Chinese semiconductor thread II
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SiliconCool Technology Secures Hundreds of Millions in Strategic Financing to Accelerate Domestic Semiconductor Equipment Breakthroughs
Zhuhai Silicon Cool Technology Co., Ltd. (“SiliconCool”), a national “specialized and innovative little giant” enterprise specializing in high-precision semiconductor packaging and bonding equipment, has successfully closed a strategic financing round totaling hundreds of millions of yuan.
The round was led by Anxin Investment, with participation from Xinlian Capital, Huatai Zijin, SDIC Venture Capital, and Zhongwei Capital signaling strong market confidence in SiliconCool’s technology and growth trajectory.
Founded in December 2018, SiliconCool has broken foreign monopolies in high-precision bonding equipment through its deep engineering expertise and iterative R&D strategy. The company now offers a diversified product matrix across three key sectors:
Power Semiconductors: A domestic leader in SiC/IGBT bonding equipment, with over 200 units shipped to date.
Optical Communication: Meeting the rising precision demands of next-gen 1.6T optical modules fueled by AI compute growth already adopted by leading module manufacturers.
Advanced Packaging: Recently launched products are poised to become a new growth engine, driving value leap for the company.
SiliconCool is a key supplier of power module placement machines to ChipLink Integrated a top-tier new energy chip and system foundry. ChipLink Capital’s participation in this funding round underscores the deepening synergy between the two firms. Their collaboration aims to accelerate the domestic substitution of critical semiconductor equipment and build a self-reliant, controllable supply chain.
Zhuhai Silicon Cool Technology Co., Ltd. (“SiliconCool”), a national “specialized and innovative little giant” enterprise specializing in high-precision semiconductor packaging and bonding equipment, has successfully closed a strategic financing round totaling hundreds of millions of yuan.
The round was led by Anxin Investment, with participation from Xinlian Capital, Huatai Zijin, SDIC Venture Capital, and Zhongwei Capital signaling strong market confidence in SiliconCool’s technology and growth trajectory.
Founded in December 2018, SiliconCool has broken foreign monopolies in high-precision bonding equipment through its deep engineering expertise and iterative R&D strategy. The company now offers a diversified product matrix across three key sectors:
Power Semiconductors: A domestic leader in SiC/IGBT bonding equipment, with over 200 units shipped to date.
Optical Communication: Meeting the rising precision demands of next-gen 1.6T optical modules fueled by AI compute growth already adopted by leading module manufacturers.
Advanced Packaging: Recently launched products are poised to become a new growth engine, driving value leap for the company.
SiliconCool is a key supplier of power module placement machines to ChipLink Integrated a top-tier new energy chip and system foundry. ChipLink Capital’s participation in this funding round underscores the deepening synergy between the two firms. Their collaboration aims to accelerate the domestic substitution of critical semiconductor equipment and build a self-reliant, controllable supply chain.
Dezhi Matrix Secures Nearly 100 Million Yuan in Series A/A+ Funding to Accelerate AI-Driven Semiconductor Testing & Industrial AI R&D
Beijing Dezhi Matrix Technology Co., Ltd. (“Dezhi Matrix”) has successfully closed its Series A and A+ financing rounds, raising nearly 100 million RMB in total. The round was led by Yuanhe Houwang Innovation Growth Fund, with participation from institutions including the Suzhou High-tech Zone.
The newly secured capital will fuel Dezhi Matrix’s aggressive R&D expansion in artificial intelligence for industrial applications, particularly focusing on:
Beijing Dezhi Matrix Technology Co., Ltd. (“Dezhi Matrix”) has successfully closed its Series A and A+ financing rounds, raising nearly 100 million RMB in total. The round was led by Yuanhe Houwang Innovation Growth Fund, with participation from institutions including the Suzhou High-tech Zone.
The newly secured capital will fuel Dezhi Matrix’s aggressive R&D expansion in artificial intelligence for industrial applications, particularly focusing on:
- Scaling the deployment of AI industrial models in real-world manufacturing environments;
- Enhancing algorithmic adaptability and generalization in complex production settings;
- Accelerating development and iteration of next-generation semiconductor testing products to meet rising demand from high-end manufacturing sectors.
Founded with the mission to “empower intelligent manufacturing with AI,” Dezhi Matrix specializes in AI-powered solutions for high-value industries including PCBA, PCB, semiconductors, and new energy. It stands out as one of the few companies in China capable of independently developing both AI-based review software systems and AI optical inspection hardware.
With a total investment exceeding 1.5 billion yuan, two semiconductor projects in Zhangjiagang have made key progress.
According to Zhangjiagang News, on the morning of January 5th, a project commissioning and signing ceremony was held in the High-tech Zone (Tangqiao Town), demonstrating the vigorous spirit of "striving hard from the start and aiming for the top." Among the projects, Corecore Semiconductor Technology (Jiangsu) Co., Ltd. was completed and put into operation, with a total investment of 500 million yuan, to build a semiconductor heating plate R&D and production base; the Lichuan (Suzhou) Semiconductor Equipment R&D and Production Base project was signed, with a total investment of 1.05 billion yuan. The first phase will produce fully automated probe stations, wafer grinding equipment, etc., and is expected to achieve an annual output value of over 1 billion yuan after full production. Statistics show that the city's characteristic semiconductor industry has now gathered more than 230 related enterprises in the industrial chain, with an output value exceeding 10 billion yuan.
