Chinese semiconductor thread II

daifo

daifo

Major
Registered Member
With the combination of increase cpu speed/cores evolved binary translation emulator, and support for modern graphix card, the current line of Loongson processor has finally reached the ability to run modern games including Black Myth at playable framerates (> 25).

3B6000
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3C6000
*The Witcher 3*, *Skyrim*, *Fallout 4*, *Ryza 2*, *Detroit: Become Human*, *Titanfall 2*, *Final Fantasy VII Remake*, *Call of Duty: Modern Warfare 2 Remastered*, *Call of Duty: Modern Warfare 1 Remastered*, *Genshin Impact*, *Euro Truck Simulator 2*, *Baldur's Gate 3*. Box64: *Dark Souls 1 Remastered*, *Dark Souls 2*, *Dark Souls 3*, *Sekiro: Shadows Die Twice*. The resources used for *The Old Man's Ring* and *Resident Evil 3*

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tokenanalyst

Lieutenant General
Registered Member

Ruili Scientific Instruments has obtained a patent for a monitoring device that improves the accuracy and reliability of the position of the robotic arm's plate.​


According to information from the State Intellectual Property Office, Ruili Scientific Instruments (Shanghai) Co., Ltd. has obtained a patent for a device called “a monitoring device”, with authorization announcement number CN 223566578 U and application date of December 2024.
The patent abstract shows that this application provides a monitoring device, including an image acquisition module, a cable, and a display device. The image acquisition module and the display device are connected by the cable. The image acquisition module is used to collect image information, and the display device is used to display the image information. At the junction of the measurement detection device and the front-end device module, a window is provided on the side wall of the measurement detection device, and the image acquisition module is located on the inner side wall of the measurement detection device, close to the window. The image acquisition module of this monitoring device is installed directly above the silicon wafer mounting position, which can cover a certain field of view and achieve good focusing, improving the accuracy and reliability of the wafer position on the robotic arm, while also improving the convenience of operation. Furthermore, the monitoring device has a compact structure, reducing space occupation and facilitating use in confined spaces.

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tokenanalyst

Lieutenant General
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Zhongke Feice shipped its first wafer flatness measurement equipment to HBM clients.​

The wafer flatness measurement equipment can perform high-precision measurement of the geometry and nanoscale topography of patterned/unpatterned wafers. It is a core process control device in the field of advanced semiconductor manufacturing , specifically designed for high-precision geometric parameter detection of patterned and unpatterned wafers. Based on the company's mature measurement platform, the equipment integrates innovative hardware technology and intelligent algorithms to provide IC manufacturers with a complete wafer quality monitoring solution from R&D to mass production. It is widely compatible with advanced processes such as ≥96-layer 3D NAND, ≤1Xnm logic chips, DRAM, and HBM.

After years of hard work, the Zhongke Feice team has completed the systematic technical breakthroughs and the development of a series of core equipment for large-aperture wafer flatness measurement . They have formed a deep-rooted layout and iterative innovation system around a series of core technologies. They have independently developed a 300mm wafer large-aperture, high-precision, low-aberration double Fizeau interferometer and a low-noise illumination system to achieve high-stability and high-definition imaging of interference fringe patterns.

In addition, the device covers multiple dimensions of indicators such as warp, bow shape, nano-morphology, in-plane displacement, and local curvature, and simultaneously captures wafer thickness changes and edge roll-off (ERO) characteristics.

Product Highlights
1763822211071.png​
  • The GINKGOIFM-P300 employs an advanced interferometer optical system, enabling the device to have a large warp measurement range.​
  • With its independently developed splicing algorithm featuring high robustness, high noise resistance, and high adaptability, the product yield has reached an internationally leading level.​
  • Employing a unique wafer clamping design, it can simultaneously inspect both sides of the wafer, minimizing the impact of gravity distortion on the measurement results.​
The successful launch of GINKGOIFM-P300 marks a major breakthrough for my country in this field, breaking the long-term monopoly of foreign manufacturers and overcoming the limitations of domestic equipment in measuring ultra-high warp wafers and low reflectivity wafers. It also supports full parameter testing of bonded wafers and compound semiconductor substrates (SiC/GaAs).

