So for example, wechat or alipay want to build some apps for Harmony, how do they do it now?
Chinese semiconductor thread II
- Thread starter vincent
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So for example, wechat or alipay want to build some apps for Harmony, how do they do it now?
On Windows or a Mac. DevEco Studio is available for those. They just shipped the very first HarmonyOS powered computers just days ago so it was impossible for them to use a HOS computer for it anyway.
But there are pictures/videos of DevEco Studio running on HOS. If they didn't release it yet for HOS, may be it is not matured enough for their liking yet.
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@tokenanalyst I don't know if you have posted this before.
Development for Harmony OS is still very early. Great documentation already exists, but still not as robust as for other platforms in terms of GUI, which is to be expected for the time being. They put a lot of emphasis on multi formfactor convergence, really focusing on apps working equally well on mobile, tablet/laptop, and desktop size screens, but they still lack the kind of clear user interface guidance you would find on other environments. Most of the documentation that is present for developers is focused on ensuring that apps developed for different OS platforms are fully interoperable with each other, Android, iOS, Harmony OS, etc. Things like app development and debugging, signing, payment, and other aspects are all documented very well. But when it comes to things like standardized interfaces, I think they are still finding their place in the world. Here you can read documentation:
From the perspectives of developers who build Harmony OS apps, it is still a very small market share, over all, so globally most will probably develop primarily for iOS and Android, and treat Harmony as something nice to have just to squeeze in extra profit. That may change in the future if it is successful of course. One thing I am impressed with is that they are intentionally pushing different UI standards for east asian, middle eastern, and western user groups from the start. If you look at the history of other software development environments, that level of consideration usually happens much later down the road. You can take that as an indication of how seriously they take this, and that Huawei themselves have full conviction that the platform will succeed.
Xinju Energy's self-developed silicon carbide main drive chip has been successfully installed in the whole vehicle, setting a new benchmark for domestic automotive power semiconductors!
The Semiconductor Industry Network learned that recently, the large-scale production of modules equipped with Core Energy's independent silicon carbide main drive chip marked the company's completion of independent and large-scale production of the entire chain of "chip design-module manufacturing" in the field of automotive-grade power semiconductors.
Thanks to the cumulative delivery of more than 450,000 silicon carbide modules of Xinju Energy in the field of new energy vehicle main drive, Xinju Energy has accumulated rich chip screening and testing capabilities and complete process and quality control experience, providing a solid backing for the large-scale production of independent chips. This mass-produced module is equipped with SiC chips manufactured by Xinyue Energy, and has passed the automotive-grade verification of the entire industry chain from chips, modules, electric drive systems to complete vehicles, successfully obtained multiple main drive project orders and entered the large-scale delivery stage.
In the current competitive environment of the industry, this breakthrough has achieved independent control of key technologies and built a vehicle-grade guarantee system for silicon carbide power semiconductors; through technology integration, it continuously optimizes product performance, reliability and cost-effectiveness, providing competitive advantages for end customers. Xinju Energy will use this as a jumping-off point to deepen SiC technology innovation and provide high-reliability power semiconductor solutions for the global new energy industry.
The domestic wet process coating materials leader, Chuangzhi Xinlian, submitted an application for listing on the main board of the Hong Kong Stock Exchange!
On June 9, according to the Hong Kong Stock Exchange, Shenzhen Chuangzhi Xinlian Technology Co., Ltd. (hereinafter referred to as Chuangzhi Xinlian) submitted an application for listing on the main board of the Hong Kong Stock Exchange. Haitong International, CCB International and China Merchants Securities International are its joint sponsors.
According to the prospectus, Chuangzhi Xinlian is a provider of metallization interconnect coating materials and key process technologies, committed to promoting the development of the coating material supply chain in wafer-level and chip-level packaging, as well as PCB manufacturing. The company has developed a complete product matrix of chemical plating and electroplating materials, covering the application scenarios of wafer-level packaging, chip-level packaging and PCB manufacturing.
From 2022 to 2024, Chuangzhi Xinlian achieved revenues of approximately RMB 320 million, RMB 312 million, and RMB 410 million, respectively, and annual profits of RMB 27.328 million, RMB 19.421 million, and RMB 52.706 million, respectively, during the same period.
According to Frost & Sullivan, the company is the largest domestic wet process coating material provider in the Chinese market in terms of revenue in 2024, and is also the largest one-stop coating solution provider in the Chinese market. The company's revenue mainly comes from the coating material business and coating service business included in the one-stop service solution. Among them, the coating material business is the company's main business, generating revenue through the manufacture and sale of coating materials used in chemical plating and electroplating processes in the semiconductor and PCB industries. In 2024, the coating material business revenue was 330 million yuan, accounting for 80.2% of the total business revenue; the revenue from the coating service business was 81.09 million yuan, accounting for 19.8%.
It is understood that wet process coating materials are a typical wet electronic chemical, which refers to the chemical substances used to deposit a thin layer of metal or alloy on the surface in the wet process of semiconductor and PCB manufacturing. As one of the key materials for the transmission of electrical signals inside semiconductors and between semiconductors, packaging substrates and PCBs, wet process coating materials play a vital role in the mechanical connection, electrical connection and heat dissipation of electronic components (especially semiconductors).