Halogenated Metal-Organic Clusters for High-Resolution Extreme Ultraviolet Lithography Resists
The relentless drive toward miniaturization in the semiconductor industry demands photoresists capable of patterning sub-20 nm features for next-generation extreme ultraviolet (EUV) lithography. Metal-oxo clusters, with sub-5 nm molecular dimensions, structural tunability, and high EUV absorption via metal centers, have emerged as promising EUV photoresist candidates. Advancing next-generation photoresist materials necessitates resolving the inherent trade-offs between sensitivity, resolution, and line-edge roughness. In this work, we report a series of halogenated metal-organic clusters based EUVL photoresists, aiming to modulate the sensitivity, resolution, and line-edge roughness. Here, we report the synthesis of halogenated metal-organic clusters as EUVL photoresists, designed to modulate the resolution-line edge roughness-sensitivity trade-off. Sub-20 nm critical dimensions and line edge roughness below 2 nm were achieved with the clusters by EUVL. The results demonstrated that halogen elements influenced the sensitivity of the clusters. To unravel the EUV-driven reaction pathways, we analyzed the chemical transformations in these clusters after exposure using X-ray photoelectron spectroscopy and Fourier-transform infrared spectroscopy. These findings pave the way for the rational design of high-performance EUV photoresists.
A 244 million yuan high-purity gallium project was signed and landed in Lüliang.
On December 31, 2025, the Lüliang Economic and Technological Development Zone and Shenzhen Xihang Semiconductor Co., Ltd. signed an agreement for the Lüliang High-Purity Gallium and Downstream Compound Semiconductor Materials Industrial Base Project. The project plans to build an industrial base for ultra-high-purity gallium (7N and above) and downstream compound semiconductor materials, with an annual production capacity of 200 tons and a total investment of approximately 244 million yuan. It aims to construct a complete industrial chain from crude gallium purification to single-crystal preparation, providing key basic materials for high-end fields such as domestic semiconductor chips and third-generation semiconductor devices.
The project will be implemented in two phases. The first phase will focus on the purification process and capacity construction of high-purity gallium of 7N and above. The second phase will initiate the comprehensive utilization of red mud to extract rare metals such as gallium, scandium, and antimony, realizing resource recycling and industrial extension. After the project is put into operation, it is expected to generate an annual output value of over 1 billion yuan and annual profits and taxes of over 100 million yuan.
Chongyang County's first chip and semiconductor company has started construction and is aiming to start production within 90 days!
Chongyang County, Hubei, has welcomed its first chip and semiconductor company Hubei Anxinda Semiconductor Co., Ltd. which officially broke ground on January 4, 2024, in the Chongyang County Economic Development Zone. The project is set to achieve full production within just 90 days, marking an unprecedented speed in the county’s industrial development history and a major breakthrough in its strategic push into emerging technologies.
A national high-tech enterprise and leader in industrial and automotive-grade solid-state storage, Anxinda brings full-chain capabilities from R&D and wafer testing to packaging and CNAS-accredited reliability testing. The company holds over 100 patents, controls Guangdong Hongtu Chip, and supplies high-performance products like the “Tian Shu Xing” PCIe SSDs (3000MB/s speeds, -40℃ to 85℃ operational range), certified for automotive (IATF16949), medical, military, and data center use.
Anxinda is a key player in China’s “domestic substitution” initiative, with deep ties to Huawei, ZTE, and other tech giants. The project will initially employ 150 people, with plans to scale and attract high-end talent. Once fully operational, it is projected to generate annual output value of 600–800 million RMB, catalyzing an industrial cluster of upstream/downstream suppliers and filling a critical gap in Xianning’s semiconductor ecosystem.
Backed by local government support under provincial “three focuses and one optimization” policy, the project exemplifies rapid execution and technological advancement positioning Chongyang County as a new hub for China’s independent, controllable memory chip development.
A national high-tech enterprise and leader in industrial and automotive-grade solid-state storage, Anxinda brings full-chain capabilities from R&D and wafer testing to packaging and CNAS-accredited reliability testing. The company holds over 100 patents, controls Guangdong Hongtu Chip, and supplies high-performance products like the “Tian Shu Xing” PCIe SSDs (3000MB/s speeds, -40℃ to 85℃ operational range), certified for automotive (IATF16949), medical, military, and data center use.
Anxinda is a key player in China’s “domestic substitution” initiative, with deep ties to Huawei, ZTE, and other tech giants. The project will initially employ 150 people, with plans to scale and attract high-end talent. Once fully operational, it is projected to generate annual output value of 600–800 million RMB, catalyzing an industrial cluster of upstream/downstream suppliers and filling a critical gap in Xianning’s semiconductor ecosystem.
Backed by local government support under provincial “three focuses and one optimization” policy, the project exemplifies rapid execution and technological advancement positioning Chongyang County as a new hub for China’s independent, controllable memory chip development.
They also just started production on their 8-inch SiC fab. Also 2 phases planned. Silan is pretty good with expansion here.