Self-developed domestic formic acid reflux machine is in stable mass production and leading customers have verified its reliable quality.
Recently, another fully automatic formic acid reflow machine independently developed by Rabo Microelectronics has been successfully shipped. With its excellent performance, it has won quality praise and brand trust from leading customers in the advanced packaging industry.
At present, our company's fully automatic formic acid reflux machine has achieved large-scale stable mass production and has been successfully deployed and applied at customer sites, demonstrating strong market adaptability and technical maturity.
Compared with traditional flux reflow, the formic acid reflow process has low cost, no need to coat or clean flux, high production capacity, WPH ≥ 50, higher yield, no introduced impurities, and is more environmentally friendly.
The fully automatic formic acid reflow machine developed by Rabo Microelectronics is suitable for the formic acid reflow process of 12/8/6-inch wafers. The Pin & Chuck has an independent motion structure, and the recipe adjustment is more flexible. It is equipped with a fully automatic liquid replenishment and liquid supply system, and the process chamber has efficient sealing. There is also an automatic chamber opening mode, which makes maintenance operations safer and more convenient.
The equipment is mainly used for advanced packaging bump reflow, including C4/C2 bump, ubump reflow and FC welding processes, and is suitable for common solders such as pure tin, tin-silver and indium.

