology" equipment for advanced packaging, integrated circuits, quantum computing, and ultra-precision optics.​

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sunnymaxi

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Chingwo Chip Wins 2026 Atomic-Level Manufacturing Innovation Award​


Qinghe Crystal (Qinghe Epistar) won the third prize in the Application Solutions Track of the 2026 Atomic-Level Manufacturing Innovation Competition. The award recognizes the company's independent breakthrough in atomic-level surface treatment technology, specifically highlighted by its newly developed "super-atomic beam TRIM equipment."

Key Technological Highlights of the TRIM Equipment:
  • Ultra-Precision Capabilities: Designed for atomic-level processing, the equipment performs surface polishing, film thickness trimming, and surface shape adjustment. It is crucial for working with superhard materials (like diamond), complex optics, and semiconductor thin films.​
  • Non-Destructive Processing: Unlike traditional charged single-ion beams, it uses a novel neutral superatomic beam. This eliminates electrostatic accumulation, deep lattice damage, and surface contamination.​
  • Zero-Defect Bonding Foundation: It achieves extreme flatness (uniformity reaching 1σ < 1nm), which maximizes the van der Waals contact area during semiconductor bonding, fundamentally preventing voids and cracks.​
  • Mass Production Ready: Supports 12-inch wafers, automated loading/unloading, and features high beam intensity (≥100μA) to meet the stability requirements of high-yield mass production.​
View attachment 177249
Evolved from Qinghe's deep expertise in semiconductor bonding, this equipment solves critical bottlenecks in atomic-level manufacturing. It is a landmark achievement for China's goal of technological self-reliance, providing essential "root technology" equipment for advanced packaging, integrated circuits, quantum computing, and ultra-precision optics.​

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Super-atomic Beam (SAB) TRIM and Ion Beam Trimming are critical in advanced logic chip manufacturing like 2nm/3nm nodes. As transistor structures like GAA shrink to atomic levels, SAB equipment is deployed to achieve sub-nanometer thickness homogeneity and planarize thin films to maximize manufacturing yields..
 

tokenanalyst

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Super-atomic Beam (SAB) TRIM and Ion Beam Trimming are critical in advanced logic chip manufacturing like 2nm/3nm nodes. As transistor structures like GAA shrink to atomic levels, SAB equipment is deployed to achieve sub-nanometer thickness homogeneity and planarize thin films to maximize manufacturing yields..
Impressive tool.
 

tokenanalyst

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A major breakthrough for domestically produced Physical AI chips.​


Ouye Semiconductor has announced a major milestone in China's autonomous vehicle industry: the mass production and delivery of its domestically produced Physical AI chips have surpassed one million units. This achievement positions Ouye as one of the few Chinese providers capable of delivering complete "computing + communication" platform-level AI chip solutions with large-scale pre-installation verification in vehicles.

This success is a critical step toward achieving self-sufficiency in the underlying computing power required for China's third-generation "Central + Regional" electronic and electrical (E/E) architecture.

For years, domestic smart vehicles relying on AI for tasks like local perception, prediction, and real-time control of hardware-intensive units (cameras, radars, body controllers, gateways) have depended heavily on overseas solutions from giants such as Infineon, Texas Instruments (TI), and Ambarella.

