antiterror13
Brigadier
The article says " ... reach Apple's M3"
Chinese semiconductor thread II
- Thread starter vincent
- Start date
The article says " ... reach Apple's M3"
KingSemi annual report is out. The only Chinese company making track equipment (resist coating/developing) for immersion litho. Like Piotech, it’s based in the city of Shenyang in the rust belt Northeastern region. Surprisingly, cities in the supposedly declining Northeast (Shenyang, Changchun & Harbin) are contributing hugely to the semicon tool industry.
Aerostatic bearing tech successfully developed!
Essential for precision machinery like wafer rotary table and grinding spindles. Also used in single-point Diamond Turning lathe, which is capable of machining ultraprecise optical parts like diffraction gratings and aspheric lens/mirrors.
Mainland China smartphone market picks up in Q1 2024, Huawei soars to regain lead -Canalys
The latest Canalys research shows the has finally seen a rebound after two years, with a Q1 2024 shipment of 67.7 million units. Significantly, Huawei returned to the top spot after 13 quarters, shipping 11.7 million smartphones and capturing a 17% market share, thanks to an enthusiastic market response to its Mate and nova series. OPPO rose to second place, driven by its Reno 11 series’ strong performance, shipping 10.9 million units. Conversely, following a strong Q4 last year, HONOR, vivo and Apple slowed their sell-ins this quarter, and ranked third, fourth and fifth respectively. HONOR was third with 10.6 million units, with a year-on-year increase of 9%. vivo ranked fourth with 10.3 million units and saw a year-on-year decrease of 9%. Apple declined the most among the top five, with 10.0 million units, a year-on-year decrease of 25%.
Canalys Senior Analyst Toby Zhu commented, "The mainland China market's growth is still behind the global recovery of 11%, which allowed Huawei to seize market share and reclaim the crown quickly. The production and supply shortage of the Mate 60 series improved in the first quarter, propelling it to become the key driver of Huawei's overall growth. In addition to the high-end lineup, Huawei released the nova 12 series in December, which features Harmony 4.0, expanding the Kirin chipset to more product lines and successfully boosting performance in the mid-range price band. This month Huawei also upgraded the P series to Pura 70, featuring an innovative pop-out camera lens, further sparking market interest. A key strategy for Huawei in 2024 is to focus on building AI capabilities for smart devices from hardware to software at a system level, leveraging its deep R&D capabilities in AI infrastructure and solutions for industry and enterprise customers. With the continued expansion of the HarmonyOS ecosystem, Huawei emerges as the third OS for smartphones and other edge computing devices, breaking the two-horse race of Android and iOS in Mainland China."
Canalys Research Manager Amber Liu added, "Despite Huawei's strong start, we maintain the modest recovery forecast for overall market performance in 2024 growing at 1%. The talking point within the industry surrounds intensifying competition and innovation moat building. Leading vendors are narrowing their market share, which means exploring growth opportunities in different channels is critical to capture short-term opportunities. Vendors' go-to-market capabilities in multi-channel management, price control, and inventory management will be tested."
"The Gen AI-capable smartphone presents important opportunities for Chinese vendors to differentiate in the high-end in 2024 to challenge Apple in their home market," said Canalys Research Analyst Lucas Zhong. "Canalys forecasts Gen AI-capable smartphones will reach 12% of shipments in 2024 in mainland China, ahead of the global average of 9%. Vendors are actively engaging consumers by developing interesting AI use cases and integrating AI features into their latest flagship launches with large marketing spends to educate consumers. In Q1, Xiaomi led in the Gen AI-capable smartphone market with its flagship 14 series, while HONOR explored its high-profile Magic 6 series with cross-device AI features with its MagicBook Pro 16. OPPO, on the other hand, pushed ahead with massive marketing investments on national TV channels, positioning its brand with AI features and innovation. We see an increasing divergence in Chinese vendors' R&D and AI product strategies this year, collectively driving further consumer awareness and adoption, which will feed into a sustainable monetization model."
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The latest Canalys research shows the has finally seen a rebound after two years, with a Q1 2024 shipment of 67.7 million units. Significantly, Huawei returned to the top spot after 13 quarters, shipping 11.7 million smartphones and capturing a 17% market share, thanks to an enthusiastic market response to its Mate and nova series. OPPO rose to second place, driven by its Reno 11 series’ strong performance, shipping 10.9 million units. Conversely, following a strong Q4 last year, HONOR, vivo and Apple slowed their sell-ins this quarter, and ranked third, fourth and fifth respectively. HONOR was third with 10.6 million units, with a year-on-year increase of 9%. vivo ranked fourth with 10.3 million units and saw a year-on-year decrease of 9%. Apple declined the most among the top five, with 10.0 million units, a year-on-year decrease of 25%.
