Chinese semiconductor industry

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gelgoog

Lieutenant General
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Taiwan's DRAM manufacturers were largely bought off by Micron. They are dead in the water basically.
Taiwan thought they would to do South Korea what South Korea did to Japan. But they failed with lack of capital and poor quality control.
Taiwan failed for two decades straight.

What's with producing DDR3 memory when DDR5 is coming online? I thought ChangXin only produces DDR4.
That tweet seems poorly informed to say the least.

YMTC has a huge workload ahead of them. They need to massively ramp up capacity. Supposedly yield is now good enough. YMTC has several possible issues like US trade sanctions or cash crunch from the bankruptcy of Tsinghua Holdings which could impact it. I think YMTC should just be spun out of Tsinghua Holdings and raise cash on the Chinese stock market via an IPO.
 

styx

Junior Member
Registered Member
xbox one an ps4 used cpu with 28nm process, if china can build a totally indigenous supply chain for this tech thats a massiva step forward for his industry, america will be very concerned
 

weig2000

Captain

Why Yangtze Memory Technologies Poised To Lead The Future Memory Market?​


Today, Yangtze Memory technologies is not new to anyone in the memory industry. Yangtze River Storage Technology Co., Ltd. (YMTC) was established in July 2016 and is headquartered in Wuhan. It is an integrated device manufacturer (IDM) that Designs, Manufactures, and Sells 3D NAND flash memory.

YMTC first marked its presence in the global memory market in 2017 when it announced that they have designed China's first 3D NAND flash memory through collaborations. However, the name YMTC became significant in global memory market in September 2019, when YMTC started mass production of 64-layer TLC 3D NAND flash memory equipped with YMTC's independently designed and owned Xtacking" architecture. Xtacking is a propriety YMTC innovation to manufacture the memory and the logic circuits on separate wafers and connect them using plasma activation and thermal annealing.


YMTC took a big leap in April 2020, when it announced industry's first 128-layer QLC flash memory that has the highest IO speed, highest storage density and highest single Capacity. As per the latest news, YMTC has already started production of 128-Layer, 3D QLC NAND and are supposed to hit the market sooner.
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, by quarter indicates that Samsung is the undisputed leader in this industry segment.

However, an analysis of worldwide patents related to the fabrication of Monolithic 3D NAND memory published after Jan 2018 shows that YMTC is set to disrupt this industry with its propriety Xtacking" technology. YMTC gave a clear hint about this in 2020 when it unveiled 128 Layer 3D NAND memory. Since its inception, YMTC has invested heavily in R&D activities and has filed close to 4000+ patent in memory space. Interestingly, considering the patents published since Jan 2018, YMTC has surpassed industry leaders in securing key technologies related to fabrication of monolithic 3D NAND memory module. Around 1/3rd of the patents published since Jan 2018 that explicitly relate to fabrication of monolithic 3D NAND memory are assigned to Yangtze Memory Technologies, followed by SanDisk [now a apart of Western Digital] and Samsung.

YMTC has already hinted that in coming years, they have plans to monetize their intellectual property in this space by licensing out their proprietary monolithic 3D NAND fabrication technologies to players like Samsung and Micron. YMTC is not only frequently filing patents but a quick look into the prosecution timeline of 3D NAND fabrication-related patents granted to the top 3 patent holding entities since Jan 2018 suggests that Yangtze Memory Technologies has obtained most of its patent rights in less than 500 days, either due to strong innovation or due to China's patent policy.

In addition to this, close to 50% of the patent families published by Yangtze Memory Technologies is still under prosecution which suggest that the base technology on which YMTC is working isn't saturated yet and a lot newer improvement/ continuation patents will be seen in coming days. On the other hand, an analysis of count of pending patents assigned to other key players indicates that they are working at a slower pace or working on technologies that are the are the verge of saturation.

YMTC is not only securing fresh patents in 3D NAND fabrication space but has plans to in-license few of the best available technologies in the market that would add value and efficiency to the YMTC memory streak. Recently, YMTC has obtained access to access to a foundational portfolio of Xperi's DBI hybrid bonding technology.
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, "DBI hybrid bonding is a key enabling technology for current and future generations of high performance, high-capacity 3D NAND flash memory. We are proud to provide YMTC access to our foundational IP portfolio and look forward to further expanding our relationship".

