Chinese semiconductor industry

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badoc

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Xsizor said:
No such thing as " different people excel in different disciplines". It depends on the areas a nation/people/society focus on. Many believe Asians were physically weak until Chinese started sweeping weightlifting medals.If Chinese devote to improving Spelling Bee or pharmaceuticals , they will win. Indians win in spelling bee because Indian parents consider English proficiency as a requirement to immigrate, integrate and succeed better in western countries. Indians excel in pharmaceuticals because Indian laws have a clause to junk foreign patents if it is necessary for public and this forced foreign companies to license Generic drugmakers. This led to slow and solid growth of indian pharma research.

We are comparing nations and people who have different levels of development and different conditions for development. No empirical evidence to suggest one people excel in a field than others. Malnutrition, for example, affects brain development and physical development. Poor countries won't churn out physically fit or smart people as numerous as rich countries, therefore. China is reaping rewards for improving its HDI, average incomes and focusing on science. If Egypt does that, Egypt can compete with Germany.
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For whatever reasons, whether it is society focus or different levels of development or otherwise, it is the end result that matters.
That is they excel in their specialization or prefered disciplines.

One thing though, there is great emphasis in India on IT and programming, producing millions of graduates from their IITs.
But their performance in global IT programming competitions are dismal.
ICPC is the Olympics of Programming.

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2019
41Indian Institute of Technology - Madras
41Indian Institute of Technology - Roorkee

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2018
56Indian Institute of Technology - Delhi
56Indian Institute of Technology - Kharagpur
56Indian Institute of Technology - Madras
56Indian Institute of Technology - Patna
56Indian Institute of Technology - Roorkee
.
 
Xizor

Xizor

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I have doubts about Gpixel and its usefulness to chinese semiconductor strategy.\
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The item concerned is a CMOS image sensor. This sensor is designed by Gpixel Changchun Optotech, Inc. (Gpixel) in China. That detailed design is transferred to a wafer manufacturer in Israel where the wafer is produced. The Israeli wafer contains several silicon dies Each silicon die is a fully functional integrated circuit that can collect photons, convert and amplify the photon signal, and output it as a digital signal.
After the wafer is manufactured in Israel, Gpixel imports it into China to be tested/inspected by Gpixel. Next, the wafer is exported from China to Japan for the assembly of the sensors.
In Japan the wafers are assembled into the final sensor assembly. Japanese origin ceramic packages and glass lids, which are designed in China, are used in the final assembly process. The ceramic package consists of several layers, each layer containing metal routing. The main function of the ceramic package is to connect the pads of the silicon die to the pins/pads of the ceramic package, which can be soldered or connected to the printed circuit board later. The ceramic package also provides protection to the silicon die against mechanical shock, vibration, dust and contamination. The glass lid is attached to the ceramic package, either by epoxy or tape. It provides protection against dust and contamination, and it also transmits the light signal to the silicon die with little reflection. In Japan the wafers are diced (separated into individual I/C chips), glued into the ceramic packages, wire bonded, and the glass lid is attached.
The assembled sensors are exported from Japan to China for final inspection and testing. The CMOS image sensors will be exported from China to the United States for use in scientific applications.
Gpixel NV founders are Tim Baeyens, Tim Blanchaert, Jan Bogaerts, Bart Ceulemans and Wim Wuyts. Together they have more than 75 person-years of relevant experience in CMOS imaging technology, development, operations and commercialization. Gpixel NV is set up with financial and operational backing of Gpixel Inc. (Gpixel Changchun Optotech), a CMOS sensor supplier based in Changchun, China, founded by Xinyang Wang in 2012.

“Imaging and CMOS image sensors are ubiquitous today,” states Tim Baeyens, CEO of Gpixel NV. “Nevertheless, there is still a strong need for dedicated companies such as Gpixel to address high end markets like industrial and professional imaging. Through our wide industry network and strong collaboration with Gpixel Inc, we anticipate growing Gpixel rapidly to become one of the key players in solid state imaging.”
What is the relation between Gpixel and Changguang Chenxin Optoelectronics?

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Am i just misinterpreting a test image here of the 8K sensor developed by Changguang Chenxin?

1638693807139.png
 
Xizor

Xizor

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Headquartered in Changchun City, Jilin Province, Changchun Changguang Chen Xin Optoelectronics Technology Co., Ltd., has set up a wholly-owned subsidiary "GPixel Japan" in Tokyo, Japan and a subsidiary "GPixel NV" in Antwerp, Belgium. The company is committed to providing high performance CMOS image sensors and customized chip services for high-end industrial detection, scientific imaging, machine vision and professional imaging fields.

Gpixel is a subsidiary of Changguang Chenxin. Gpixel fabs its designs with TowerJazz, Israel. So Gpixel seem to be a company polished to face the global markets. While there are elder concerns (state owned and state supported) who provide research and backing for Gpixel.

CIOMP (Changchun Inst of Optics , Fine mechanics and Physics) has several companies and enterprises under its wing :
Changguang Group
Changchun UP Optotech Co.,Ltd.
Suzhou Everbright Photonics Co., Ltd.
Changchun Gpixel Co., Ltd.
and many more (including an aerospace material enterprise).
 
