Chinese semiconductor thread II

tokenanalyst

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Hengkun New Materials will enter the Sci-Tech Innovation Board (STAR Market)

Xiamen Hengkun New Materials Technology Co., Ltd. (hereinafter referred to as "Hengkun New Materials") will enter the Sci-Tech Innovation Board (STAR Market) with its "hard technology" DNA. As one of the few domestic companies to achieve mass production of key materials for 12-inch integrated circuit wafer manufacturing, Hengkun New Materials has not only been recognized as a national-level "Little Giant" for specialized, specialized, and innovative materials, but has also broken the monopoly of foreign giants in the fields of photolithography materials and precursor materials, achieving a leap from a "localization rate of less than 1%" to a "three-year compound growth rate of self-generated revenue of 67%."

Since its establishment in 2004, Hengkun New Materials has always focused on the research and development and industrialization of key materials for integrated circuits. It is one of the few innovative companies in China with the ability to research and develop and mass-produce key materials for 12-inch integrated circuit wafer manufacturing. Its products cover two core areas: photolithography materials and precursor materials.

Key integrated circuit materials are a crucial area for fostering and developing new high-quality integrated circuit production capacity. Achieving independent control over these materials is the upstream foundation for resolving core integrated circuit technology challenges. Hengkun New Materials has achieved mass production and supply of photoresist materials such as SOC, BARC, KrF photoresist, i-Line photoresist, and precursor materials such as TEOS. ArF immersion photoresist has been verified and is now available on a small scale. These materials are widely used in the lithography and thin film deposition processes of advanced NAND, DRAM, and logic chips below 90 nm, becoming indispensable domestic support for the core 12-inch wafer manufacturing process, fully supporting the national integrated circuit localization strategy.

Independent and controllable core technologies, and product iteration to achieve import substitution


In recent years, the domestic integrated circuit industry has maintained robust growth. With multi-faceted support from national strategies and industry policies, the localization of the integrated circuit industry has accelerated, and domestic wafer fabs have continuously enhanced their R&D and innovation capabilities, production and manufacturing capabilities, and market development capabilities in advanced processes. Upstream key materials and equipment companies, as key elements influencing the advancement of integrated circuit manufacturing processes, must possess not only independent R&D and continuous innovation capabilities for core technologies, but also the ability to scale production and maintain quality control. The company's cumulative production and sales of over 40,000 gallons of photolithography materials demonstrates its large-scale production and quality control capabilities. As of the end of the reporting period, the company had over 100 self-produced products undergoing R&D, verification, and volume supply . The company has established stable partnerships with several leading 12-inch integrated circuit fabs in China, providing technical support for the localization of key materials and making significant contributions to the development of the domestic integrated circuit industry.

Since 2020, the company has successively undertaken sub-projects of the National 02 Major Science and Technology Project and special research tasks of the National Development and Reform Commission, and has completed acceptance. In 2023, the company has newly undertaken a number of important research tasks from multiple national ministries and commissions.

The company is one of the few domestic companies that has achieved mass production and supply of photolithography materials and precursor materials. According to Frost & Sullivan market research, in 2023, the company's SOC and BARC sales volume ranked first among domestic manufacturers in the domestic market .

In terms of performance, from 2022 to 2024, Hengkun New Materials achieved operating income of approximately RMB 322 million, RMB 368 million, and RMB 548 million, respectively; and achieved attributable net profit of approximately RMB 101 million, RMB 89.8493 million, and RMB 96.9192 million, respectively.

In the first half of 2025, Hengkun New Materials achieved operating income of approximately RMB 294 million, a year-on-year increase of 23.74%​

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sunnymaxi

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China's No.2 Ai chipmaker Cambricon's revenue reached RMB 2.881 billion, a YoY increase of 43 times.

Net profit reached 1.038 billion RMB, compared with a net loss of RMB 530 million in the same period last year, marking a clear turnaround to profitability.

