Hongri Technology: Plans to establish a holding subsidiary to operate semiconductor packaging lead frame business
Hong Rida Co., Ltd. recently announced that it plans to jointly invest with Fujian Tedu Technology Co., Ltd. and Shanghai Hongke Tongchuang Enterprise Management Partnership (Limited Partnership) to establish a new holding subsidiary, Hongke Semiconductor (Dongtai) Co., Ltd. (tentative name, subject to final approval by the local registration authority).
The subsidiary will focus on the R&D, design, manufacturing, and sales of semiconductor packaging lead frames. Hongri Da invested RMB 90 million, representing a 60% stake. Fujian Tedu Technology Co., Ltd. and Shanghai Hongke Tongchuang Enterprise Management Partnership (Limited Partnership) each invested RMB 30 million, representing a 20% stake.
Hongri Da was founded in 2003 and focuses on connectors as its core product, supplemented by precision mechanical components. It is also actively developing new businesses such as semiconductor heat dissipation and 3D printing.
This move marks a further expansion of Hongri Technology's presence in the semiconductor industry, aiming to enhance its market competitiveness and technological strength in this field. According to financial data for the first three quarters of 2025, Hongri Technology's revenue was 693 million yuan, with a net loss attributable to the parent company of 18.7 million yuan, indicating a loss-making situation. The strategic objective of this investment is to integrate resources from all parties, build synergies, seize market opportunities, and enhance the company's profitability and overall competitiveness.

