Chinese suppliers should supply google or meta only at much higher prices.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Chinese suppliers should supply google or meta only at much higher prices.
We have hit the earning season for chipmakers
Rockchip reports 20.26% revenue growth YoY and 52% growth in profit. Its RK3588 flagship SoC is very popular in auto electronics, robot sensing and various industrial applications. It is dealing with DDR4 shortage issues.
Southchip reports 40% growth YoY in revenue and 2.82% growth in earnings. It is investing in expand auto product line in various smart driver chips, PMIC, connector chips and such.
Sai Micro reports huge gain in profit but huge drop in revenue after it sold Swedish fab Silex.
The company formally known as SMEC and now as 芯联集成/United Nova also reporting huge growth in revenue, up 20% yoY and its gross margin is 4% now (so turned profitable, its gross margin has improved 5 quarters in a row). makes sense since it actually has enough revenue to outstrip all the new fab depreciation.
Its SiC MOSFET modules have apparently been delivered to Western AI firms. It sees huge growth in AI server power chips.
Its 55nm BCD DrMOS chip has passed customer validation. 180nm DrMOS already in mass production. It is widely bringing up volume in HVDC market.
Rockchip reports 20.26% revenue growth YoY and 52% growth in profit. Its RK3588 flagship SoC is very popular in auto electronics, robot sensing and various industrial applications. It is dealing with DDR4 shortage issues.
Southchip reports 40% growth YoY in revenue and 2.82% growth in earnings. It is investing in expand auto product line in various smart driver chips, PMIC, connector chips and such.
Sai Micro reports huge gain in profit but huge drop in revenue after it sold Swedish fab Silex.
The company formally known as SMEC and now as 芯联集成/United Nova also reporting huge growth in revenue, up 20% yoY and its gross margin is 4% now (so turned profitable, its gross margin has improved 5 quarters in a row). makes sense since it actually has enough revenue to outstrip all the new fab depreciation.
Its SiC MOSFET modules have apparently been delivered to Western AI firms. It sees huge growth in AI server power chips.
Its 55nm BCD DrMOS chip has passed customer validation. 180nm DrMOS already in mass production. It is widely bringing up volume in HVDC market.
NationalChip Technology's automotive chip business increased by 73.52% year-on-year, and its R&D expense rate reached 89.03%.
On October 28, Suzhou Guoxin Technology Co., Ltd. (stock code: 688262, stock abbreviation: Guoxin Technology) released its third-quarter 2025 financial report. Q3 operating revenue reached 88.055 million yuan, a year-on-year decrease of 57.7%. From January to September, the company's cumulative operating revenue reached 259 million yuan, a year-on-year decrease of 44.92%. The company explained the revenue decline as primarily due to external factors impacting its custom chip service business, which resulted in longer production cycles and delayed customer deliveries. However, the company has actively implemented countermeasures, and as of August 27, 2025, the supply chain situation for its custom chip business has improved, with ample orders currently available. The company is fully committed to wafer production, packaging and testing, and customer deliveries.
Notably, the company's core business segments are showing significant growth. From January to September 2025, the company's proprietary chip and module business generated revenue of 158 million yuan, a year-on-year increase of 40.58%. By application area, revenue from the automotive electronics chip business reached 79.9826 million yuan, a significant year-on-year increase of 73.52%. As of September 30, 2025, the company's cumulative shipments of automotive electronics chips have exceeded 20 million units, highlighting the competitiveness of its core products in the market.
Current sensing component company Pusenmei completes Series A+ financing
According to Zhongke Chuangxing, Pusenmei Microelectronics Technology (Suzhou) Co., Ltd. (Pusenmei) recently announced the completion of its Series A+ financing round, led by Qianhai Ark Fund and Shenzhen Capital Group, with participation from Guotai Junan Innovation Investment and Jinpeng Fund. Pusenmei will use the funds raised for R&D, capacity expansion, and market expansion.
PROSEMI was founded in 2019 and is committed to providing professional and diversified precision current sensing components and circuit protection solutions. Its core team comes from leading domestic and foreign companies such as Yageo Electronics, Dayi Electronics, Huade Electronics, AEM, Littelfuse, and ZTE.
