Chinese semiconductor thread II

[tokenanalyst]

Toujing Technology: Full order book, rising storage prices may drive manufacturers to continue expanding production.​

Toujing Technology reported strong Q3 2025 financial results, with revenue rising 124.15% year-on-year to 2.266 billion yuan and net profit up 225.07% to 462 million yuan. This growth is attributed to successful mass production launches of advanced semiconductor equipment for cutting-edge process nodes, along with improved economies of scale and reduced operating expenses.

The company has a full order book, driven by rising demand in the memory market and technological advancements beyond Moore’s Law. Key products—such as PECVD Stack (ONO), ACHM, PECVD Bianca, ALD SiCO, and others based on new platforms (PF-300TPlus/M) and reaction chambers (pX, Supra-D)—have passed customer certification and entered mass production.


Chairman Lu Guangquan emphasized that the industry is entering a post-Moore’s Law era, with innovations like gate-all-around (GAA) transistors, backside power delivery, high-K metal gates, and 3D integration driving demand for advanced equipment. The rapid growth of data has accelerated adoption of high-bandwidth memory (HBM) and multi-layer 3D NAND flash, increasing the need for thin-film deposition and bonding technologies.

Toujing is deepening its expertise in thin-film deposition (PECVD, ALD, HDPCVD, etc.) and 3D integration equipment, including wafer-to-wafer and chip-to-wafer hybrid bonding. The company has received repeat orders for hybrid bonding tools and successfully shipped next-generation high-speed, high-precision systems; chip-to-wafer bonding verification is ongoing. It also completed development of laser lift-off technology after permanent bonding.

With existing industrial bases in Shenyang and Lingang (Shanghai) supporting over 700 units/year production capacity, Topwin is constructing a second plant in Shenyang to further expand output—ensuring it can meet rising demand.

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[tokenanalyst]

Everyone talks about building power plants for AI datacenters but nobody talk about developing technology that lower energy usage.​

The gallium nitride power module developed by Jiufengshan Laboratory could save 300 million kilowatt-hours of electricity annually for ultra-large AI computing centers.​

The Jiufengshan Laboratory has developed a breakthrough gallium nitride (GaN) power module that could save 300 million kilowatt-hours of electricity annually in ultra-large AI computing centers—equivalent to about 240 million yuan in cost savings. Each module, no bigger than a fingernail, can be scaled up to one million per 1-gigawatt AI rack.

Currently, power modules consume 1 billion kWh/year (11% of total data center usage) by converting high-voltage electricity into low-voltage for processors. Replacing traditional silicon-based chips with GaN technology reduces energy use by 30%, shrinks module size by 30%, and cuts costs in half, offering a major leap in efficiency.

The lab, composed of seven PhDs, overcame nanoscale manufacturing challenges to build an end-to-end GaN supply chain—from material growth to packaging. Their innovation has already attracted commercial orders exceeding 10 million yuan and partnerships with domestic power suppliers.

With global data center electricity demand expected to double by 2030, driven by AI, the technology is timely. The team is now entering pilot testing, aiming for mass production within 3–5 years, targeting a market worth hundreds of billions of yuan.

The project also won recognition in China’s National Postdoctoral Innovation Competition and attracted strong investor interest. Led by Dr. Li Sichao, the lab aims to accelerate deployment, delivering high-efficiency power solutions critical for sustainable AI infrastructure.

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[tokenanalyst]

Goodjet Semiconductor's IGBT project will officially start production in January next year!​

Goodtech's IGBT heat dissipation device project plans to build two production lines, currently holding orders worth 200 million yuan, with production scheduled until March of next year. Equipment for the IGBT heat dissipation device project began arriving on site in February of this year, and the production line installation is currently 50% complete and in the commissioning phase. The project is scheduled to officially commence production in January of next year, with projected annual sales reaching 300 million yuan by 2026.

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[tokenanalyst]

Galaxycore: Shipments of high-pixel CMOS image sensors exceed 100 million units; high-pixel single-chip integration technology gains recognition.​

Galaxycore Technology has reported that shipments of its 32MP and 50MP CMOS image sensors have exceeded 100 million units this year, driving significant revenue growth in the mobile phone camera market. The company's high-pixel sensors offering pixel sizes of 0.61μm, 0.7μm, and 1.0μm are widely adopted in front and rear cameras of major smartphone brands.

A key highlight is Galaxycore’s 0.7-micron 50MP sensor based on its GalaxyCell® 2.0 process platform, which delivers superior performance through:​

• Enhanced dynamic range and image quality via DAG HDR technology (outputting 12-bit data)​
• Full 100% phase-detection autofocus (PDAF) density for faster, more accurate focusing​
• Ultra-low power consumption with Always On Low Power (AON) support, including ULP and ambient light detection modes​

The sensor has already been ordered by a leading international ODM, validating Galaxycore’s innovative single-chip high-pixel integration technology. This success reflects the effectiveness of its Fab-Lite model, enabling efficient mass production across multiple pixel specifications.

