Chinese semiconductor thread II

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Michael90

Senior Member
Registered Member
tphuang said:
the counterpart article on NAND that YMTC news came from

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revenue is up 445% YoY as market share rose from 8 to 13%. If whole market is $46B then 13% of that is $5.8B, which is much higher than we previously thought. That is not too far from the $7B+ reported for CXMT. Both of these guys are now so much larger than SMIC
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Yes, and the gap between them will get even far larger by next year . This is actually surprising , since if you had asked anyone just 4 years ago who will be the biggest beneficiary in china of US sanctions on china's semi industry, almost everybody(me included ) would have convincingly said SMIC without a doubt . It's surprising to see how YMTC and CXMT came from way behind out of nowhere to advanced so fast to the point their revenues dwarfs SMICs by far and will only increase even more with the AI boom and memory shortages globally. Their best years are ahead of them.
 
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meedicx

Junior Member
Registered Member
Phead128 said:
Great news for Chinese HBM (critical for AI), which has closed gap to merely 3 years behind leading Korean competitors.

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The implications is US export controls has completely backfired and has actually invigorated a massive boom in key strategic areas in AI for China.
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Alibaba is one of the biggest investors in CXMT and their T-Head Zhenwu roadmap announced a few weeks ago implies HBM3 is already being mass produced and HBM3e will be mass produced next year (they did not announce throughput but you can make some assumptions from the capacity).

The Zhenwu roadmap also matches the memory improvements of the Ascend roadmap, which indicates supply-chain level breakthroughs:
  • Zhenwu M890 is already running in data centers and has 144 GB HBM (HBM3 level). The Ascend 950 DT is being mass produced right now and also has 144GB HBM-like memory.
  • Zhenwu V900 is announced for 2027 Q3 will have 216 GB HBM (HBM3e level). The Ascend 960 announced for next year has 288GB.

I'm not sure of the credibility, but
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also says Baidu Kunlunxin P800 (current year) uses HBM3 and their planned M300 chip next year will use HBM3e.

So there are many data points in the Chinese AI chip supply chain that all support this.
 
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