Focusing on its core product, precision current sensing components (CSRs), Pusenmei has developed a comprehensive product portfolio, encompassing packaged alloy CSRs, thin-film alloy CSRs, high-power shunts, and modular products. These products fully meet the common and customized needs of diverse scenarios and customers. Vertically, Pusenmei has established a closed-loop industrial chain encompassing "upstream new materials - high-end equipment - components," fostering unique and comprehensive product and industry competitiveness. Currently, Pusenmei boasts manufacturing facilities exceeding 20,000 square meters in Suzhou, Jiaxing, and Dongguan.
A current sensing element (CSR) is a precise, low-resistance passive component. As one of the most widely used current sensor solutions, CSRs leverage the properties of alloy materials and Ohm's law to collect current signals and protect circuits. They detect the measured current and convert it into a standard voltage or current signal, enabling information transmission, processing, storage, display, recording, and control. They are widely used in various modules, including battery management systems, motor drives, inverters, and frequency converters. Applications include industrial control, new energy vehicles, photovoltaic energy storage, consumer electronics, smart homes, robotics, and AI applications. This field is categorized by product type and primarily includes three main categories: packaged alloy products (metal strip resistors), thin-film alloy products (foil resistors), and high-power shunt resistors.
Liandong Technology: The QT-8400 series test platform has entered the mass production and shipment stage, and the number of customers is steadily increasing.
Liandong Technology stated in an institutional online exchange and investor event that the global semiconductor industry has gradually recovered after experiencing cyclical adjustments in 2024. Driven by the recovery of demand for artificial intelligence, automotive electronics, industrial Internet of Things and consumer electronics, the power semiconductor market continues to expand, and the industry development prospects are positive.
The company noted that silicon carbide (SiC) and gallium nitride (GaN), as third-generation semiconductor materials, are continuously unlocking market potential in new energy vehicles, renewable energy power generation, industrial equipment, and fast-charging applications due to their high power density and high efficiency. As the penetration rate of SiC and GaN devices increases, the industry's demand for high-precision, high-power testing equipment continues to grow, bringing long-term benefits to the company's core business.
Liandong Technology has been deeply engaged in the testing of high-power devices, modules, and third-generation semiconductors for many years, establishing a proprietary and controllable technology ecosystem. The company maintains long-term partnerships with leading international companies such as ON Semiconductor, Littelfuse, and Vishay Group, as well as leading domestic customers such as Xinlian Integrated Circuit, CRRC, San'an Optoelectronics, Tongfu Microelectronics, Huatian Technology, China Resources Microelectronics, and Yangjie Technology, continuously optimizing its customer base.
The company's QT-8400 series test platform has established a clear technological advantage in the full-performance testing of third-generation semiconductor wafers and modules, including silicon carbide and gallium nitride. Featuring high precision, high power, and wide voltage coverage, the platform has entered mass production and shipment, with steadily growing customer base. The company stated that it will continue to increase R&D investment to further consolidate its leading position in the power semiconductor test equipment market.
The company noted that silicon carbide (SiC) and gallium nitride (GaN), as third-generation semiconductor materials, are continuously unlocking market potential in new energy vehicles, renewable energy power generation, industrial equipment, and fast-charging applications due to their high power density and high efficiency. As the penetration rate of SiC and GaN devices increases, the industry's demand for high-precision, high-power testing equipment continues to grow, bringing long-term benefits to the company's core business.
Liandong Technology has been deeply engaged in the testing of high-power devices, modules, and third-generation semiconductors for many years, establishing a proprietary and controllable technology ecosystem. The company maintains long-term partnerships with leading international companies such as ON Semiconductor, Littelfuse, and Vishay Group, as well as leading domestic customers such as Xinlian Integrated Circuit, CRRC, San'an Optoelectronics, Tongfu Microelectronics, Huatian Technology, China Resources Microelectronics, and Yangjie Technology, continuously optimizing its customer base.