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ansy1968

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from @Oldschool , Richard Chang the founder of SMIC should be awarded a national award, the highest maybe both the Friendship Award or Order of the Republic for his critical contribution in China IC development.

And IF I can add by using 2nd hand equipment and refurbishing it by themselves, they can able to sustain it and be sanction proof. At the same time training a new cadre of technician and able to reversed engineer if possible.

Here's a story of former SMIC founder richard chang started a new Fab in Qingdao. Its called sienidm
He has broad connections. He recruits original equipment company technicians and employees to help him on this. The specialty of this company is getting second hand equipments and renewed them for usage, The equipments are non US origin.

Maybe him and huawei can collaborate. This company can help setup second hand equipments without the support of the original companies.

“自建二手设备翻新基地”是芯恩的特色之一，一方面它可以节省成本，同时可以培养人才，减少对于原厂技术支持的依赖。”

“张汝京老师在芯恩贡献的核心价值，是引进非美装备以及组队热机的实力，在隐退之前的几年有望贡献本土首个工艺/良率满足商业量产级的非美28nm产线（非美，而非国产）……这其中的难关和最具价值的工作，并非二手日韩台装备的进口渠道，而是能够把冷机点热，把工况/工艺/良率一直调通的原厂团队……张汝京最具实力的出手，就是他能够找齐全球的原厂老师傅共同协作，把冷机点热，产线工况调通、多种工艺搭配、良率和成本性调优。”

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horse

horse

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This article is kind of bizarre.

Sounds like propaganda.

The truth is Intel is behind TSMC in the current state of the art chip, 7nm-5nm nodes.

The article is saying Intel wants to obtain the trade secrets of a competitor, at the 3nm node, which the competitor is working on.

Yet Intel itself currently does not have the ability to fab at 7nm or 5nm.

:oops:
 
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tokenanalyst

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Dharma Institute successfully developed an AI chip with integrated storage and computing, which increased the energy efficiency ratio by 300 times​


Recently, Alibaba Dharma Academy announced that it has successfully developed an integrated chip for storage and calculation. According to the introduction, Dharma Academy said that the integrated storage-calculation chip integrates a number of innovative technologies. It is the world's first AI chip that uses "hybrid bonding 3D stacking technology" to achieve integrated storage-calculation. It can break through the von Neumann architecture. The performance bottleneck meets the demand for high bandwidth, high capacity memory and extreme computing power in scenarios such as artificial intelligence. In certain AI scenarios, the performance of the chip is increased by more than 10 times, and the energy efficiency ratio is increased by more than 300 times.

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ansy1968

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horse said:
This article is kind of bizarre.

Sounds like propaganda.

The truth is Intel is behind TSMC in the current state of the art chip, 7nm-5nm nodes.

The article is saying Intel wants to obtain the trade secrets of a competitor, at the 3nm node, which the competitor is working on.

Yet Intel itself currently does not have the ability to fab at 7nm or 5nm.

:oops:
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@horse I don't know bro, maybe a hint that Intel benefited from the harvest of TSMC tech by the Biden administration? I may predict that TSMC within 5 years maybe bought by Intel either due to economic difficulties or legally. As the Chinese FAB or by SMIC alone had grown enough expertise ,competency and scale to challenge the two leaders (Samsung and TSMC).
 
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ansy1968

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tokenanalyst said:

Dharma Institute successfully developed an AI chip with integrated storage and computing, which increased the energy efficiency ratio by 300 times​


Recently, Alibaba Dharma Academy announced that it has successfully developed an integrated chip for storage and calculation. According to the introduction, Dharma Academy said that the integrated storage-calculation chip integrates a number of innovative technologies. It is the world's first AI chip that uses "hybrid bonding 3D stacking technology" to achieve integrated storage-calculation. It can break through the von Neumann architecture. The performance bottleneck meets the demand for high bandwidth, high capacity memory and extreme computing power in scenarios such as artificial intelligence. In certain AI scenarios, the performance of the chip is increased by more than 10 times, and the energy efficiency ratio is increased by more than 300 times.

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@tokenanalyst bro I read a lot about 3D stacking from Mainland publication and the progress it had made, from Huawei, SMIC to Alibaba.
Since packaging is China strength, it's one of many ways to skip around the restriction while they wait for SMEE EUVL?
 
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tokenanalyst

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ansy1968 said:
@tokenanalyst bro I read a lot about 3D stacking from Mainland publication and the progress it had made, from Huawei, SMIC to Alibaba.
Since packaging is China strength, it's one of many ways to skip around the restriction while they wait for SMEE EUVL?
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Exactly, is one way to pack more transistors in a single chip. Packaging was one of those areas in the industry that everyone looked down on, but now it is going to become a fundamental area to continue Moore's Law. In my opinion a high resolution wide area lithography machine with high precision in the near future is going to be very important to make very complex multi-dies chips, like AI, Server chips. SMEE and Canon are working on that, i don't know Nikkon and ASML.

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