News on China's scientific and technological development.

taxiya

Brigadier
Registered Member
It must be TSMC. I assume all Chinese supercomputing chips are contracted to them because there is never any official mention of where they are produced. And only TSMC has a reliable 7nm process.
To be sure, it is TSMC right now, because only TSMC has 7nm today.
In two years, TSMC will not be the only one.

Globalfoundries is supposed to have 7nm in 2019. It is in discussion of a JV in China based on technology they used in their Singapore plant.

I could not find anything on it. What we know for sure is the prototype Sugon uses 7nm chip which only TSMC can make. I also find earlier FT2000 (Tianhe-2) is TSMC made. But I don't know who produces Shenwei chips up to today, do you know?
 

taxiya

Brigadier
Registered Member
LOL is it?
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recently people talked 'imminent war with Taiwan' though, in a thread which has been deleted by Mods (I reported it immediately once I saw it)
I know what thread was it. TWO persons can hardly be defined as people, especially two "crazy" ones even by mainland nationalist standard.
 

Icmer

Junior Member
Registered Member
To be sure, it is TSMC right now, because only TSMC has 7nm today.
In two years, TSMC will not be the only one.

Globalfoundries is supposed to have 7nm in 2019. It is in discussion of a JV in China based on technology they used in their Singapore plant.

I could not find anything on it. What we know for sure is the prototype Sugon uses 7nm chip which only TSMC can make. I also find earlier FT2000 (Tianhe-2) is TSMC made. But I don't know who produces Shenwei chips up to today, do you know?

I have tried to look for this but the only information I could find was on Zhihu, where people said the SW26010 was produced by TSMC.
 

taxiya

Brigadier
Registered Member
I have tried to look for this but the only information I could find was on Zhihu, where people said the SW26010 was produced by TSMC.
I think I have seen that too, but Zhihu is Quora without citation of source, it is worse than wiki.
 

SamuraiBlue

Captain
The 3rd E class computer (Sugon) has passed milestone of key tech research and to begin the next phase of "prototype to final product" development.
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  • The event happened on June 1st.
  • The architecture is X86 base CPU + GPU. All of them domestically produced. I suspect it is the licenese from AMD purchased not long ago.

I doubt it.
AMD is not the legal entity owning core X86 patent, they only have a cross patent agreement with Intel.
Intel is the only entity that can provide usage right of the patent.
 

Hendrik_2000

Lieutenant General
Via JSCh
Yangtze Memory Technologies to Debut New 3D NAND Architecture and Deliver Keynote at Flash Memory Summit 2018
Date: 2018-07-25

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New entrant to participate in the high-entry-barrier NAND flash memory industry with its innovative patent-pending XtackingTMarchitecture

Wuhan, China, July 25, 2018 -
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, a new player in the NAND industry, will be joining Flash Memory Summit this year for the first time, delivering a much-anticipated keynote address to reveal its ground-breaking technology - XtackingTM. YMTC is the first Chinese company to take part in the high-entry-barrier NAND flash memory industry with its new architecture for unprecedented performance, higher bit density, and faster time-to-market.

Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND’s Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company’s new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.

The XtackingTM technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, XtackingTM will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.

The XtackingTM technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.


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Hendrik_2000

Lieutenant General
Via Taishang

Domestic chips to get a big boost
China Daily, May 24, 2018

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A technician demonstrates a domestically developed chip in Wuxi, Jiangsu province. [Photo/Xinhua]
China is including domestic processors in its government procurement plans :enjoy: as the nation steps up its effort to promote the application of homegrown chips in government agencies and State-owned enterprises.

The move is likely to put pressure on U.S. tech giant Intel Corp whose chips are now widely used in China's server market :lol:, experts said on Wednesday.

According to a proposal published on the official website of the Central Government Procurement Center, servers powered by domestic central processing units including Loongson, ShenWei and Phytium are included in China's government procurement plan for 2018-19.

This is the first time that homegrown chip-driven servers have been included in such a proposal, underlying China's determination to promote the application of domestic processors which are making steady progress in performance. State-owned enterprises and government agencies are important buyers of information technology equipment in China.

Loongson is the brand name for China's first self-developed general-purpose microprocessor. ShenWei is a homegrown CPU that powers Sunway TaihuLight, the world's fastest supercomputer. Phytium CPUs are developed by the National University of Defense Technology, a top military academy in China.

Nicknamed the "brain" of electronic products, chips lie inside a wide range of products and power mobile phones, computers, automobiles and other equipment. In recent years, China has spent more than $200 billion on imported chips annually, more than the amount spent on crude oil imports, according to official data.

Hu Weiwu, president of Loongson Technology Corp, said the move is a "milestone" for homegrown chips, "highlighting the strong support the government gives us".