Chuangzhi Xinlian's coating materials and services cover the two core coating processes in the field of electronic packaging used in the semiconductor and PCB industries: chemical plating and electroplating. Specifically, the main products include chemical nickel gold/chemical nickel palladium gold, electroplated copper and cyanide-free electroplated gold coating materials. When managing the coating service business division, the company provides customers with coating services for silicon wafers, silicon carbide wafers, packaging substrates, and PCBs, and charges service fees.
According to the Frost & Sullivan report, from 2022 to 2023, due to the short-term decline in demand in the semiconductor and PCB industries, the total market size of wet process coating materials will drop to RMB 38 billion in 2023. However, in 2024, driven by the rising demand in downstream industries, the global wet process coating materials market rebounded to RMB 40.7 billion. In the future, the global wet process coating materials market size is expected to reach RMB 73.7 billion in 2029, with a compound annual growth rate of 12.6% from 2024 to 2029.
Semiconductor equipment manufacturer Zhongke Instrument is sprinting for IPO on Beijing Stock Exchange
On June 11, the China Securities Regulatory Commission disclosed a report by China Merchants Securities Co., Ltd. on the completion of its guidance work for the public issuance of shares to unspecified qualified investors and listing of Chinese Academy of Sciences Shenyang Scientific Instrument Co., Ltd. (hereinafter referred to as China Scientific Instrument) on the Beijing Stock Exchange.
China Merchants Securities said that after guidance, the company believes that Zhongkeyi has the corporate governance structure, basic accounting work, and internal control system that a listed company should have, and fully understands the characteristics and attributes of various sectors in the multi-level capital market; Zhongkeyi and its directors, supervisors, senior management, shareholders holding more than 5% of the shares and actual controllers (or their legal representatives) have fully mastered the laws, regulations and rules on issuance and listing, standardized operations, and are aware of the responsibilities and obligations in terms of information disclosure and fulfillment of commitments, and have established a sense of integrity, self-discipline and the rule of law when entering the securities market.
It is reported that Zhongkeyi's IPO process has undergone several adjustments: on December 28, 2020, the company submitted its first application for listing on the Science and Technology Innovation Board to the Shanghai Stock Exchange and was accepted, but voluntarily withdrew its application in May 2021. In January 2023, the company restarted its listing plan, signed a guidance agreement on the Science and Technology Innovation Board with China Merchants Securities, and completed the filing with the Liaoning Securities Regulatory Bureau on January 17. The latest progress shows that based on business development strategy considerations, the company has changed the intended application board from the Science and Technology Innovation Board to the Beijing Stock Exchange in April 2025.
According to the information, the company is mainly engaged in the research and development, production and sales of dry vacuum pumps and vacuum equipment, and provides related technical services. Dry vacuum pumps are core auxiliary equipment for semiconductor manufacturing process equipment, providing the necessary highly clean vacuum environment for production equipment in industries such as integrated circuits, photovoltaics, LEDs, flat panel displays, and lithium batteries.
The company's vacuum instrument and equipment products mainly include three categories: large scientific equipment, vacuum thin film equipment, and new material preparation equipment. Among them, large scientific equipment refers to large scientific research equipment and facilities of major national scientific projects used for basic scientific research; vacuum thin film equipment mainly includes PVD and CVD equipment used for scientific research; new material preparation equipment mainly includes crystal material preparation equipment, vacuum metallurgical equipment, etc. At the same time, the company provides technical services such as equipment repair and maintenance for dry vacuum pumps and vacuum instruments and equipment.
The company's technical service business mainly provides repair and maintenance services for dry vacuum pumps and vacuum equipment to integrated circuit and photovoltaic product manufacturers and scientific research institutions. In order to be close to customers and respond quickly, the company has established two subsidiaries, Shanghai Shangkaiyi and Wuhan Shangkaiyi, in Shanghai and Wuhan respectively, specializing in the repair and maintenance of dry vacuum pumps of various brands and models.
Shanghai Shangkaiyi and Wuhan Shangkaiyi are currently qualified suppliers of integrated circuit manufacturers such as TSMC, SMIC, Yangtze Memory Technologies, and Dalian Intel. When integrated circuit manufacturers need to repair and maintain the dry vacuum pumps used in their production processes, they can directly sign business orders with Shanghai Shangkaiyi and Wuhan Shangkaiyi. Shanghai Shangkaiyi and Wuhan Shangkaiyi receive customer equipment and return the equipment to customers after completing repairs, component replacement, testing, etc.
Sukos Semiconductor successfully delivered the second batch of TGV electroplating equipment
Recently, the high-performance TGV electroplating equipment carefully built by Sukos Semiconductor for Triassic has successfully completed the factory acceptance and has been officially loaded and shipped. It will soon go to the production line of Triassic to provide strong support for the customer's mass production goals. This marks another important milestone for Sukos Semiconductor in the field of core process equipment in the fields of advanced packaging/semiconductors/MEMS/RF devices.
