Chinese semiconductor thread II

pbd456

Junior Member
Registered Member
Or rather, China currently still lacks true leaderships in many sectors. Leaders with bold and strategic visions that enable them to form and lead globally competitive corporations. Yes, it is good that China have the like of BYD and Huawei but there should be many more of them in many other sectors.

Like, China should have its own globalized Walmart, Costco, IKEA, etc. After all, most of their products are made in China and these corporations are reaping the most profit.

Where is China's globalized hotel chain like Hilton, Sheraton, Marriott, etc?

Where are China's globalized fashion/luxury clothing, shoes, makeups, .. brands?

etc


There is no reasons why China can't create these globalized corporations now. China have the scientific and R&D knowledge, productions, financial supports, etc. China just need some true leaderships to harness and unify all these together to make really competitive corporations. Instead, China now have way too many mom and pop store/company #1, #2, #3, #metoo9, #Iamcopyof2&3 s.
For hotel chains, it won't happen because US wont allow. usa forced the divestment of Radisson usa operations due to security concern (chinese government has the information of americans hotel stays!)
 

JPaladin32

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Registered Member
Not really. SMIC N+3 isn't 5nm class yet

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The Kirin 9030 is manufactured using SMIC’s N+3 process, a scaled extension of its previous 7nm (N+2) node. However, in absolute terms, N+3 remains substantially less scaled than industry 5nm processes from TSMC and Samsung. While SMIC has executed notable innovations in DUV-based patterning and DTCO techniques, the process is expected to face significant yield challenges, particularly due to aggressively scaled metal pitch using DUV multi-patterning.
If you call Samsung 5LPE 5nm, then N+3 is also 5nm.
 

swcc

New Member
Registered Member
If you call Samsung 5LPE 5nm, then N+3 is also 5nm.
Funny how anyone and everyone unequivocally say that 5LPE is 5nm(see Snapdragon 888(the horrible thermal issues)) but will do everything to say that SMIC N+3 which has a higher density than 5LPE is NOT 5nm. Compared to the 888 with huge thermal issues, the 9030 pro has stellar performance equal to 8 gen 3 gpu and cpu, while having amazing thermal control, we'll see the smic n+3 is not 5nm narrative going forward tho
 

antiterror13

Brigadier
There is only two ASML DUVi machines that can be used in that node and a both were sold to SMIC before the "October Surprise": the NXT:2000i and the NXT:2050i. According to Mega Stooge Alan Estevez those machines were supposed to be inoperable by now because the lack of mantinience. So you can make your deductions from there.

How many NXT:2000i and the NXT:2050i SMIC have ? is there any other company outside SMIC have those ?
 

latenlazy

Brigadier
Funny how anyone and everyone unequivocally say that 5LPE is 5nm(see Snapdragon 888(the horrible thermal issues)) but will do everything to say that SMIC N+3 which has a higher density than 5LPE is NOT 5nm. Compared to the 888 with huge thermal issues, the 9030 pro has stellar performance equal to 8 gen 3 gpu and cpu, while having amazing thermal control, we'll see the smic n+3 is not 5nm narrative going forward tho
Seems like they might have sacrificed on yield for a more aggressive design which if that’s the case good on them. They’re probably primed to take a big leap with even provisional introduction of EUV steps on the margins if that’s what they’ve managed with the 9030.
 

swcc

New Member
Registered Member
Seems like they might have sacrificed on yield for a more aggressive design which if that’s the case good on them. They’re probably primed to take a big leap with even provisional introduction of EUV steps on the margins if that’s what they’ve managed with the 9030.
N+2 is at the very least 90% yield now, just see the number of products it's used in and how many they've shipped(yet bloomberg say cambricon's 590 and 690 is only 20% yield), N+3 6 months ago was 50% probably, i'd say the process as of now is 65-70% yield, should break 80% soon
 

latenlazy

Brigadier
N+2 is at the very least 90% yield now, just see the number of products it's used in and how many they've shipped(yet bloomberg say cambricon's 590 and 690 is only 20% yield), N+3 6 months ago was 50% probably, i'd say the process as of now is 65-70% yield, should break 80% soon
I’m doubtful N+3 yield is more than 50% given Huawei’s release strategy for the 9030. I think people should keep their expectations modest. If they tried to speed run N+3 last year and fell short, and then still had to take such an aggressive binning approach to the release so late this year, that probably means they’ve been struggling to produce enough chips all year. There might be some very difficult to overcome constraints depending on DUVi to fab at 5 nm for volume production.
 

broadsword

Brigadier
Don't forget this breakthrough that cuts chip defects by 99%.

Chinese Researchers Make Breakthrough in Reducing Chip Manufacturing Defects
Zheng Xutong
DATE: Oct 28 2025
SOURCE: Yicai

(Yicai) Oct. 28 -- A research team led by Peng Hailin, a professor at Peking University's College of Chemistry and Molecular Engineering, has managed to reduce pattern defects in chip lithography by using cryo-electron tomography, a method normally used in structural biology.

The team used cryo-ET to reconstruct polymer in a liquid film for fab-compatible lithography, reducing the polymer residues of developed patterns on 12-inch wafers by 99 percent, according to findings published in scientific journal Nature on Sept. 30.
Lithography is a key process in semiconductor manufacturing that uses light irradiation to change the solubility of photoresist and then uses developer to dissolve the exposed photoresist to create designed circuit patterns on a silicon wafer.
The new method can be immediately applied in semiconductor manufacturing due to the technology being compatible with existing equipment, Peng told Yicai. Feedback from the industry is necessary for further improvements and for the team to find future study directions, he pointed out.

Liquid film serves as the critical medium for the dissolution of photoresist to create nanoscale circuit patterns in lithography, the team said in the study. However, the microscopic behaviors of photoresist in liquid film and at interfaces remain elusive despite decades of research, leading to industrial effort for pattern defect control being largely a trial-and-error, they noted, adding that the main bottleneck is the absence of a suitable high-resolution imaging technique.

To address this challenge, the team developed the cryo-ET method to reveal the photoresist behaviors in liquid films. Compared with conventional methods, such analysis can reconstruct the three-dimensional structures and interfacial distributions of photoresist polymers at high resolution while maintaining the native structures of polymer-based photoresist in liquid films during imaging and resolving polymer entanglements of photoresist molecules.

The global semiconductor photoresist market topped USD2.7 billion last year and will likely reach USD4.5 billion by 2031, according to QY Research. Leading companies are primarily based in Japan, the United States, and South Korea, including Tokyo Ohka Kogyo, JSR, and Shin-Etsu Chemical, while Chinese firms have broken into the sector with mid to low-end products.

Although China faces restrictions on importing advanced lithography machines, it is still necessary for domestic companies to develop high-end products such as extreme ultraviolet photoresist to catch up with international peers, Peng noted.
 

swcc

New Member
Registered Member
If you call Samsung 5LPE 5nm, then N+3 is also 5nm.
Techinsights did,
Qualcomm SM8350 Snapdragon 888 Samsung 5 nm LPE CPU (X1) SoC Design Analysis
This report provides a SoC Design Analysis of the Qualcomm SM8350 Snapdragon 888 application processor, built on Samsung's 5 nm LPE finFET process
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, But they're saying N+3 is not true 5nm
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Classic fascist bullshit, rightfully sanctioned
 
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