Though Kioxia and Western Digital are a tough competition for YMTC and have also announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology based on a new split-gate architecture. The new device will likely stack two 80-layer structures on top of each other, forming a 160-layer device. Yet looking at the technology acquisition rate, it seems like they need to speed up their R&D activities.

While the global storage leader Samsung has moved their R&D onto the 8th generation V-NAND platform by stacking 200 layers or above, their US rival Micron has recently announced a new 3D flash memory technology, which has an astonishing 176 layers of memory cells stacked on top of each other.

Tough the future path is tough for YMTC, yet they are on the track and have already started the production of 128-Layer, 3D QLC NAND memory and has plans to transition to its Xtacking 3.0 design sometime in the latter half of 2022.

It would be interesting to revisit the NAND flash manufacturers revenue analysis graph once the YMTC's 3D NAND memory modules becomes commercially available in the market.

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Taiwan specialty DRAM makers will face heavier pressure in the 2nd half of next year as China memory firms ChangXin Memory, GigaDevice and others ready production lines to mass produce DDR3 products, media report.


China's four largest semiconductor manufacturing companies, SMIC, Huahong, YMTC, and CXMT, the first two focus on foundry business and logic chips, the latter two on NAND and DRAM and memory and storage. A lot of attention is on SMIC, which is a second-tier player in the fab industry, but YMTC is on the verge of or at least very promising in joining the major league technology-wise. CXMT is at least one generation behind the leading player (DDR4 vs. DDR5). There are still a lot of tough challenges ahead, but Chinese semiconductor industry is very promising, with relatively complete horizontal and vertical line-ups.

Less than decade ago, China's biggest imports fell into four categories: oil, iron ore, semiconductor, and flat displays. There aren't much China can do in the short term about the first two, but China has almost completely turned the corner in the flat panel display industry, taking the dominant position in the LCD sector and is rapidly closing the gap or even leading in the newer or emerging display technologies, i.e., OLED, MiniOLED, and microLED. This has been achieved after over a decade of intensive R&D, heavy investment and losses. Flat panel display can be considered part of the pan-semiconductor industry; sooner or later, China will gain leading position in the semiconductor industry.
 

coolieno99

Junior Member
They wouldn't be Chinese chips, they would be Russian chips fabbed on Chinese equipment if Russia bought and used the SSA800 without restrictions. If they were Chinese chips I would wholeheartedly agree with including them in weapons headed to India and Vietnam - those chips might have some unpleasant surprises in case they were ever turned against China.

Well, they have sold India the S-400, their premier air defense system.

Edit: Now that I think a little more about it, it would still be possible to slip in something nasty even if the chips were designed by Russians so long as they were using Chinese EDA tools.
J-10, J-11, J-16, J-20 ... etc. are or should be protected on the S-400 IFF (Identification Friend or Foe) system. Currently Russia and China are close allies. So S-400 IFF are program to exclude J-10, J-11, J-16, J-20 ... etc. as possible targets, to prevent friendly fire accidents.
During Gulf War 2, French made SAMs used by the Iraqis failed to launch against F-16 or F-18 because the French SAMs IFF system was programmed F-16 / F-18 as friendlies .
So most likely the S-400 IFF only allow launches against U.S. and NATO aircrafts. So Indians S-400 are allow only to shoot down U.S. and NATO aircrafts.
 
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WTAN

Junior Member
Registered Member
Well good news seem like Huawei is optimistic and soon get back into the buz of smart phone Via Vincent. Seem like they were told by the FAB 28nm and 14 nm is possible within 2 years
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Yu Chengdong: Huawei mobile phones will "return the king" in 2023, and Mate50 will only have 4G version next year​

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Source: Aijiwei

1 day ago
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According to reports on the micronet, according to Tencent's "Deep Web" report, Yu Chengdong recently stated at an internal consumer business presentation that Huawei's mobile phones will continue to do so and that the king will return in 2023. Huawei insiders said that this presentation is a recruitment activity for the company, which means that the consumer business has stopped shrinking and turned to expansion.