Canalys Senior Analyst Toby Zhu commented, "The mainland China market's growth is still behind the global recovery of 11%, which allowed Huawei to seize market share and reclaim the crown quickly. The production and supply shortage of the Mate 60 series improved in the first quarter, propelling it to become the key driver of Huawei's overall growth. In addition to the high-end lineup, Huawei released the nova 12 series in December, which features Harmony 4.0, expanding the Kirin chipset to more product lines and successfully boosting performance in the mid-range price band. This month Huawei also upgraded the P series to Pura 70, featuring an innovative pop-out camera lens, further sparking market interest. A key strategy for Huawei in 2024 is to focus on building AI capabilities for smart devices from hardware to software at a system level, leveraging its deep R&D capabilities in AI infrastructure and solutions for industry and enterprise customers. With the continued expansion of the HarmonyOS ecosystem, Huawei emerges as the third OS for smartphones and other edge computing devices, breaking the two-horse race of Android and iOS in Mainland China."
Canalys Research Manager Amber Liu added, "Despite Huawei's strong start, we maintain the modest recovery forecast for overall market performance in 2024 growing at 1%. The talking point within the industry surrounds intensifying competition and innovation moat building. Leading vendors are narrowing their market share, which means exploring growth opportunities in different channels is critical to capture short-term opportunities. Vendors' go-to-market capabilities in multi-channel management, price control, and inventory management will be tested."
"The Gen AI-capable smartphone presents important opportunities for Chinese vendors to differentiate in the high-end in 2024 to challenge Apple in their home market," said Canalys Research Analyst Lucas Zhong. "Canalys forecasts Gen AI-capable smartphones will reach 12% of shipments in 2024 in mainland China, ahead of the global average of 9%. Vendors are actively engaging consumers by developing interesting AI use cases and integrating AI features into their latest flagship launches with large marketing spends to educate consumers. In Q1, Xiaomi led in the Gen AI-capable smartphone market with its flagship 14 series, while HONOR explored its high-profile Magic 6 series with cross-device AI features with its MagicBook Pro 16. OPPO, on the other hand, pushed ahead with massive marketing investments on national TV channels, positioning its brand with AI features and innovation. We see an increasing divergence in Chinese vendors' R&D and AI product strategies this year, collectively driving further consumer awareness and adoption, which will feed into a sustainable monetization model."
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Home-developed brain chip unveiled at forum
By GT staff reporters Published: Apr 25, 2024
(Not sure if this is the thrwad for this, though its about a brain chip)
A core brain chip, called "Neucyber" independently developed by Chinese scientists, is unveiled at the Zhongguancun (ZGC) Forum on April 25, 2024.
Implanted in the brain is a small, soft film connected by delicate threads. Through this, a monkey with its hands tied up can control a robotic arm with "just its thoughts" and grasp a strawberry.
This high performance of the brain-computer interfaces (BCI) technology revealed at the Zhongguancun (ZGC) Forum on Thursday is backed by a core brain chip, called "Neucyber," independently developed by Chinese scientists. Previously, Tesla CEO Elon Musk announced that his brain-chip startup Neuralink implanted a brain chip in a sick man.
The high performance is attributed to the three core components in Neucyber independently developed in China — high-throughput flexible microelectrodes, two high-speed neural signal acquisition devices and a generative neural decoding algorithm.
"The BCI involves capturing subtle changes in brain electrical signals, decoding brain intentions, and achieving 'thought' control of 'actions,' allowing the control of machines without physical contact," said Luo Minmin from the Chinese Institute for Brain Research.
The performance of BCI lies in the clarity of capturing brain electrical signals and the precision of their conversion, which rely on electrodes and algorithms, respectively.
The electrode acts as a "sensor," implanted in the brain to "read" brain electrical signals, with its performance determining the quantity and quality of captured brain signals.
Brain tissue is very soft and moves rhythmically with a person's heartbeat and breathing. In the past, the implantation of electrodes made of hard materials such as steel needles caused damage to brain tissue, triggering inflammatory reactions and leading to the encapsulation of the electrodes, which over time weakened the signals, says Li Yuan, Business Development Director of Beijing Xinzhida Neurotechnology, the company that developed this BCI brain chip system.
Implantable electrodes use flexible materials, greatly reducing damage to the brain and ensuring long-term stable signal acquisition. The flexible electrode has been stably implanted in the monkey's skull for nearly a year, and is still able to collect high-quality signals, according to Li.
The Neucyber is the first system in the world to realize the brain control interception of two-dimensional moving objects by rhesus monkeys through mind control. In the future, this could offer new hope for paralyzed people to be able to touch and grasp things in the physical world, Li noted.
Industry observers said the BCI technology is a systematic project that has higher requirement for stability and involving electrodes, chips, algorithms, software and materials. Key technologies are still needed to be further broken through.
Previously, China's prestigious Tsinghua University announced that Chinese scientists had made a breakthrough in the .
A team, led by principal Biomedical Engineering researcher Hong Bo from the School of Medicine with Tsinghua University, designed and developed the wireless minimally invasive implanted BCI technology device NEO (Neural Electronic Opportunity). The NEO was successfully implanted into a patient's brain for the BCI-assisted treatment trial at the Xuanwu Hospital in Beijing, on October 24, 2023.
