In the high-end manufacturing sector, silicon carbide (SiC) ceramics, with their superior properties such as high hardness, high thermal conductivity, high temperature resistance, and corrosion resistance, have become an important basic material for industries such as semiconductor equipment, aerospace, and new energy. However, due to the material's inherent hardness and brittleness and the extremely high difficulty in processing, achieving high-precision, high-quality micropore processing on thick silicon carbide has always been a significant technical challenge for the industry.
Recently, Yueqian Laser announced new progress in femtosecond laser precision machining technology, successfully completing the machining of a large aspect ratio micro-hole in 3.7 mm thick silicon carbide material. This machining achieved high-quality fabrication with a 600-micron aperture, demonstrating excellent machining accuracy and consistency, and providing a new technical solution for the manufacturing of silicon carbide precision components.
In terms of processing results, both types of silicon carbide materials achieved near-ideal straight holes, with minimal difference between the inlet and outlet diameters of the micropores, smooth and flat hole walls, and no common defects such as cracks or recast layers. Some samples even exhibited high surface finish, demonstrating the unique advantages of femtosecond lasers in the micromachining of hard and brittle materials.
The core of this achievement lies in the "cold processing" characteristics of femtosecond lasers. Unlike traditional machining or long-pulse laser processing, femtosecond lasers can complete energy deposition in an extremely short time, directly removing materials through a "cold ablation" mechanism. This significantly reduces the formation of heat-affected zones, avoids microcracks and material damage caused by thermal stress, and thus preserves the original properties of silicon carbide to the greatest extent.
Meanwhile, femtosecond laser processing also features high precision, high consistency, and non-contact processing. This technology can effectively control hole size, roundness, and taper, achieving stable batch processing; at the same time, it avoids problems such as edge chipping and breakage caused by tool wear and mechanical contact, providing reliable assurance for the manufacturing of complex structures and precision micro-holes.
