These four assumptions:
1- AI = computing power
2- AI is winner takes all
3- AGI is near and will make human labor obsolete
4- China cannot develop its own chips
Chinese semiconductor thread II
- Thread starter vincent
- Start date
1- AI = computing power
2- AI is winner takes all
3- AGI is near and will make human labor obsolete
4- China cannot develop its own chips
Looking at the posts, looks like the poster was sleepy version 34 lol.
domestic lab JFS Lab developed process in growing InP epitaxy on 6-inch InP wafers. Will reduce InP cost by 60-70% vs 3-inch waers.
Sharing this here too, since ultrapure helium seems to be used in semiconductor mfg too..
This is some speculations coming for Mate 80's main Kirin chips. Expecting N+3 and improved transistor density and power consumption. Seems like process has stabilized and yield is acceptable. My guess is 36nm gate pitch and maybe 210nm cell height.
Nice.
I'm always on the cautious side and I'm concerned that the numbers are real, but not for Mate 80. The same Weibo people also said N+3 went into trial production in Q4 last year. It took TSMC N5 1.5 years to ramp up yield so there really isn't much time for Mate 80.
Old enough to remember when 5G was the tech that would have change the world, from surgery in your home to flying cars. The military will have smartphone connected drones and jet fighters. A drone operator would be bombing wedding parties in Kabul with his smartphone from home. That if the US lose the race will be a third rate power. US D.C. think tank stooges have the habit of overhyping technologies that they don't understand for political gains.
Xingji Micro-Equipment's direct-write lithography equipment has been mass-produced and imported into several leading domestic packaging and testing companies.
Xingji Micro-Equipment announced that its series of wafer-level and board-level direct-write lithography equipment for the mid-range field has achieved a major market breakthrough. The company has signed purchase orders with a number of leading domestic packaging and testing companies. The products are mainly used in large-size chip packaging directions such as SoW, CIS, and CoWoS-L.
With the explosive growth of applications like artificial intelligence and high-performance computing, market demand for large-scale, highly integrated mid-range chips is surging. Leveraging its extensive expertise in direct-write lithography, Xingji Micro-Equipment accurately grasps market trends and offers equipment solutions that efficiently meet the packaging process's intelligent deflection correction requirements for RDL and PI layers, significantly improving overall packaging yield.
This recognition from several leading domestic packaging and testing companies signifies that Core Micro's product performance and reliability have reached industry-leading levels. Based on this, combined with current market feedback and business planning, Core Micro anticipates continued order growth from the end of this year to next, potentially reaching new heights. The first batch of equipment is expected to be deployed in customer production lines starting by the end of this year. This will strongly support the domestic packaging and testing industry in meeting the growing demand for high-performance, large-scale AI chip packaging and accelerate the localization of high-end packaging technology.
Zhongke Zhuoer, a semiconductor blank mask developer, completed a B round of financing worth hundreds of millions of yuan.
Semiconductor materials company Zhongke Zhuoer recently completed a Series B financing round totaling hundreds of millions of yuan, led by Chengdu Jiaozi Zhongying Innovation Development Fund, a subsidiary of Bank of China International Investment. Several other institutions are also rapidly advancing their investment. The funds will be used for process research and development of quartz mask substrates for semiconductor lithography, the construction of domestically produced production lines, and to overcome bottlenecks in mass production.
According to information, Zhongke Zhuoer, founded in 2018 by Professor Yang Wei of the Institute of Optoelectronics of the Chinese Academy of Sciences, is a developer of precision optoelectronic and semiconductor intelligent equipment, specializing in the R&D and production of precision optics, semiconductor materials, and intelligent equipment. The company has achieved breakthroughs in key technologies for precision polishing and coating of semiconductor mask substrates, possessing R&D and production capabilities from process technology to core equipment. The company is also responsible for national research projects on the semiconductor blank mask industry chain. Its main products cover 130-250nm process semiconductor/display blanks (28-90nm products are under active development) and related core equipment.
Zhongke Zhuoer reportedly has achieved three independent technological breakthroughs: ultra-precision polishing technology achieves a surface roughness better than 0.2 nanometers (compared to the international mainstream of 0.3 nanometers); magnetron sputtering coating equipment achieves film uniformity of ±2% (compared to the international standard of ±5%); and a defect detection system can identify 0.3-micron defects and correlate them with production data. Zhongke Zhuoer stated that domestically produced blank masks have achieved technical benchmarks in the 130-500nm process, but further breakthroughs are still needed in more advanced nodes below 100nm.
In terms of commercialization, Zhongke Zhuoer's blank masks have been verified by companies such as Luwei Optoelectronics, Longtu Photomask, and several domestically developed photolithography equipment manufacturers. Zhongke Zhuoer's Chengdu pilot line has completed process and product verification, and this round of financing will focus on advancing mass production capabilities.