Top Expert said china system was top 1 or 2 even though they didn’t participate in the ranking past 10 years.
Chinese semiconductor thread II
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Top Expert said china system was top 1 or 2 even though they didn’t participate in the ranking past 10 years.
With an investment of 300 million yuan, Rimaster Intelligent Measurement and Control Equipment R&D and Production Headquarters was put into operation in Wuxi.
According to Wuxi High-tech Zone Online, on June 26, Rimaster's intelligent measurement and control equipment R&D and production headquarters was officially put into operation in Wuxi High-tech Zone. Rimaster's investment of 300 million yuan in establishing this headquarters will effectively fill the gap in the region's industrial chain in the high-end testing instrument segment, adding a crucial link to Wuxi High-tech Zone's efforts to accelerate the construction of a modern industrial system..
Founded in 2020, Rimaster is one of the very few leading companies in China that simultaneously masters both communication testing and semiconductor RF testing technologies. It is the only national high-tech enterprise and specialized innovative enterprise in China that integrates communication testing (OBS comprehensive tester) and semiconductor RF testing (VST boards/ATE). Currently, the company has R&D institutions and sales companies in Shenzhen, Beijing, and Chengdu. Its products have successfully entered the markets of telecom operators, mainstream national testing laboratories, standards-setting organizations, mainstream chip manufacturers, leading terminal and module companies, as well as universities and research institutes.
It is understood that the establishment of Rimaster's headquarters in Wuxi High-tech Zone will drive a qualitative leap in the company's technological research and development and manufacturing efficiency. It will not only help to significantly shorten the R&D iteration cycle and improve the delivery response speed, but also inject new momentum into Wuxi High-tech Zone to strengthen the high-end measurement and control and semiconductor RF testing industry chain and create a highland for domestic substitution in wireless communication testing.
Yongxi Electronics' Phase III IC packaging and testing project lands in Ningbo.
On the evening of June 26, Yongxi Electronics announced that, in order to seize industry development opportunities and further enhance the company's overall strength and market share, the company plans to invest in the construction of the "Phase III Project of Microelectronics High-end Integrated Circuit IC Packaging and Testing" in the Sino-Italian Ningbo Eco-Park, and signed an "Investment Agreement" with the Sino-Italian Ningbo Eco-Park Management Committee and Sino-Italian Ningbo Eco-Park Holding Group Co., Ltd.
The announcement indicates that the total planned investment for this project is 10.3 billion yuan, including land transfer fees, factory construction, and equipment purchase costs, with the final amount subject to actual investment. The project's main product lines include BUMP, 2.5D, FC, and WB models. The construction site is located in Yuyao City, Ningbo, Zhejiang Province, with an estimated construction period of 96 months. The company will construct and put the project into operation in phases according to its implementation schedule.
Regarding the project's market positioning and feasibility analysis, the announcement indicates that the downstream industry's demand for high-end chips is increasingly exceeding supply. As one of the domestic suppliers of mid-to-high-end advanced packaging, the company needs to fully seize industry development opportunities and plan and deploy in multi-dimensional heterogeneous advanced packaging technology. This project will be strategically positioned, focusing on advanced packaging processes at the forefront of the industry, and promoting the industrialization of these technologies to further drive the large-scale development of China's high-end chip industry, thereby meeting the downstream market demand for high-end chips in China . The implementation of this project will help improve the company's R&D capabilities and industrialization capabilities in the field of high-end chip packaging. On the one hand, this project will provide stronger guarantees for the company's R&D and testing of new high-end products, deepen the company's business layout in the field of wafer-level advanced packaging, and seize the good opportunities of the rapid development of the integrated circuit industry and the domestic substitution of high-end chip packaging. On the other hand, this project will help further improve the localization level of advanced packaged chips, which is of great significance to ensuring the stability of China's chip industry supply chain.
The bonding equipment industry is going to explode in the coming years as 3D ICs become the norm.
The DISPEC 9000 fully automated SiC substrate dislocation defect non-destructive testing system from Chuangrui Spectroscopy has achieved another milestone in delivery.
The DISPEC 9000, a fully automated system for detecting dislocation defects in Silicon Carbide (SiC) substrates, has successfully completed factory testing and been officially shipped to its customer. This marks the company's steady transition from single-unit sales to large-scale, standardized delivery. It follows previous successful acceptances by leading domestic and international customers.
Driven by the growth of the third-generation semiconductor market, demand for SiC defect testing is rising steadily. The high volume orders reflect strong confidence in AeonSpectroscopy's technology and product performance. The company has now demonstrated capability to handle centralized shipments with larger volumes while maintaining quality control and supply chain efficiency.
The DISPEC 9000 is designed for industrial-scale mass production, featuring:
- Non-Contact Optical Testing: Supports full-batch, end-to-end data acquisition without damaging the substrate.
- AI-Powered Intelligence:Utilizes deep learning to accurately classify specific defect types including:
- TSD (Twin Screw Dislocation)
- TED (Thread Edge Dislocation)
- BPD (Burgers Plane Defects)
- SF (Staircase Faults)
- MP (Misfit Planar defects)
- High Throughput: Engineered to meet strict inspection cycle requirements for mass production.
