Chinese semiconductor industry

[pmc]

Yota was manufactured in China. I think Yota 3 only in China.
At some point Russian phone will be created. as handheld devices are increasingly used in high tech soldiers ,control robotic systems and drones. once there is investments in OS and Cloud. there is no reason to stop from going all the way in semi.

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firms in Estonia has to wait two years for chips and LED screens. similar situation is with automobile in Europe. This idea that Asia will produce hardware and rest of the world will produce software will not work.

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[antiterror13]

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They started with 90nm for DSP, then 55nm then to 40nm. That was years ago. I presume the AESA on the 052D and the 055 might be using the 90nm based DSP. From 2018, they shifted to 40nm for the next gen DSP and moving into 28nm. In 2012, Huarui 1 was introduced by Institute 14 to be used on over 12 Institute 14 (NRIET) radars, and Soul Core 1 by Institute 38 for acoustic applications such as sonar. In 2018, Huarui 2 was introduced with a 40nm process. Huarui 3 will be using 28nm and features AI.

Great, thank you. All with indigenous equipment and GaN ?

So this banning things has no impact at all on PLA weapon development, just another blunder by the US

 

[GodRektsNoobs]

Yota was manufactured in China. I think Yota 3 only in China.
At some point Russian phone will be created. as handheld devices are increasingly used in high tech soldiers ,control robotic systems and drones. once there is investments in OS and Cloud. there is no reason to stop from going all the way in semi.

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firms in Estonia has to wait two years for chips and LED screens. similar situation is with automobile in Europe. This idea that Asia will produce hardware and rest of the world will produce software will not work.

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​

I personally think Russia and CIS countries together have a large enough market to be competitive in IC. If Japan could do it in an era that wasn't even as close to as globalized as today, why can't Russia with its scientific talents?

 

[Tam]

Great, thank you. All with indigenous equipment and GaN ?

So this banning things has no impact at all on PLA weapon development, just another blunder by the US

You can't use GaN for things with high transistor count due to its high transistor failure rate. Hence they are used as power circuits, such as amplifiers and such, using older processes with larger transistor sizes.

 

[JSL]

once China declares full independence from foreign suppliers in semiconductor, the floodgates also open for Russia, which is the nightmare scenario for certain adversaries.

Imagine the mechanical engineering capabilities of Russia combined with the electronics and software of China.

Chinese mechanical engineering capabilities are already ahead of Russia in many field such as naval ship building and civil construction; but still trailing in certain area such as nuclear propulsion and rocket engines.

 

[Chin evan]

Chinese mechanical engineering capabilities are already ahead of Russia in many field such as naval ship building and civil construction; but still trailing in certain area such as nuclear propulsion and rocket engines.

rocket engine? Are you sure ? How do you come to that conclusion/assesment ?

 

[pmc]

I personally think Russia and CIS countries together have a large enough market to be competitive in IC. If Japan could do it in an era that wasn't even as close to as globalized as today, why can't Russia with its scientific talents?

Market is never an issue. it is just an excuse made by people who also think that older technology can keep them afloat indefinitely not realizing no half decent skilled workforce will be attracted to it. I estimate that Russians will succeed in few years.
Japanese started much later than Soviets.

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[xypher]

Just curious, what is preventing Russia from developing its own smartphone and PC industry? I remember Russia has its own Yota phone when I there as an exchange student in 2013-2014. However, the Yotaphone has never become as popular as Huawei, Apple, and Samsung. I bought one when I was in St. Petersburg simply because somehow none of the local SIM cards worked on my old Iphone.

No particular reason - most of the smartphone products are just uncompetitive. Chinese brands sold at lower price points when they were starting, only after getting experience, fleshing out both the hardware and software parts, as well as establishing brand names, some vendors (e.g. Huawei) started charging more. While Russian manufacturers often charge a rather premium price for a mediocre product and it is not even the labor cost issue (Yotaphone & recent Yandex phone are all manufactured in China). They simply cannot fit into the market.

As for the PC industry - what do you mean by it? Like simply assembling PCs from the components (e.g. Dell, Lenovo, HP, etc.)? Russia already has that - they are sold on domestic markets, that's why you won't hear about them. If you are talking about indigenous-design CPUs, GPUs, etc., then it is both a market and technology issue. Russia has indigenously designed Elbrus & Baikal CPUs but they are mostly used in government & military procurement because they are still lagging behind the market leaders and are not interesting for an average consumer. Development and catching up takes time.

