Chinese semiconductor thread II

[tokenanalyst]

Mingtai Microelectronics Advanced Packaging and Testing Project Tops Out with 500 Million Yuan Investment​

On July 17, 2026, Sichuan Mingtai Microelectronics announced that the main structure of its Phase II advanced packaging and testing production project has been successfully topped out. This milestone marks a significant breakthrough in the company’s strategy to expand capacity and upgrade technology, injecting new momentum into the integrated circuit (IC) industry cluster in Neijiang, Sichuan.

The project involves a total investment of 500 million yuan (~$70 million USD), covers an area of 25 mu (approx. 1.67 hectares), and has a total construction area of 45,000 square meters. It is a key regional initiative aimed at strengthening high-end IC packaging and testing capabilities. Upon completion, the facility will feature high-standard cleanrooms and introduce advanced equipment, including fully automated packaging lines and high-precision intelligent testing devices. This will significantly enhance production accuracy, efficiency, and competitiveness in the high-end chip market.

Construction began in November 2025. The project is scheduled for full completion and delivery by February 2027. Once operational, the project will add an annual capacity of over 10 billion high-end IC packages, helping to fill the regional gap in advanced packaging capacity. It is expected to generate an annual output value exceeding 1.5 billion yuan and create more than 2,000 local jobs, further strengthening the regional semiconductor supply chain and talent pool.

Mingtai Microelectronics is a national high-tech enterprise engaged in the packaging and testing of integrated circuits and discrete devices . It is currently the largest independent third-party packaging and testing service provider in the Chengdu-Chongqing economic circle. Its main business is the packaging, testing, and sales of integrated circuits and power devices, and it is the largest independent third-party foundry in Southwest China. The company's existing packaging products mainly include DIP series, SOP series, TO series, SOT series, QFN/DFN, LQFP, LGA, PDF

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[tokenanalyst]

Shenggong Co., Ltd. invested 1.13 billion yuan to build silicon component and other projects.​

Jinzhou Shenggong Semiconductor Co., Ltd. (stock code: 688233, stock abbreviation: Shenggong) issued an announcement stating that it plans to invest a total of approximately RMB 1,129,921,400 (subject to actual investment) to construct a new silicon component R&D and supporting silicon material capacity expansion project, a key integrated circuit manufacturing material R&D and industrialization project, and a new packaging and micro-nano optoelectronic silicon material R&D and industrialization project. Specifically, the planned investment for the "New Silicon Component R&D and Supporting Silicon Material Capacity Expansion Project" is RMB 586,498,000; the planned investment for the "Key Integrated Circuit Manufacturing Material R&D and Industrialization Project" is RMB 325,626,300; and the planned investment for the "Packaging and Micro-nano Optoelectronic Silicon Material R&D and Industrialization Project" is RMB 217,797,100. The above project amounts are estimated values under the current plan. Shenggong will invest in stages as needed based on project progress, market environment, and financial situation. The specific investment scale and implementation pace will be dynamically adjusted according to actual circumstances, and the final amount will be based on the actual amount incurred.

The semiconductor industry is rapidly evolving, with demand for silicon-based materials in packaging and micro-nano optoelectronics continuously expanding, creating vast potential for domestic substitution of high-end silicon components. Shenggong Technology's core business currently focuses on large-diameter silicon materials and silicon components, with products primarily used by silicon component equipment manufacturers, downstream semiconductor etching equipment manufacturers, and terminal memory chip manufacturers.




Shenggong Technology's existing production capacity and product range are insufficient to fully cover the diversified and high-end procurement needs of downstream customers, resulting in shortcomings in capacity supply and new product development capabilities. The simultaneous deployment of these three projects will complement and improve Shenggong Technology's comprehensive integrated circuit material product matrix, allowing it to seize opportunities in the domestic substitution industry, enhance its self-sufficiency in high-end semiconductor materials, consolidate its market share, and support the company's long-term strategic development. Shenggong Technology has been deeply involved in silicon components for many years, possessing a mature R&D team, stable downstream customer resources, and mature production processes, with accumulated technical expertise in new material R&D and large-scale mass production. The project sites are primarily located in Jinzhou, a region with a well-developed semiconductor industry and strong policy support; funding comes from its own capital and self-raised funds, with readily available financing channels. Each project is being constructed in phases and stages, with short-term and long-term production capacity being released in an orderly manner. The R&D and production line construction plans have been fully demonstrated, and the technology, site, funding, and market conditions are all in place for implementation, making the projects highly feasible.​

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