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thanks to export control, they are creating another monster..
 

tokenanalyst

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Chengke Microelectronics has completed a new round of financing of over 100 million yuan and is a provider of high-speed optical communication DSP chips.​



Shanghai Chengke Microelectronics Technology Co., Ltd. ("Chengke Microelectronics") recently completed a new round of financing totaling over 100 million yuan. Participants in this round include Yongxin Ark, Shandong Caijin Venture Capital, Xingniu Capital, Walken Capital, and Lanshi Venture Capital.

According to public information, Chengke Microelectronics was founded in 2017 and has R&D centers in Shanghai Lingang and Caohejing. The company is a leading domestic supplier of high-speed optical module oDSP (Optical Digital Signal Processor) chips, holding 100% intellectual property rights for these high-speed optical module DSPs. Its founder, Wang Hun, has over 25 years of experience in high-speed SerDes integrated circuits and is a pioneer in international research.

The 50G PAM4 oDSP electronic chip developed by Orange Microelectronics utilizes proprietary pure digital CMOS DSP technology. It is the world's first fully integrated single-chip product to combine a PAM4 oDSP with a high-swing linear laser driver, capable of directly driving both EML and DML lasers. This chip series also supports both Gearbox and Retimer operating modes, offering low power consumption and a wide range of solutions, fully meeting the needs of 50G PAM4 optical modules across various spans.

According to Orange Micro's product plan, its 400G/800G PAM4 DSP chips are scheduled to enter mass production this year, and its 1.6T PAM4 DSP chips are currently in the development phase.

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tokenanalyst

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Silicon carbide companies released their semi-annual reports and disclosed the latest progress of their silicon carbide businesses, as follows:
  • Silan Microelectronics : Cumulative shipments of 20,000 main drive modules based on the second- generation SiC-MOSFET chip have been completed, and the 8-inch production line is expected to be put into operation by the end of the year.
  • Yangjie Technology: SiC MOS market share continues to increase, and both chip and module production lines have been put into production;
  • Saijing Technology: Developed its own 1200V/13mΩ SiC chip and acquired Hunan Hongan to complement its SiC business.
  • New Clean Energy: SiC MOSFET has achieved mass production and automotive-grade products are expected to be launched by the end of the year.

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tokenanalyst

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CoreShare Technology secures 100 million yuan in Series B+ funding, focusing on 12-inch wafer and advanced packaging manufacturing CIM systems​


Recently, Wuxi Xinxiang Information Technology Co., Ltd. (hereinafter referred to as "Xinxiang Technology"), a semiconductor CIM system developer, announced the launch of its B+ round of financing. It has currently received hundreds of millions of yuan in investment from institutions such as Wuxi Venture Capital, Wuxi High-tech Zone and Wuxi Zhanxin Fund, and will fully focus its strategic focus on the highest-value and highest-threshold 12-inch wafer and advanced packaging CIM market.

Public information shows that Xinxiang Technology is a full-stack IT solution service provider for semiconductor factories in China. It provides semiconductor factories with one-stop IT solutions including IT factory design, factory integration, production management, and long-term operations, and is committed to becoming a strategic partner for integrated production of semiconductor factories.

The CIM system is known as the "central nervous system" of semiconductor manufacturing, determining the life and death of a semiconductor factory with tens or even hundreds of billions of dollars in investment. The CIM system determines whether chips can be mass-produced efficiently, stably, and with high yield on the production line.

After eight years of dedicated research and development, CoreShare Technology has successfully launched a 12-inch advanced packaging CIM system. Simultaneously, some 12-inch wafer CIM projects are also progressing steadily. According to the plan, China's first complete 12-inch wafer and advanced packaging full-process CIM system is expected to be fully implemented by 2026. This means achieving full localization of CIM systems on China's highest-standard semiconductor production lines, and simultaneously achieving breakthroughs in two key technologies: 12-inch wafers and advanced packaging CIM.

CoreShare Technology, leveraging its long-term partnerships with over 20 domestic clients and actively expanding into markets such as Singapore, Malaysia, Europe, and Taiwan, has established a robust operational structure and continuously enhanced self-sustaining capabilities, generating stable and sufficient cash flow.

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