In addition, Huawei will release the new Mate50 series of flagship phones early next year. Part of the Mate50 will use Kirin 990 chips, and some will use Qualcomm 898 chips, but only the 4G version.

Many people familiar with the matter said that Huawei has made substantial progress in the field of chip supply chain. An industry source close to telecom operators said that the current schedule given by Huawei sales staff to operators is, "28nm will be mass-produced next year, and mass production will be possible after 14nm." Huawei HiSilicon insiders said, "Now is the time to go. So, after these two or three years, mass production will be possible."


At last night's Huawei full-scene smart life new product launch conference, Huawei released the Mate X2 Collector's Edition and plain leather folding screen mobile phone, which increased the 8G memory to 12G, and added 512GB storage specifications. The Kirin 9000 chip on board is upgraded to support 5G. , The price is 18,999 yuan, and it will be sold out this morning. This may be Huawei's last batch of 5G mobile phones.

According to Bloomberg's previous report, people familiar with the matter said that Huawei is considering licensing its design to a department of the state-owned China Posts and Telecommunications Equipment Group Co., Ltd. (PTAC), which will then seek to purchase it that was blacklisted in the Trump era. It has already sold Huawei-branded Nova mobile phones on its website. According to the partnership, this department called Xnova will provide independent-brand mobile phones based on Huawei’s design. The report pointed out that this move may be the best opportunity for Huawei to save its smartphone business. (Proofreading|Stan)
This news article and statement by Huawei's Yu Chengdong basically confirms that the development of the SMEE 28nm DUVL has been successful.
The DUVL is on track to be used by Huawei in China for production of 28nm and 14nm ICs.
The DUVL is capable of 14nm IC Production.
There is no better confirmation than that coming from the CEO of Huawei.
 

ansy1968

Brigadier
Registered Member
This news article and statement by Huawei's Yu Chengdong basically confirms that the development of the SMEE 28nm DUVL has been successful.
The DUVL is on track to be used by Huawei in China for production of 28nm and 14nm ICs.
The DUVL is capable of 14nm IC Production.
There is no better confirmation than that coming from the CEO of Huawei.
@WTAN Sir I may add so is the 14NM 3D stacking technology. The timetable of the RETURN OF THE KING is 2023, with scheduled operation of its Shanghai FAB and that of SMIC Beijing domestic FAB in 2022, they can mass produced it.
 

Tyler

Captain
Registered Member
Taiwan's DRAM manufacturers were largely bought off by Micron. They are dead in the water basically.
Taiwan thought they would to do South Korea what South Korea did to Japan. But they failed with lack of capital and poor quality control.
Taiwan failed for two decades straight.

What's with producing DDR3 memory when DDR5 is coming online? I thought ChangXin only produces DDR4.
That tweet seems poorly informed to say the least.

YMTC has a huge workload ahead of them. They need to massively ramp up capacity. Supposedly yield is now good enough. YMTC has several possible issues like US trade sanctions or cash crunch from the bankruptcy of Tsinghua Holdings which could impact it. I think YMTC should just be spun out of Tsinghua Holdings and raise cash on the Chinese stock market via an IPO.
YMTC is going to disrupt the market by scaling way up.
 

WTAN

Junior Member
Registered Member
@WTAN Sir I may add so is the 14NM 3D stacking technology. The timetable of the RETURN OF THE KING is 2023, with scheduled operation of its Shanghai FAB and that of SMIC Beijing domestic FAB in 2022, they can mass produced it.
Yes, you are right. Huawei Hisilicon is now working on 3D Stacking Designs for 14nm and 7nm Kirin Chips. A very smart Lady is leading the design at Hisilicon.
The 14nm 3D Chips will have to go into mass production in late 2022 at the Huawei FAB in order for it to be ready for use in Huawei Mobiles to be released in 2023.
The King is Coming Back with Harmony OS.
This will shake up the Mobile Phone World.
 
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