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tokenanalyst

Lieutenant General
Registered Member
I trust Western journalists as much as I trust a full grown hungry Nile crocodile with a human baby, but this is disgusting IF real.

ASML offered to spy for U.S. after breaking export ban to China in 2023, book claims​


In 2023, ASML violated a “gentlemen’s agreement” with the United States concerning how many chip-making machines the company could sell to China, leading to anger among the Americans and embarrassment for the Dutch government. The company then offered to be the U.S.’s “eyes and ears” in China in an attempt to prevent further export restrictions, the Financieele Dagblad reported, based on the book De belangrijkste machine ter wereld by former Bloomberg journalists Diederik Baazil and Cagan Koc.

Citing anonymous sources, the authors of the book describe several conversations between the Netherlands, ASML, and the U.S. in recent years. One of these happened in November 2023, when it became clear that ASML had sold more machines to China than the U.S. had allowed.

In that conversation between then-Prime Minister Mark Rutte and ASML CEO Peter Wennink, Rutte warned the CEO that he was venturing into dangerous territory by violating an agreement with the U.S. He made clear that the Dutch government felt misled by the Veldhoven-based company and “humiliated” in the eyes of its most important ally. According to Rutte, regaining American trust was not only one of the U.S. government’s demands, but also in ASML’s best interest.

In January 2023, the Netherlands and the United States reached an agreement to further restrict the sale of ASML machines to China, intended to prevent China from gaining access to the most advanced chip-production equipment: EUV (extreme ultraviolet light) machines. Subsequently, the export of the less advanced DUV (deep ultraviolet light) machines to China was also prohibited.

The ban was to take effect in September 2023 and be implemented fully from January 2024. For the intervening period, there was a gentlemen’s agreement that ASML was only allowed to ship a limited number of already contracted DUV machines to China and was banned from selling any new machines.

However, during that period, ASML sold far more chip machines to China than agreed with the Americans, and the Americans were furious when they discovered this.

In the years that followed, the U.S. further increased pressure on ASML, demanding that the company stop servicing the machines it had sold to China. Wennink has been an outspoken critic of the Americans’ approach, arguing that excluding China would only lead to the country dedicating more energy to developing its own technology. But the U.S. disagreed with this reasoning and kept up the pressure.

According to the book, Wennink then made the striking suggestion that, if ASML engineers were allowed to continue serving Chinese customers, the company could provide the U.S. with insight into what goes on behind the walls of Chinese chip factories. ASML engineers visit the sites of their machines on a regular basis, maintaining the machines and speaking with local employees. “ASML could be Washington’s eyes and ears in China,” a senior American official said in the book.

When asked, an ASML spokesperson said in the book that such an offer was never made. He called it an inaccurate portrayal of events. Wennink and ASML declined to comment to FD. They also did not cooperate with the book. ​
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This also highlight the biggest issue that the Chinese government had with China commercial fabs like SMIC, HLMC and HHGrace.
even if those fabs were successful, there where so dependent on foreign input that in any geopolitical crisis the Chinese government knew they will be useless and there is another problem, foreign companies and workers there were constantly monitoring these fabs and foreign machines have telemetry services to monitor their performance. So there was a pretty serious case for espionage.

The Chinese government knew this since the mid 2000s, especially the export control part. Different from Russia, China consume semiconductors at such high volume that would be impossible to smuggle such amount of chips just to keep the basics working.

