Chinese semiconductor thread II
- Thread starter vincent
- Start date
First Anduril and now Iluvatar. What is this trend of naming companies from LOTR.
Alibaba T-Head displaying info for its AI chip, formerly known as PPU, now called 真武 810E on its website.
The only other NLO crystal within this wavelength (KBBF) was also developed by CAS.
That's the English name. The real name is Tianshu Zhixin. The official registered names of Chinese companies are in Chinese. Then those companies that have international exposure pick an international name for marketing and international trade purposes. So nothing wrong in picking something foreigners can easily remember. There are a few different ways of picking an international name.
1) Just a romanized version of the actual Chinese name. Eg: Huawei
2) Actual English translation of the Chinese name or something very close. Eg: ByteDance
3) Something totally different. eg: LandSpace, WeChat.
Iluvatar falls in that third category. In that case you just pick something that is memorable and easy to market to the foreign audience.
With a total investment of 600 million yuan, the Canrui Technology Global Chip R&D Center project has been topped out.
Canrui Technology has officially reached the structural "topping out" phase of its Global Chip R&D Center in Shanghai’s Taopu District. Representing a total investment of 600 million yuan, the 57,000-square-meter facility is a landmark project in Shanghai’s "Industrial Upward Mobility" initiative, which promotes the construction of high-rise intelligent manufacturing spaces. This project is the first in Putuo District to successfully implement the "industrial buildings moving upstairs" model, designed to maximize land efficiency while supporting high-tech production.
Founded in 2005, Canrui Technology is a leader in magnetic sensors and power management chips, serving critical sectors such as automotive electronics, industrial control, and medical equipment. The new center will serve as a comprehensive hub for the entire integrated circuit lifecycle, including R&D, design, packaging, and testing. Its design specifically accommodates the precision requirements of semiconductor manufacturing, ensuring that the heavy equipment and specialized processes are compatible with a high-rise industrial environment.
Once fully operational, the center is expected to generate an annual industrial output value of 500 million yuan. Beyond its economic contributions, the project aims to attract high-end global talent and foster a collaborative innovation ecosystem by aggregating upstream and downstream resources in the semiconductor supply chain. This development is expected to significantly enhance the regional industrial level and serve as a model for urban industrial upgrading through the integration of research and production.
Jingsheng Electronics: 12-inch advanced packaging R&D line completed; Shanghai Phase II laboratory expansion project under construction.
Recently, Wuhan Jingce Electronics Group Co., Ltd. (hereinafter referred to as "Jingce Electronics") stated in its investor relations activity record that the company is actively making strategic plans for advanced packaging technology. By increasing its capital to hold 33.6414% of the equity of Hubei Xingchen Technology Co., Ltd. (hereinafter referred to as "Hubei Xingchen"), the company has deepened its strategic cooperation and binding with core customers such as Hubei Xingchen.
Currently, Hubei Xingchen has established a leading 12-inch integrated circuit advanced packaging R&D line in China, with core processes fully operational, enabling it to provide customers with one-stop advanced packaging solutions. It is currently in the customer introduction phase. Simultaneously, based on market demand, the second phase of the R&D line project is under construction.
The company's expansion in the semiconductor industry from front-end measurement equipment to the semiconductor manufacturing and packaging industry chain is conducive to the company seizing the historical opportunities of the rapid development of data centers, supercomputing, and AI industries, while promoting the growth of the company's semiconductor business, which is of great significance to the company's long-term development.
Furthermore, to accelerate the iterative upgrade to more advanced process technologies, enhance comprehensive R&D capabilities and competitiveness, and further implement future development strategic plans, the company's holding subsidiary, Shanghai Jingce, plans to purchase the land use rights of plot F2-05 in the Shixi Software Information Park, Qingpu District, Shanghai, and invest in the construction of the second phase laboratory expansion project of Shanghai Jingce Semiconductor Technology Co., Ltd. The total planned investment for this project is approximately RMB 350 million.
Currently, Hubei Xingchen has established a leading 12-inch integrated circuit advanced packaging R&D line in China, with core processes fully operational, enabling it to provide customers with one-stop advanced packaging solutions. It is currently in the customer introduction phase. Simultaneously, based on market demand, the second phase of the R&D line project is under construction.
The company's expansion in the semiconductor industry from front-end measurement equipment to the semiconductor manufacturing and packaging industry chain is conducive to the company seizing the historical opportunities of the rapid development of data centers, supercomputing, and AI industries, while promoting the growth of the company's semiconductor business, which is of great significance to the company's long-term development.
Furthermore, to accelerate the iterative upgrade to more advanced process technologies, enhance comprehensive R&D capabilities and competitiveness, and further implement future development strategic plans, the company's holding subsidiary, Shanghai Jingce, plans to purchase the land use rights of plot F2-05 in the Shixi Software Information Park, Qingpu District, Shanghai, and invest in the construction of the second phase laboratory expansion project of Shanghai Jingce Semiconductor Technology Co., Ltd. The total planned investment for this project is approximately RMB 350 million.