More Chinese companies are getting into the lithography maintenance business.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Shanxi CETC successfully delivered third-generation horizontal silicon carbide chemical vapor deposition equipment
The equipment shipped this time is the third-generation horizontal silicon carbide chemical vapor deposition equipment developed by Shanxi China Electronics Technology Co., Ltd. with a new design concept . Its structural design and process technology are independently developed by the company. The equipment adopts a high-precision temperature control system, which can accurately control the temperature difference of the graphite substrate within 1°C to ensure the stability of the process; the CFD numerical simulation technology is used to optimize and adjust the equipment structure and process parameters, effectively improving production quality and efficiency.
After many times of process optimization and debugging, the equipment can successfully achieve a purity of coated products ≥ 99.9999%, a thickness of silicon carbide coated products of 100μm±10%, and key technical indicators such as main crystal form, crystal orientation, and hardness have reached the domestic leading level .
The equipment shipped this time is the third-generation horizontal silicon carbide chemical vapor deposition equipment developed by Shanxi China Electronics Technology Co., Ltd. with a new design concept . Its structural design and process technology are independently developed by the company. The equipment adopts a high-precision temperature control system, which can accurately control the temperature difference of the graphite substrate within 1°C to ensure the stability of the process; the CFD numerical simulation technology is used to optimize and adjust the equipment structure and process parameters, effectively improving production quality and efficiency.
After many times of process optimization and debugging, the equipment can successfully achieve a purity of coated products ≥ 99.9999%, a thickness of silicon carbide coated products of 100μm±10%, and key technical indicators such as main crystal form, crystal orientation, and hardness have reached the domestic leading level .
btw, I posted this in AI thread, but worth using this to rebut Trump admin here
Just 1 new Ascend cloud cluster alone has 160,000 cards with 432 CM384 super nodes -> works out to be 129 EFLOPS. So, I think 200k is a huge underestimation.
On that x90 article.
iirc, the original n+2 was 42nm so this is a little improvement to 40nm. I don’t quite remember the other figures though.
this does match what hvpc said to me a year ago that SMIC was doing 40nm first.
iirc, the original n+2 was 42nm so this is a little improvement to 40nm. I don’t quite remember the other figures though.
this does match what hvpc said to me a year ago that SMIC was doing 40nm first.
That video leaves out some things.
Micron lost its lawsuit against JHICC in the US.
CXMT's initial DDR5 product was actually LPDDR5.
He claims the Beijing fab will help CXMT go from 8% to 12% share by the end of the decade. But there is also the possibility to increase fab space at Hefei again.
Micron lost its lawsuit against JHICC in the US.
CXMT's initial DDR5 product was actually LPDDR5.
He claims the Beijing fab will help CXMT go from 8% to 12% share by the end of the decade. But there is also the possibility to increase fab space at Hefei again.
Where is the source says that Micron lost its lawsuit against JHICC in the US？
Would you rather have an article from Reuters then?
Micron pulled the same BS against JHICC that Intel used to bury the NEC x86 clones in the 1980s. Litigation.
The truth is most of Micron's capacity is in Asia, and their leading memory designs are also Asian. Micron bought these for peanuts from Taiwan, and Japan.
The US strongarmed those countries to sell their bankrupt DRAM companies to Micron for peanuts and not to Chinese investors.
The US thought this way they would prevent Chinese DRAM's rise. But China just hired the Asian engineers that Micron laid off and made their own DRAM designs.
Micron then sued JHICC for using "their" IP. Which Micron acquired for peanuts from a bankrupt Taiwanese company after the Taiwanese government spent a boatload of money developing it. Micron did not have a leg to stand on as the lawsuit shows.
Of course the video says nothing about this.
Micron pulled the same BS against JHICC that Intel used to bury the NEC x86 clones in the 1980s. Litigation.
The truth is most of Micron's capacity is in Asia, and their leading memory designs are also Asian. Micron bought these for peanuts from Taiwan, and Japan.
The US strongarmed those countries to sell their bankrupt DRAM companies to Micron for peanuts and not to Chinese investors.
The US thought this way they would prevent Chinese DRAM's rise. But China just hired the Asian engineers that Micron laid off and made their own DRAM designs.
Micron then sued JHICC for using "their" IP. Which Micron acquired for peanuts from a bankrupt Taiwanese company after the Taiwanese government spent a boatload of money developing it. Micron did not have a leg to stand on as the lawsuit shows.
Of course the video says nothing about this.
Last edited:
Its literally in the your quoted post.