 

[Wangxi]

Why Yangtze Memory Technologies Poised To Lead The Future Memory Market?​

Today, Yangtze Memory technologies is not new to anyone in the memory industry. Yangtze River Storage Technology Co., Ltd. (YMTC) was established in July 2016 and is headquartered in Wuhan. It is an integrated device manufacturer (IDM) that Designs, Manufactures, and Sells 3D NAND flash memory.

YMTC first marked its presence in the global memory market in 2017 when it announced that they have designed China's first 3D NAND flash memory through collaborations. However, the name YMTC became significant in global memory market in September 2019, when YMTC started mass production of 64-layer TLC 3D NAND flash memory equipped with YMTC's independently designed and owned Xtacking" architecture. Xtacking is a propriety YMTC innovation to manufacture the memory and the logic circuits on separate wafers and connect them using plasma activation and thermal annealing.


YMTC took a big leap in April 2020, when it announced industry's first 128-layer QLC flash memory that has the highest IO speed, highest storage density and highest single Capacity. As per the latest news, YMTC has already started production of 128-Layer, 3D QLC NAND and are supposed to hit the market sooner.

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, by quarter indicates that Samsung is the undisputed leader in this industry segment.

However, an analysis of worldwide patents related to the fabrication of Monolithic 3D NAND memory published after Jan 2018 shows that YMTC is set to disrupt this industry with its propriety Xtacking" technology. YMTC gave a clear hint about this in 2020 when it unveiled 128 Layer 3D NAND memory. Since its inception, YMTC has invested heavily in R&D activities and has filed close to 4000+ patent in memory space. Interestingly, considering the patents published since Jan 2018, YMTC has surpassed industry leaders in securing key technologies related to fabrication of monolithic 3D NAND memory module. Around 1/3rd of the patents published since Jan 2018 that explicitly relate to fabrication of monolithic 3D NAND memory are assigned to Yangtze Memory Technologies, followed by SanDisk [now a apart of Western Digital] and Samsung.

YMTC has already hinted that in coming years, they have plans to monetize their intellectual property in this space by licensing out their proprietary monolithic 3D NAND fabrication technologies to players like Samsung and Micron. YMTC is not only frequently filing patents but a quick look into the prosecution timeline of 3D NAND fabrication-related patents granted to the top 3 patent holding entities since Jan 2018 suggests that Yangtze Memory Technologies has obtained most of its patent rights in less than 500 days, either due to strong innovation or due to China's patent policy.

In addition to this, close to 50% of the patent families published by Yangtze Memory Technologies is still under prosecution which suggest that the base technology on which YMTC is working isn't saturated yet and a lot newer improvement/ continuation patents will be seen in coming days. On the other hand, an analysis of count of pending patents assigned to other key players indicates that they are working at a slower pace or working on technologies that are the are the verge of saturation.

YMTC is not only securing fresh patents in 3D NAND fabrication space but has plans to in-license few of the best available technologies in the market that would add value and efficiency to the YMTC memory streak. Recently, YMTC has obtained access to access to a foundational portfolio of Xperi's DBI hybrid bonding technology.

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, "DBI hybrid bonding is a key enabling technology for current and future generations of high performance, high-capacity 3D NAND flash memory. We are proud to provide YMTC access to our foundational IP portfolio and look forward to further expanding our relationship".

Though Kioxia and Western Digital are a tough competition for YMTC and have also announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology based on a new split-gate architecture. The new device will likely stack two 80-layer structures on top of each other, forming a 160-layer device. Yet looking at the technology acquisition rate, it seems like they need to speed up their R&D activities.

While the global storage leader Samsung has moved their R&D onto the 8th generation V-NAND platform by stacking 200 layers or above, their US rival Micron has recently announced a new 3D flash memory technology, which has an astonishing 176 layers of memory cells stacked on top of each other.

Tough the future path is tough for YMTC, yet they are on the track and have already started the production of 128-Layer, 3D QLC NAND memory and has plans to transition to its Xtacking 3.0 design sometime in the latter half of 2022.

It would be interesting to revisit the NAND flash manufacturers revenue analysis graph once the YMTC's 3D NAND memory modules becomes commercially available in the market.

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[Wangxi]

Taiwan specialty DRAM makers will face heavier pressure in the 2nd half of next year as China memory firms ChangXin Memory, GigaDevice and others ready production lines to mass produce DDR3 products, media report.

https://twitter.com/i/web/status/1462584855686909957