Ctto
By GT staff reporters Published: Apr 25, 2024
(Not sure if this is the thrwad for this, though its about a brain chip)
A core brain chip, called "Neucyber" independently developed by Chinese scientists, is unveiled at the Zhongguancun (ZGC) Forum on April 25, 2024.
Implanted in the brain is a small, soft film connected by delicate threads. Through this, a monkey with its hands tied up can control a robotic arm with "just its thoughts" and grasp a strawberry.
This high performance of the brain-computer interfaces (BCI) technology revealed at the Zhongguancun (ZGC) Forum on Thursday is backed by a core brain chip, called "Neucyber," independently developed by Chinese scientists. Previously, Tesla CEO Elon Musk announced that his brain-chip startup Neuralink implanted a brain chip in a sick man.
The high performance is attributed to the three core components in Neucyber independently developed in China — high-throughput flexible microelectrodes, two high-speed neural signal acquisition devices and a generative neural decoding algorithm.
"The BCI involves capturing subtle changes in brain electrical signals, decoding brain intentions, and achieving 'thought' control of 'actions,' allowing the control of machines without physical contact," said Luo Minmin from the Chinese Institute for Brain Research.
The performance of BCI lies in the clarity of capturing brain electrical signals and the precision of their conversion, which rely on electrodes and algorithms, respectively.
The electrode acts as a "sensor," implanted in the brain to "read" brain electrical signals, with its performance determining the quantity and quality of captured brain signals.
Brain tissue is very soft and moves rhythmically with a person's heartbeat and breathing. In the past, the implantation of electrodes made of hard materials such as steel needles caused damage to brain tissue, triggering inflammatory reactions and leading to the encapsulation of the electrodes, which over time weakened the signals, says Li Yuan, Business Development Director of Beijing Xinzhida Neurotechnology, the company that developed this BCI brain chip system.
Implantable electrodes use flexible materials, greatly reducing damage to the brain and ensuring long-term stable signal acquisition. The flexible electrode has been stably implanted in the monkey's skull for nearly a year, and is still able to collect high-quality signals, according to Li.
The Neucyber is the first system in the world to realize the brain control interception of two-dimensional moving objects by rhesus monkeys through mind control. In the future, this could offer new hope for paralyzed people to be able to touch and grasp things in the physical world, Li noted.
Industry observers said the BCI technology is a systematic project that has higher requirement for stability and involving electrodes, chips, algorithms, software and materials. Key technologies are still needed to be further broken through.
Previously, China's prestigious Tsinghua University announced that Chinese scientists had made a breakthrough in the .
A team, led by principal Biomedical Engineering researcher Hong Bo from the School of Medicine with Tsinghua University, designed and developed the wireless minimally invasive implanted BCI technology device NEO (Neural Electronic Opportunity). The NEO was successfully implanted into a patient's brain for the BCI-assisted treatment trial at the Xuanwu Hospital in Beijing, on October 24, 2023.
Ctto
BYD continuing to expand its chipmaking facilities. In Q1, its Yangzhou fab made 480m RMB, almost half of full year revenue in 2023
Right now, they have 6 lines producing DM 4.0 IGBTs, enough for 1 million PHEVs per year.
This fab is moving on to DM 5.0 IGBTs as BYD upgrades to new DM motors
Yangzhou area is capable of producing wafers, chip production, packaging and testing and more
Expansion of domestic silicon carbide substrate production with annual output of 400,000 pieces.
The market demand for silicon carbide is increasing, driven by applications such as electric vehicles, renewable energy and industrial automation. Among the main costs of silicon carbide, the cost of the substrate link is greater than the epitaxial link and preparation link. From a cost and market perspective, if the cost of silicon carbide substrates is reduced by 40%, the size of the silicon carbide market will increase by four times. From the supply and demand side, global substrate demand will exceed 300W wafers in 2025, while global silicon carbide substrate production capacity in 2022 will be only 600,000 to 800,000 wafers, with a production capacity gap of about 5 times. Domestic and foreign companies are focusing on Expansion of production.
Recently, Jiangxi Gangfeng Technology Co., Ltd. announced the relevant contents of its third-generation semiconductor substrate epitaxial construction project (Phase I) with an annual output of 400,000 pieces. The main construction content of the project includes the construction of silicon carbide semiconductor substrate production lines and related Improvement of supporting factory facilities. The first phase of the project is expected to have an annual production capacity of 400,000 pieces of third-generation semiconductor substrate epitaxy after completion.
Precision tooling for lithography machines optics components.
I am really trying to figure out how upstream this is in the supply chain. Chip -> fab equipment -> fab equipment part -> machinery that makes the part -> part for the machinery that makes the part... It is removed by 4 layers. I don't think it can be specifically considered a semiconductor industry item by this point. I looked at it and it has many other applications, most being high-tech industries.
On this thread, I once wrote that the semiconductor localization drive would lead to advancements in everything high-tech in China. This is a good example.