Looking ahead, Galaxycore plans to further optimize 32MP and 50MP sensors and launch next-generation products with over 100 million pixels, reinforcing its market leadership in high-performance CMOS image sensor solutions.

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[tokenanalyst]

Dynamic Image Blurring Analysis and Vibration Suppression in Reflective Lithography Projection Objective.​

Abstract​

Dynamic image degradation in reflective projection objectives limits sub-nanometer chip fabrication in high-numerical aperture (NA) extreme ultraviolet (EUV) lithography systems. Micro-vibrations induce optical misalignments via opto-mechanical coupling, causing spatial image blur. An opto-mechanical coupled model and a multi-parameter optimization method are proposed to evaluate the mirror position offset and reduce the vibration response. Based on the second Lagrange equations, a multi-body dynamics model considering the internal stiffness, damping and mass of the objective is established. The predicted mirror displacement errors along the X, Y and Z axes are 3.01%, 3.39% and 0.12% respectively. Hopkins’ partially coherent imaging theory and wavefront aberration transfer functions are used to develop a dynamic image blur evaluation model. On this basis, a hybrid genetic algorithm-particle swarm optimization (GA-PSO) method is proposed to optimize stiffness and damping parameters, reducing mirror displacement responses and spatial image pattern errors(PE) by over 36% and 40% respectively.​

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[Randomuser]

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surged by more than fivefold in Shanghai, as enthusiastic investors vied to get shares of the

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used in artificial intelligence, helping to mark the second-biggest trading debut in China’s stock market this year.

Moore’s shares began trading at 650 yuan amid a declining market, a 468 per cent jump from their

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(IPO) price of 114.28 yuan. China’s benchmark CSI300 Index slipped 0.1 per cent.

The surge in Moore reflects China’s prioritisation of technology self-sufficiency in a critical five-year plan that outlined the nation’s economic and social development goals through 2030. China is now engaged in a tit-for-tat competition with the US in the tech area from AI large-language models to sophisticated chips and robotics.

Moore raised 8 billion yuan (US$1.13 billion) in the second-largest IPO on the mainland this year. Proceeds from the IPO will finance its next-generation projects in AI and graphics chips and supplement working capital. The offering is only smaller than Huadian New Energy Group’s US$2.7 billion IPO in July.

Dubbed “China’s Nvidia”, Moore had a quick path to the capital market, getting the green light from the China Securities Regulatory Commission in October, a mere four months after its application, compared with the average processing time of about 470 days for last year’s applicants on the Shanghai Stock Exchange Science and Technology Innovation Board (STAR Market).

The company had significant backers. Liang Wenfeng, the founder of the large language model firm DeepSeek and the quantitative hedge fund HighFlyer, was listed as the top institutional investor, having invested 7 million yuan in Moore before its IPO, according to mainland media.

Moore was founded in 2020 by James Zhang Jianzhong, along with several former senior graphics processing unit (GPU) engineers from Nvidia. Zhang, who worked for 14 years at Nvidia, chairs Moore’s board.

In its early stages, the company’s GPU were primarily used for visual displays in games and other applications. Later, the company shifted its focus to AI accelerator chips designed for the inference and training of large language models.

The prospectus shows that in the first half of this year, Moore’s revenue reached about 70 million yuan, already exceeding its total revenue for the previous year, though the company remains unprofitable.

The company said it expected to achieve consolidated profitability as early as 2027. In comparison, Cambricon, which focuses on specialised AI chips, reported revenue of about 2.9 billion yuan in the first half of the year and is expected to record its first annual net profit since listing this year.

In 2023, the US government added Moore to its Entity List, a designation that restricted the Chinese company from gaining access to US technology and materials. In its IPO prospectus, Moore said that it had adjusted its supply chain strategy in response to geopolitical changes.

Moore’s dazzling debut in Shanghai was a stark contrast with Guangdong Tianyu Semiconductor, which fell 34 per cent to HK$38, from its IPO price of HK$58, during its trading debut in Hong Kong on the same day. Shares of Tianyu, the largest producer of silicon carbide epitaxial wafers, were 60 times overbought.

 

[tphuang]

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国产 CPU 厂商飞腾今日官宣，国产 CPU 首次在 5G 扩皮基站实现规模化应用。

飞腾腾云 S5000C-M 独家中标中国移动 5G 扩皮基站集采 8000 片，打破国外长期垄

Phytium cloud S5000C-M is the sole supplier for recent China mobile 5G expanded base station procurement, breaking foreign chip monopoly

 

[tphuang]

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Omnivision OV50R expects to enter mass production in Q1, this is flagship CIS I think.

 

[jli88]

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Omnivision OV50R expects to enter mass production in Q1, this is flagship CIS I think.

Omnivision was an acquired company. May I ask does it have all its essential facilities in China or still dependent on outside?

 

[tphuang]

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Gowin Semi/高云半导's software 云源软件V1.9.12 have received TUV certification ASIL-D. Now fully support its 22nm advanced FPGA product. Its 55nm, 22nm product can be used in auto electronics, industrial control and such.