Again, my guess is that they devised a plan in `2012 to have a vast network of a purely domestic semiconductor-electronic supply chain and a network of fabs all across China by ~2030 to serve SOEs, domestic infrastructure, the space program and the military purely with domestic chips. Raging from discrete devices to 32nm ICs. First, this fabs would be immune to spying and second, even if there is a geopolitical crisis, even if SMIC, HMLC and others are shutdown, China will still have the ability produce chips and use this supply chain as blueprint to expand the domestic semiconductor from the ground up.
tokenanalyst said:
In 2015 the Chinese government goal for 2020-2030 was to have:

2020:
250 nm I-Line machine. Wavelength = 350nm 0.8NA
110 nm KrF machine. Wavelength = 248nm 0.8NA
90nm ArF machine. Wavelength = 193nm 0.8NA

2025:
45nm Immersion machine. Wavelength = 193nm 1.35NA

And for 2030:
32nm EUV machine. Wavelength = 13.5nm 0.30NA

Not 7nm no 5nm no 3nm, that goal was to make chips in a planar process closer to the resolution of the machine because at the time,2015, overlay was still an issue. So for 250nm the overlay is 80nm, 110nm is 35nm, for 90nm is close to 30, for 45nm is 15nm and for 32nm is 10nm. Single exposures and big overlays.

My thinking is that the goal was not to replace foreign machines but to have machines that could make chips that are critical for the government, the space program and the military. That was the self-reliance that government wanted in with MIC2025, is to have 70% of the chips that the government use being produced locally, that include chips for the military, reducing the dependency of critical components that could be blocked. But US stooges in their infinite stupidity miss-interpreted this as China wanting to replace every single chip in China with domestic one and from there with the narrative of bellicose overpaid US think tankers everything when downhill with the situation escalating significantly under Biden in 2022.

I do think was bit foolish for the Chinese government not keeping their MIC2025 plans secret knowing that US clowns would misinterpreted it BUT at the same time I think that with MIC2025, the Special Project 02 and other projects China may have avoided a US made bullet.
Click to expand...


Jason Huang is right, the Chinese government doesn't want their institutions and much much less the Chinese military to be dependant of US made chips, not even Chinese Chips made in SMIC with US machines because the risk of supply chain disruptions. Different from what stooges said, I do think that China always wanted to separate SMIC and others from the PLA.
 
L

LanceD23

Junior Member
Registered Member
Huawei 9030, 20% performance over previous. Can assume 5nm in volume production?
Using DUVi is too challenging to make.
 
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A

antiterror13

Brigadier
tokenanalyst said:
I trust Western journalists as much as I trust a full grown hungry Nile crocodile with a human baby, but this is disgusting IF real.

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This also highlight the biggest issue that the Chinese government had with China commercial fabs like SMIC, HLMC and HHGrace.
even if those fabs were successful, there where so dependent on foreign input that in any geopolitical crisis the Chinese government knew they will be useless and there is another problem, foreign companies and workers there were constantly monitoring these fabs and foreign machines have telemetry services to monitor their performance. So there was a pretty serious case for espionage.

The Chinese government knew this since the mid 2000s, especially the export control part. Different from Russia, China consume semiconductors at such high volume that would be impossible to smuggle such amount of chips just to keep the basics working.

Again, my guess is that they devised a plan in `2012 to have a vast network of a purely domestic semiconductor-electronic supply chain and a network of fabs all across China by ~2030 to serve SOEs, domestic infrastructure, the space program and the military purely with domestic chips. Raging from discrete devices to 32nm ICs. First, this fabs would be immune to spying and second, even if there is a geopolitical crisis, even if SMIC, HMLC and others are shutdown, China will still have the ability produce chips and use this supply chain as blueprint to expand the domestic semiconductor from the ground up.



Jason Huang is right, the Chinese government doesn't want their institutions and much much less the Chinese military to be dependant of US made chips, not even Chinese Chips made in SMIC with US machines because the risk of supply chain disruptions. Different from what stooges said, I do think that China always wanted to separate SMIC and others from the PLA.
Click to expand...

All Chinese military chips are made by China Electronics Technology Group Corporation (CETC), is a massive state-owned defense electronics conglomerate with ~200,000 employees worldwide and annual revenues in the range of CN¥220 billion.

I think all important CETC tools, software and machineries are local
 
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