Chinese semiconductor thread II

tokenanalyst

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CMOS image sensor chip company SmartSens: Net profit in the first half of the year is expected to increase by 180%​

Recently, SmartSens released its 2025 semi-annual performance forecast, expecting to achieve operating income of 3.6 billion to 3.9 billion yuan in the first half of the year, an increase of 1.143 billion to 1.443 billion yuan compared with the same period last year, an increase of 47% to 59% over the same period last year; it is expected to achieve a net profit attributable to shareholders of 360 million to 420 million yuan, an increase of 210 million to 270 million yuan compared with the same period last year, an increase of 140% to 180% over the same period last year.

In addition, it is expected that the net profit attributable to the owners of the parent company after deducting non-recurring gains and losses in the first half of 2025 will be between 358 million yuan and 418 million yuan, an increase of 206 million yuan to 266 million yuan compared with the same period last year, an increase of 135% to 174%.

Founded in 2017, SmartSens is a high-tech enterprise engaged in the research and development, design and sales of CMOS image sensor chip products. Headquartered in Shanghai, China, it has R&D centers in multiple cities and countries.

Since its establishment, SmartSens has always focused on the innovation and development of high-end imaging technology, and has been recognized and favored by many customers with its own performance advantages. As a company committed to providing CMOS image sensor products with multi-scenario applications and full performance coverage, the company's products have covered the full performance requirements of multi-scenario application fields such as security monitoring, machine vision, smart car electronics, and smart phones.​

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tokenanalyst

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Another domestic GPU unicorn launches IPO​

Hanbo Semiconductor (Shanghai) Co., Ltd. has obtained the registration for listing guidance and plans to IPO on the A-share market. The guidance institution is CITIC Securities.The company is a GPU chip provider, providing full-stack chip solutions for artificial intelligence core computing power, graphics rendering, and content generation.​

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The JINGHAISHAN series has achieved full support for SVAC3.0, further improving the localization of video encoding.​


SVAC3.0, China's independent security standard

The SVAC (Surveillance Video Audio Coding) standard, as my country's independently innovated security surveillance audio and video codec standard, has been developed to version 3.0. Compared with international standards such as H.264 and H.265, SVAC3.0 is specially optimized for security surveillance scenarios and has unique advantages in intelligent analysis, encryption security, and power consumption control.

Taking the 4K CrowdRun sequence as an example, SVAC3.0 and HEVC encoding are used respectively. The encoding compression efficiency of SVAC3.0 is 36% higher than that of HEVC. The RD curve is shown in the following figure:
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Weijing Technology has joined the SVAC Alliance, deeply integrated into the core standard ecosystem of the security monitoring industry, and actively participated in various standard technical discussions, proposal writing and revision work organized by the alliance. It is committed to contributing to key coding and decoding technologies, system architecture and testing and certification systems, and promoting the improvement of SVAC standards and industrial applications. Weijing Haishan VS839 already supports SVAC3.0 encoding, which can achieve encoding capabilities above 1080P@30fps, and directly output video streams that meet national standards, meeting the strict requirements for video data security in key areas.

Previously, the high-end security chip market has long been monopolized by international giants, and domestic chip companies often lag behind in supporting coding standards. This breakthrough is of great significance to promoting the localization of security equipment.

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Changdian Technology's traction inverter packaging and testing solution unlocks leaps in electric vehicle range and reliability​

Recently, traction inverters have become a hot topic in the market: traction inverters equipped with a new generation of chips have been successfully applied to new smart electric vehicles, and the next generation of electric vehicle traction inverter reference design has been released. The focus of market competition has also shifted from single performance to the triangular balance of "efficiency - cost - ecology " .

As the core component of battery current conversion in electric and hybrid vehicles, traction inverter plays an important role in current management, motor control and energy optimization, and supports the basic functions of vehicle driving. Relying on its rich experience in the field of automotive-grade chips and semiconductor device packaging and testing, Changdian Technology has built a full range of technical capabilities and production capacity for traction inverter chip packaging and testing, helping customers improve component system efficiency, create a modular architecture that meets functional safety certification standards, and ensure the long-term reliability of products.

Module deconstruction under complex functions

The main task of the traction inverter is to convert high-voltage direct current into three-phase alternating current to drive the motor, while recovering kinetic energy for regenerative braking and charging the battery. This system not only determines the power response, acceleration smoothness and braking control of the vehicle, but also directly affects the energy utilization efficiency of the vehicle.
According to the system composition, the traction inverter usually includes key modules such as gate driver, battery management system ( BMS ), inverter module ( Inverter Module ), microprocessor unit ( MCU ), current sensor, etc

Changdian Technology has built a comprehensive technical capability and production capacity foundation in the field of traction inverter chip packaging and testing, which can cover the packaging needs of various chips from MCU , drive, sensor, power module to BMS . The company has a wealth of automotive-grade packaging technologies, including TO series, QFP , SOP , DFN/QFN , BGA , Power Module , etc., and has achieved large-scale mass production and delivery of Grade 0/Grade 1 products to meet the stringent requirements of high-reliability automotive applications.
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In addition, it is difficult for a single semiconductor technology to achieve both high performance and cost-effectiveness, which has led to the hybrid drive solution of silicon carbide ( SiC ) and silicon ( Si ) becoming the mainstream trend in traction inverter design. The main drive part uses silicon carbide ( SiC ) devices to achieve efficient energy conversion at low loads; under high load conditions, the auxiliary drive silicon ( Si ) devices work together to complement each other with their excellent large current carrying capacity and cost advantages. Based on this, Changdian Technology takes into account the characteristics of different materials and devices in the design of the packaging system to ensure the coordinated optimization of the system in terms of thermal management, electrical performance and reliability.
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tphuang

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It is on their website.

Any news of licensors of the C930? Or when this will hit the consumer market?
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this came out 4 months ago, I haven't heard any RISC-V chips using them yet. Actually I don't even know who uses C920 at this point
 

henrik

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Nikkei certainly isn't a credible source when it comes to something as secretive as Chinese lithography. Chinese foundries don't have much reason to expedite their adoption of domestic DUV when they already have an excess of ASML scanners. There are also already fully domestic lines running.

So for these fully domestic lines, are they 28nm?
 
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