The company's QT-8400 series test platform has established a clear technological advantage in the full-performance testing of third-generation semiconductor wafers and modules, including silicon carbide and gallium nitride. Featuring high precision, high power, and wide voltage coverage, the platform has entered mass production and shipment, with steadily growing customer base. The company stated that it will continue to increase R&D investment to further consolidate its leading position in the power semiconductor test equipment market.
Aisen Co., Ltd.'s ultra-high purity cobalt sulfate-based liquid received the first domestically produced mass production order from a mainstream wafer fab
Aisen Co., Ltd. announced that the company's independently developed ultra-high purity cobalt sulfate-based liquid has officially obtained the first domestically produced mass production order from a mainstream wafer fab, marking a key breakthrough for the company in the field of domestic substitution of core materials in advanced semiconductor processes.
In recent years, Aisen has made significant progress in the research and development and industrialization of advanced process technologies, successfully supplying core materials for 28nm and 5nm-14nm advanced processes to mainstream wafer fabs. The company's products have undergone rigorous verification and have reached internationally advanced levels of purity, stability, and compatibility.
The company explains that its core product lines include copper plating additives and ultra-high-purity chemicals. The company claims that its copper plating additives have secured sustained and stable mass production orders from several leading wafer fabs. The mass production and delivery of its ultra-high-purity cobalt sulfate-based solution further demonstrates Aisen's comprehensive technical strength in copper interconnect process chemicals.
Public information indicates that Aisen Co., Ltd. specializes in the research and development and manufacturing of high-purity electronic chemicals. It is one of the few companies in China capable of providing key material solutions for process nodes of 5nm and below. The company's products are widely used in high-end fields such as wafer manufacturing, packaging and testing, and display panels.
They also produce photoresist and lithography chemicals.
Interesting to see a vocacional school developing such high level technology.
Impact of Phase Defects on the Aerial Image in High NA Extreme Ultraviolet Lithography
Abstract
With the development of extreme ultraviolet (EUV) lithography technology to higher numerical aperture (NA), it provides higher resolution imaging quality, which may be more sensitive to the phase defect in EUV mask. Therefore, it is necessary to comprehensively understand the effect of phase defect on the imaging quality depending on the NA. We simulated aerial images of patterned EUV masks for the EUV lithography exposure tool of NA = 0.55 and NA = 0.33 using the rigorous coupled-wave analysis (RCWA) method. The results shows that higher NA enhances the contrast of aerial images, which, in turn, provides greater tolerance for phase defect. This indicates that high NA can mitigate the negative impact of phase defect on imaging quality to some extent. Furthermore, it is found that both the defect signal and the intensity loss ratio of the aerial image first increase and then decrease as the width of the phase defect increases, due to the height/width ratio of the phase defect. Meanwhile, the defect width corresponding to the maximum phase defect signal tends to become smaller as the NA becomes larger. It is also worth noting that when NA = 0.33, variations in the position of the phase defect led to fluctuations in the CD error due to the shadow effect of the absorber, while it diminishes at NA = 0.55. This is because a higher NA of 0.55 provides a stronger background field, which suppresses the shadow effect of the absorber more effectively than it does at NA = 0.33.
Yeah. The big three (Samsung, SK Hynix, Micron) got scared of CXMT and left the DDR4 market. Only for CXMT to start mass production of DDR5 and also cut DDR4 production.
And now AI threatens to gobble up DRAM capacity.
This one is kind of lame. The German government forbade Silex from buying the Elmos fab for capacity expansion because Silex was owned by a Chinese company (Sai Micro). So Silex expanded its facilities in Sweden instead doubling capacity to 7000 wpm of 8" wafers. The US government then made US customers start to leave the Swedish Silex fab. The Swedish government forbade Sai Micro from using design services by Silex in Sweden. Then the Swedes made a deal to get a group of local investors to buy 55% of Sylex Sweden shares from Sai Micro. Sai Micro still has 45%.
At least they did not outright steal the company like what happened to Nexperia.
Sai Micro does have a fab in China for MEMS using a similar process to Silex in Sweden, this is called Silex China, but this is in Beijing with 15000 wpm of 8" wafers. Expandable to 30000 wpm. So whatever.
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