So far, most servers included in government purchase plans come with Intel processors. But as domestic chips make progress, they are good enough to support certain application scenarios, Hu said.

"More efforts are needed to cultivate a computer ecosystem, including software, to support the use of China-developed chips. The wider the use of these chips, the better they will become. It will take time, but we are confident about the process," Hu added.

According to a roadmap released by the National Manufacturing Strategy Advisory Committee, China's integrated circuit industry will narrow its technological gap with those of the world's leading countries by 2020, with annual sales growing at over 20 percent on average.

Liu Jiepeng, deputy general manager of the marketing department at Tsinghua Tongfang, a major server maker in China, said in an interview with Global Times that there is a strong demand for domestic chip-driven servers from government agencies amid growing concern about national security.

The intensified push to develop the homegrown semiconductor industry comes amid widespread concern that heavy reliance on foreign chips will threaten the foundation of the nation's electronics industry. Such concerns have intensified since the recent U.S. decision to ban the sale of key U.S. components, including chips, to Chinese telecom equipment maker ZTE Corp.

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***

Thank you, Mr. Trump and his regime, for making it a legitimate concern for China to support its own chip industry.
 

Hendrik_2000

Lieutenant General
Via JSCh. sofar there is no restriction on Lithograph technology.But it may come someday.

Three China foundries gearing up for transition to sub-10nm process technology
Cindy Yu, Taipei; Jessie Shen, DIGITIMES
Thursday 24 May 2018

Semiconductor Manufacturing International (SMIC) and Huali Microelectronics, and memory foundry specialist Yangtze Memory Technologies (YMTC) are all gearing up for transition to sub-10nm process technology with respective deployments kicking off this year.

SMIC has reportedly ordered a set of extreme ultraviolet (EUV) production equipment from ASML for nearly US$120 million. The largest China-based pure-play foundry is looking to enter risk production of chips built using 14nm FinFET process in the first half of 2019, and will move forward with its plan to incorporate the EUV technology into its 7nm process, according to company sources.

SMIC is expected to receive its first EUV production tools in early 2020 enabling the foundry to step up deployments in the sub-10nm processes, the sources said.

SMIC has revised upward its capex target for 2018 to US$2.3 billion from US$1.9 billion. Capex this year will be used for advanced process R&D, equipment purchases and capacity expansions, the company disclosed previously.

SMIC co-CEO Liang Mong-song will play a key role in assisting the company to accelerate the development of advanced process technology. Liang said at the company's most recent investors meeting that SMIC will kick off risk production of its 14nm FinFET process and venture into the AI (artificial intelligence) chip sector in the first half of 2019 after entering volume production of 28nm HKC+ process in the second half 2018.

Fellow 12-inch foundry Huali has installed ASML's TWINSCAN NXT:1980Di immersion lithography system at its FAB6, where the company will be fabricating 14nm FinFET chips, according to company sources. Huali will be investing a total of CNY38.7 billion (US$6.06 billion) in the construction of FAB6, which is designed for production capacity of 40,000 12-inch wafers monthly.

Huali expects to begin pilot operations at FAB6 by the end of 2018, and have the new fab ready for commercial production by the end of 2022. The fab will focus on the fabrication of logic ICs built using 28nm, 14nm and more advanced process technologies.

Memory-IC foundry YMTC under China's state-owned Tsinghua Unigroup has its first 193nm immersion lithography system delivered recently, according to company sources. The equipment priced at US$72 million will be used for the production of 20nm and 14nm chips.

As YMTC is gearing up for volume production of its in-house developed flash memory chips, the company will be engaged in equipment installations at its factory site in Wuhan over the next several months, the sources said. YMTC plans to build a total of three 3D NAND flash fabs for US$24 billion.

YMTC recently held a ceremony to mark equipment move-in at its first 12-inch fab designed for 300,000 wafers in monthly capacity. Construction of the fab was completed in September 2017, and the fab is ready for volume production later in 2018, the sources indicated.

YMTC has obtained its first orders for commercial production of over 10,000 32-layer 3D NAND flash chips, Charles Kau, acting chairman of YMTC and executive VP of Tsinghua Unigroup, was quoted in previous reports. The company is looking to be capable of producing 64-layer 128Gb 3D NAND products in 2019 to narrow its technological gap with industry leaders within two years.


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Anlsvrthng

Captain
Registered Member
I am not so sure if the IC manufacturing will be considered as pulling industry in ten years time.

As it looks like last gen f EUV machines pulling 1.5 MW electricity to make ICs, and to go to 3nm they will pull 6 MWe.

The semi manufacturing now pulling exponentially more resources for each step.
I think the ICs are representing the last big pulling industry, the next one will be something else.

It still means that China needs to develop this industry, but they need to be flexible to not to overspend onto a (maybe) slowing/hiring the wall industry.
 
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