Chinese semiconductor thread II
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Huawei operating at least 11 semiconductor fabs on DRAM and foundry
This source is a kind of a mixed bag, sometime is reliable sometime not so much. So take it with a grain of salt.
To note that these are all state-owned companies, so if Huawei is involved is as minority shareholder or even in hidden way, where fab management comes from HW and (of course) HW is customer of the fab, but there is no official link.
PXW is
This source is a kind of a mixed bag, sometime is reliable sometime not so much. So take it with a grain of salt.
To note that these are all state-owned companies, so if Huawei is involved is as minority shareholder or even in hidden way, where fab management comes from HW and (of course) HW is customer of the fab, but there is no official link.
PXW is
Yangzhou Wafer-Level Chip Advanced Packaging Base Project Put into Production
According to the official WeChat account of Jiangdu Economic Development Zone, on May 10, the production commissioning ceremony of the wafer-level chip advanced packaging base project was held in Jiangdu Economic Development Zone.
It is reported that the wafer-level chip advanced packaging base has been included in the provincial private capital key industrial projects in 2025, with a total investment of 1 billion yuan to build a production line for ultra-large wafer-level chip packaging products. After the project is put into production, it will provide high-performance chip packaging solutions for multiple fields such as consumer electronics and automotive electronics, and effectively promote the transformation and upgrading of Yangzhou's integrated circuit industry.
According to reports, Xinde Technology has been deeply involved in the field of high-end semiconductor packaging and testing for a long time and is a cutting-edge force in the field of advanced packaging. The wafer-level chip advanced packaging base project that has been put into production this time has a large investment volume, high technological content, and strong driving capacity. It is an important breakthrough in corporate innovation and industry development, and is of great significance to the development of Yangzhou's integrated circuit industry.
30 billion Huzhou Industrial Fund launched, focusing on semiconductors and other fields
On May 10, at the 2025 Huzhou Future Conference, Huzhou launched the Huzhou Industrial Fund with a total scale of 30 billion yuan.
It is reported that the total scale of Huzhou Industrial Fund is 30 billion yuan, and it adopts the "sub-fund + direct investment" model. The direct investment model strengthens the leadership of the chain leader, focusing on supporting the implementation of major leading projects with a total investment of more than 1 billion yuan, and focusing on semiconductors and optoelectronics, new energy vehicles and key components, #artificial intelligence, high-end equipment, low-altitude economy and other fields. The sub-fund model supports early investment, small investment, hard technology investment, and major scientific and technological innovation platforms, and the number of sub-funds established has reached 30.
In addition, a total of 106 projects were signed at the meeting with a total investment of 69.12 billion yuan, covering manufacturing industries such as new energy vehicles and key components, semiconductors and optoelectronics, biomedicine, high-end equipment, as well as talents, technology, modern services and agriculture.
Public information shows that Huzhou has gathered a group of high-quality enterprises covering all links of the semiconductor industry chain. For example, Jiemei Technology focuses on the research and development, production and sales of thin carriers for electronic components; Zhongjing Technology is deeply involved in the field of semiconductor silicon materials; Dongni Electronics is committed to the application research and development, production and sales of ultra-fine alloy wires and other metal-based composite materials. In addition, Hantianxia Electronics Co., Ltd. was the first in China to master the mass production technology of BAW filter chips, and its cumulative sales have exceeded 300 million; Martin Core Semiconductor (Zhejiang) Co., Ltd. has more than 60 patents and focuses on the research and development and production of semiconductor packaging equipment.
It is worth noting that since the second half of last year, several billion-yuan semiconductor projects have landed in Huzhou. On October 18 last year, an advanced semiconductor chip packaging and testing base and headquarters project with a total investment of 5.2 billion yuan landed in Huzhou Moganshan High-tech Zone. The project is invested by Shenzhen All-Core Micro Semiconductor Co., Ltd. and will build a new advanced semiconductor power device chip packaging and testing production line. After reaching full production, it is expected to achieve an annual main business income of approximately 5 billion yuan; in January this year, Huzhou Metalans Technology Co., Ltd. officially started production in the Semiconductor Industrial Park of Nan Taihu New District, and its planar super lens project will provide important support for related industries; in February this year, Jingzhou Yangtze River Delta TGV glass substrate semiconductor process equipment R&D and industrialization project, glass substrate PVD coating equipment R&D and production project signed and settled in Nanxun District. Both projects focus on the field of glass substrates, with a total investment of 1.5 billion yuan.
Huawei chip partner Xinkailai seeks $2.8 billion in financing
BEIJING/HONG KONG (Reuters) - China’s Xinkailai, a chip equipment maker with close ties to Huawei Technologies Co Ltd , is seeking $2.8 billion in first-round funding as the start-up seeks to expand its customer base and boost its industry influence, two sources familiar with the matter said.
