News on China's scientific and technological development.
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Skywatcher
Captain
Well current projections are for CIOMP (and whoever it will eventually license the tech to) to release the 125W EUV lithography sometime in the 2020-2022 timeframe, IIRC the Internet chatter correctly.Hi antiterror13
Yup, its a niche market, like Skywatcher said only a few FAB can maintain the leading edge, and if SMEE miraculously is able to release its EUV this year ,its game over. But using DUV for non leading edge is still viable as stated by the article below, but even here the new SMEE 28nm DUV will take a lot of market share especially in China (the only player in town).
From cnTechPost
Chinese chipmaker UNISOC releases TSMC 28 nm-based smartwatch chip
2020-07-12 17:56:36 GMT+8 | cnTechPost
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UNISOC, China-based supplier of mobile communications chipsets and IoT chipsets, today announced the W307, the next-generation smartwatch platform.
The W307 is based on TSMC's 28 nm HPC+ process and features an integrated CPU, memory, 4G multimode modem, Bluetooth, Wi-Fi, GNSS, and imaging systems.
The W307 has a smaller footprint than its predecessor, the Chunteng 8521E, bringing more freedom in the design space for end products.
The W307 is significantly optimized for performance, connectivity, intelligence, and power consumption.
Key highlights of the platform, according to UNISOC, include:
Highly integrated: The W307 SoC is based on a single-core A53 processor and offers 30% less package area than its predecessor, which saves you money. The W307 has a large PCB layout area and can be used as a single-sided pendulum.
Light system and low power consumption: The W307 features an RTOS lightweight system for smooth and responsive user experience. The overall power consumption is more than 30% lower than the previous generation, which can bring more durable performance for the smartwatch.
HD Video Calling: W307 has built-in UNISOC's reliable and globally certified second-generation 4G LTE multimode modem. It supports LTE Cat4, WCDMA, and GSM communication protocols and provides 4G+Wi-Fi HD video calls.
Sub-meter high precision positioning: combined with UNISOC AI multi-location technology, high precision positioning SDK, W307 It can support sub-meter high precision positioning. This provides a strong technical foundation for applications such as electronic fencing and meets the needs of parents who want a precise location for their children.
Rich Applications: The W307 is compatible with a wide range of RTOS applications and supports 9-axis sensors and the popular voice assistant, voice mail, and voice mail applications. Applications such as voice chat and pedometers provide a rich and fun interactive and entertaining experience for children.
"TOKYO -- will procure some of its electrical steel sheet from China Baowu Steel Group, China's largest steel supplier, in a move that could presage an era in which Japanese steel-makers will have to compete on price as well as quality, Nikkei has learned."
"A Toyota executive says products from China Baowu Steel are now "as good as [their] Japanese-made counterparts."
Hi Skywatcher
With demand from SMIC and other domestic FAB, can SMEE had the capability to produce both 28nm DUV and EUV en massed? from what I know ASML can only produce 20 EUV unit per year.
Skywatcher
Captain
Well, SMIC is probably going to demand only a couple of EUV machines a year anyways (look at how small the 14nm node is right now as a share of SMIC's total revenue, the same may hold for any SMIC EUV process in 2022+ for at least a couple years)
Skywatcher
Captain
Honestly, I don't know.
They can just raise capital at the stock market just like the recent big IPO of SMIC.
I think a better equivalent than Huawei would be BYD. They make everything from gasoline vehicles, electric vehicles, forklifts, solar panels, batteries, and even monorails. And all this from a relatively young company founded in the 1990s.