Ouye Semiconductor distinguishes itself as the first domestic company to provide full-stack SoC (System-on-Chip) solutions based on the third-generation automotive E/E architecture. With a core R&D team boasting over 20 years of average industry experience, Ouye aims to close the gap with global leaders through:​
  1. Unified Platform Approach: A "chip-algorithm-software" stack covering three core scenarios:​
    • Central Computing​
    • Regional Controllers​
    • Edge Intelligent Components​
  2. Product Portfolio Highlights:
    • Longquan 560: A high-efficiency automotive-grade AI computing processor designed for the third-generation E/E architecture. It excels in ISP (Image Signal Processing) and NPU efficiency, supporting assisted intelligent driving, CMS (Central Mirrors), smart headlights, and DSSAD systems.​
    • Gongbu 565 Series: China's first high-end automotive-grade ZCU(Zone Control Unit) chip featuring RRAM (Resistive Random Access Memory).
      • Equipped with a native AI acceleration engine for local computing.​
      • Enables functions like motor fault prediction, thermal management, and adaptive seat adjustment.​
      • Performance Gains: Reduces end-to-end control latency by >70% compared to traditional MCUs; achieves TSN hard forwarding latency as low as 3 microseconds.​
The Gongbu series redefines the ZCU's role, transforming it from a simple controller into an intelligent hub capable of native local AI processing. Ouye Semiconductor has reportedly secured dozens of projects with mainstream automakers and is currently entering a phase of rapid growth driven by large-scale mass production. This milestone signifies a shift in China's automotive supply chain toward domestic dominance in high-end computing hardware.

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tokenanalyst

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Hanwei Technology releases China's first nine-axis MEMS inertial sensor chip, enabling intelligent motion posture perception in embodied devices.​


MEMS Consulting has learned that Hanwei Technology Group Co., Ltd. (hereinafter referred to as "Hanwei Technology") recently released China's first nine-axis MEMS inertial sensor chip for the field of embodied intelligence: HAU925. Hanwei Technology stated that the HAU925 integrates MEMS, ASIC, and intelligent processing units into a single chip, and is equipped with a self-developed sensor fusion algorithm. It can output three-axis acceleration, three-axis angular velocity, three-axis magnetic field, as well as pitch angle, roll angle, and quaternion attitude information, and has advantages such as small size, high precision, and stable reliability. Hanwei Technology will use the HAU925 to improve the high-precision motion attitude perception capabilities of embodied intelligent robots, robot dogs, motion capture suits, and unmanned vehicles.

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Key Capabilities & Performance
  • Comprehensive Data Output: The chip provides three-axis acceleration, three-axis angular velocity, and three-axis magnetic field data simultaneously, calculating precise pitch, roll, and quaternion attitude information.​
  • Industry-Leading Precision:Leveraging differential comb structures and self-compensating MEMS technology, the HAU925 significantly reduces errors caused by process variations, temperature shifts, vibration, and packaging stress. Its core metrics include:
    • Gyroscope Noise: 0.0055°/s√Hz​
    • Gyroscope Zero Bias: 0.3°/s​
    • Accelerometer Noise: 65ug/√Hz​
    • Accelerometer Zero Bias: 20mg​
Design & Manufacturing Advantages
  • Ultra-Compact Size: Measuring only 6mm × 6mm × 1.6mm, the chip is smaller than one-tenth of a single Chinese yuan coin and packaged in a standard QFN-14 form factor for easy surface-mount assembly.​
  • Simplified Integration: The single-chip design eliminates the need for complex wiring and calibration between multiple modules found in traditional designs.​
  • Mass Production Capability: Hanwei Technology utilizes advanced domestic production lines with an annual capacity of 10,000 wafers (equivalent to 150 million chips), ensuring high consistency, stability, and rapid delivery for large-scale projects.​

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henrik

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also, I did an article with Tech Buzz China on CXMT
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and I produced the domestic supply chain diagram for CXMT in there as well as the capacity and revenue estimates. I also have one for long term revenue projection

Buy both cxmt and micron stocks is better than buying byd and tesla stocks? Are ymct and cxmt going to keep on expanding their capacities until they are larger than sk hynix and samsung?
 

tphuang

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Buy both cxmt and micron stocks is better than buying byd and tesla stocks? Are ymct and cxmt going to keep on expanding their capacities until they are larger than sk hynix and samsung?
CXMT is on pace to being far and away the most profitable in China over the next year. Even at $20B a quarter for next 4 quarters & 80% margin, it's profit will be $64B.

YMTC will probably have profit of $15-20B also as NAND price continue to rise.
 
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