Xinkailai was previously unknown, but as its product line layout and strategic ambitions have become increasingly clear, the company has become the most watched company in China's semiconductor industry this year.
Founded in 2021 and owned by the Shenzhen municipal government, Xinkailai is currently seen mainly as a Huawei supplier. But it aims to surpass North China Huachuang Group 002371.SZ and Advanced Micro Devices (AMEC) 688012.SS to become China's leading chip equipment maker, according to four sources with knowledge of its goals. (That is a tall task, given the industry preference for maturity)
Shenzhen’s municipal government is considering selling about 25 percent of a subsidiary of Xinkailai, valuing the company at 1.3 billion yuan ($11 billion), one of the sources said, adding that the financing could be completed in the coming weeks.
The source also said the subsidiary’s assets do not include Xinkailai’s lithography machine business. Reuters has not yet learned the name of the subsidiary.
Shanghai Xinyang: Currently built photoresist production capacity of 100 tons, KrF photoresist multiple products sold in batches
On May 13, Shanghai Xinyang stated on its investor interaction platform that the company currently has a photoresist production capacity of 100 tons, and in the next three years, it will transfer the 500 tons of production capacity originally planned to be built at the Hefei production base to the Shanghai Chemical Industry Zone production base.
According to the information disclosed by the company, the layout of Shanghai Xinyangguang photoresist production capacity has been clearly adjusted: the headquarters (Shanghai Songjiang) has an existing production capacity of 100 tons; the 500 tons of photoresist production capacity planned for the original Hefei base will no longer be built and will be transferred to the Shanghai Chemical Industry Zone. This means that in the next three years, the Shanghai Chemical Industry Zone will add 500 tons of photoresist production capacity and become the company's core production base for this business.
In addition, Shanghai Xinyang has continued to make breakthroughs in the field of photoresist technology. The company has achieved batch sales of multiple KrF photoresist products, and has also obtained sales orders for ArF immersion photoresists, and plans to further expand production capacity through a new base in Shanghai Chemical Industry Zone.
The production capacity adjustment is aimed at optimizing resource allocation and improving production efficiency by relying on the industrial chain and location advantages of Shanghai Chemical Industry Zone. The company said that the market demand for photoresists continues to grow, and the strategic layout adjustment will strengthen its competitiveness in the field of semiconductor materials.
Kemet Gas: Subsidiary's photolithography gas products have been certified as qualified suppliers by Japan's GIGAPHOTON
On May 14, Kemet Gas issued an announcement stating that the company's holding subsidiary Kemet Electronic Special Gases Co., Ltd. received a qualified supplier certification letter from Japan's GIGAPHOTON Co., Ltd. (hereinafter referred to as "GIGAPHOTON") on May 13, 2025. The photolithography gas products (Kr/Ne, Ar/Ne/Xe) produced by Kemet Electronic Special Gases Co., Ltd. have passed GIGAPHOTON's qualified supplier certification, and the certificate is valid until April 24, 2030.
Founded in 2000, GIGAPHOTON Co., Ltd. is a developer and manufacturer of excimer lasers for semiconductor lithography, excimer lasers for other purposes, and extreme ultraviolet lithography (EUV). GIGAPHOTON uses its original "laser technology" and "optical measurement technology" to provide high-performance, advanced lithography light sources for the semiconductor industry. As one of the world's leading manufacturers of exposure excimer lasers, GIGAPHOTON has not only won the favor of almost all semiconductor companies in the Asian market including Japan, but has also achieved rapid growth in the European and American markets.
Regarding the impact of this certification on the company, Kemet Gas said that the company's photolithography gas products (Kr/Ne, Ar/Ne/Xe) have passed GIGAPHOTON's qualified supplier certification, which is GIGAPHOTON's recognition of the company's production capacity and product quality in the field of photolithography gas production, and also reflects the company's advanced product production technology, cylinder inner wall treatment technology, gas analysis technology and other comprehensive strengths and competitive advantages. This certification will help the company improve its recognition and popularity in the field of photolithography gas, and will play a positive role in the company's expansion of photolithography gas product sales business.
Investment exceeds 1 billion yuan! This semiconductor equipment project is located in Shanghai.
It is reported that China Science and Technology Feiteng plans to invest more than 1 billion yuan to establish its second headquarters in Zhangjiang Science City , and build a more than 130,000 square meters Shanghai Zhangjiang R&D center and production base (Feiteng Scape) for integrated circuit testing equipment of China Science and Technology Feiteng. After the project is completed, it will serve as the most important strategic highland of China Science and Technology Feiteng in the next stage, focusing on the research and development and industrialization of key quantity testing equipment in the field of advanced processes, and comprehensively make up for the shortcomings of domestic high-end semiconductor quality control equipment in the field of advanced processes.
In April, the financial report released by China Science and Technology Feitek showed that the operating income in 2024 was 1.38 billion yuan, a year-on-year increase of 54.94%. The net loss attributable to shareholders of the listed company was 11.5251 million yuan, and the net profit in the same period last year was 140 million yuan, turning from profit to loss. The company plans not to distribute profits, pay cash dividends, issue bonus shares, or increase capital by capital reserve in 2024.
The main factors affecting the operating performance are that China Science and Technology Flight Test has achieved positive results in the breakthrough of core technologies, promotion of industrialization and iterative upgrading of various product series. The comprehensive competitive advantages in core technologies, customer resources, breadth and depth of product coverage have been further enhanced, and market recognition has continued to increase, which has driven the company's order scale and revenue scale to continue to grow.
China Ceramics Electronics: The company's precision ceramic parts have passed customer verification and have been used in domestic semiconductor equipment in batches
Recently, Zhongci Electronics said in an institutional survey that the company has continued to increase its R&D and investment in the field of precision ceramic parts, has developed aluminum oxide and aluminum nitride precision ceramic parts, established a precision ceramic parts manufacturing process platform, and developed ceramic heating plate products with core technical indicators that have reached the level of similar international products and passed user verification. It has been used in domestic semiconductor equipment in batches, and the sales revenue of precision ceramic parts has increased significantly year-on-year. The research and development of cooperation with domestic leading equipment manufacturers has made phased progress recently.
In the field of optical modules, the performance of the company's 400G/800G/1.6T electronic ceramic packaging shells and substrates has been benchmarked against overseas manufacturers, and its main customers include leading companies in optical communication devices. As the demand for AI computing power continues to grow, the share of this business is expected to further increase, and the growth rate is expected to remain at the industry-leading level in 2025-2026. In terms of the third-generation semiconductor business, the SiC chips of subsidiary Guolian Wanzhong have achieved zero batch quality accidents in the new energy vehicle market with their performance and quality advantages, and have gradually expanded to high-voltage fields such as rail transit and smart grids. GaN RF chips benefit from emerging scenarios such as overseas 5G construction and satellite communications, and have significant long-term growth potential.
Regarding the management change, the company said that the extension of the board of directors' change is progressing in an orderly manner, and the original team will continue to perform their duties until the process is completed. In terms of market value management, although the company has no equity incentive or repurchase plan, it will continue to study diversified incentive tools and proceed prudently in combination with strategic needs. In addition, the company's technical team has accelerated innovation through industry-university-research cooperation. Key technologies have been reserved for 6G communication-related RF chips and devices, and product verification is being promoted according to user needs.
Core Vision Microelectronics Completes C+ Round of Financing
Recently, Nanjing Core Vision Microelectronics Technology Co., Ltd. (referred to as "Core Vision Microelectronics") completed its C+ round of financing. The amount of financing was not disclosed. The institutions participating in the investment include China Reform Holdings and China Reform High-level Talent Fund.
Founded in 2018, Core Vision Microelectronics is a unicorn enterprise cultivated by Nanjing City, a high-tech enterprise in Jiangsu Province, a technology-based small and medium-sized enterprise, and a member of the Nanjing Integrated Circuit Industry Association. With three R&D centers in Nanjing, Shanghai, and Silicon Valley and a marketing center in Shenzhen, Core Vision is in a leading position in the implementation of single-photon direct ToF (SPAD dToF) technology and applications, and is one of the world's pioneers in researching single-photon dToF three-dimensional imaging technology. The company has chip-level photoelectric conversion device design and single-photon detection imaging technology, and mainly deals in one-dimensional and three-dimensional ToF sensor chips based on single-photon detection. Chip products are widely used in many consumer electronics fields such as sweepers, drones, and mobile phones, as well as applications such as AR/VR, smart homes, and autonomous driving lidar. The company's management team has brought together a group of senior technical experts at home and abroad with more than 15 years of experience in the industry.
Core Vision Microelectronics has completed the independent research and development of dozens of chips, including the two mainstream directions of 1D dToF and 3D dToF. 1D dToF products have been shipped to top mobile phone customers, creating a precedent in the domestic market; BSI 3D dToF chips have been successfully installed in another top brand flagship mobile phone, and Core Vision has become the first company in the world to realize the application of 3D dToF chips on Android phones. In addition, the company's automotive-grade products have launched VCSEL laser emission driver on-board chips and all-solid-state laser radar receiving chips, and have gradually entered the product verification stage.