- Versatility: Capable of inspecting both ingots and non-standard size seed crystals, adaptable to various process scenarios.
Chuangrui Spectroscopy is expanding its portfolio beyond third-generation semiconductors to cover compound semiconductors and materials for AI applications. The company aims to become a globally leading enterprise in full-stack advanced spectral detection technology, driving the high-quality development of the semiconductor industry through continuous R&D and product innovation.
Zeptools developing E-Beam systems for mask production.
Beijing Liangzi Measurement Technology Co., Ltd. focuses on ultrafast laser and extreme ultraviolet (EUV) computational imaging technologies, and is committed to the localization of metrology equipment for advanced semiconductor processes. Its desktop-grade EUV light source and lensless computational imaging solution can break through the bottleneck of traditional optical inspection accuracy, enabling rapid and high-precision inspection of wafers with advanced processes below 14 nanometers.
There are two really important areas that are advancing pretty fast in China, this two areas are not just important for frontend lithography machine manufacturing (Like EUV and immersion) but also high end bonding equipment, E-Beam lithography, semiconductor metrology and nanoimprint lithography.
1- Nanometer-Picometer positioning tools.
2- Micrometer-Nanometer fabrication machine tools for ultra-precision optics manufacturing and ultra-precise semiconductor equipment components manufacturing.
Like I said many times, China is not just developing "a lithography machine", they are developing an entire supply chain for EUV and DUV lithography machines...AND other equipment that require ultraprecise precise machined optics, components and picometer positioning like Bonding tools, semiconductor metrology tools, nanoimprint lithography...
The interesting part is that a lot of this tooling require nanometer-picometer level positioning and surface measurement. so the investment that China did in ultraprecise positioning is paying itself in these tools. Is self-reinforcing.
1- Nanometer-Picometer positioning tools.
2- Micrometer-Nanometer fabrication machine tools for ultra-precision optics manufacturing and ultra-precise semiconductor equipment components manufacturing.
Like I said many times, China is not just developing "a lithography machine", they are developing an entire supply chain for EUV and DUV lithography machines...AND other equipment that require ultraprecise precise machined optics, components and picometer positioning like Bonding tools, semiconductor metrology tools, nanoimprint lithography...
The interesting part is that a lot of this tooling require nanometer-picometer level positioning and surface measurement. so the investment that China did in ultraprecise positioning is paying itself in these tools. Is self-reinforcing.
Pushing the Limits of Precision! Three Key Leaps in the Ultra-Precision Optics and Micro/Nano Fabrication Industry
Domestically, Changsha ÅFiSy has been deeply involved in ultra-high precision ion beam polishing equipment, successively launching several new ion beam polishing machines with maximum processing part sizes ranging from 300 mm to 2 m. The equipment adopts a non-contact atomic-level removal principle, achieving a processing accuracy of angstrom (0.1 nm). The surface shape accuracy is better than λ/50 PV and λ/1000 RMS (λ=632.8 nm). It can process planar, spherical, aspherical, off-axis, and free-form surfaces, and is compatible with a variety of materials such as microcrystalline glass, ULE, fused silica, sapphire, and single-crystal silicon. EFORS has successfully broken the long-standing foreign monopoly in the field of ultra-high precision ion beam polishing, providing core domestically produced equipment support for cutting-edge fields such as aerospace, high-power lasers, and semiconductor lithography.
Equipment self-sufficiency: Domestically produced ultra-precision machining equipment accelerates its replacement of imports.
Ultra-precision machining equipment is the cornerstone of optical component manufacturing capabilities. For a long time, core equipment such as high-end single-point diamond lathes, magnetorheological polishing machines, ion beam shaping equipment, and ultra-precision grinding machines have been heavily reliant on imports. In recent years, domestic equipment manufacturers have made continuous breakthroughs in key areas such as spindle rotation accuracy, hydrostatic guideway technology, in-situ measurement and compensation, and environmental thermal stability. The positioning accuracy of five-axis CNC machine tools has improved from ±5μm to ±2μm or even higher; domestically produced femtosecond laser processing stations have achieved thermal damage-free micromachining of hard and brittle materials; and CNC grinding and polishing equipment has begun to integrate robot adaptive polishing and process databases. At the same time, the localization of tools for superhard materials has provided a new path for efficient and low-damage machining of hard and brittle materials.
Jiangsu Youpuna has been deeply committed to the independent research and development of core technologies, integrating hydrostatic shaft systems, air-bearing spindles, and nanometer-level intelligent CNC systems to create high-end optical aspherical composite grinding machines. Its products focus on ultra-precision mold processing scenarios in the fields of optics, optical communication, and semiconductors, achieving excellent key processing accuracy with a workpiece surface PV value ≤0.15μm and a surface roughness Ra＜5nm, placing its technology at the forefront of international standards.
Haipu Ultra Precision (Beijing Haipu Ruisen) focuses on the manufacturing of ultra-precision high-end equipment, overcoming key challenges in hydrostatic technology and achieving independent production of core components such as hydrostatic spindles, rotary tables, and guideways. Equipped with self-developed CNC systems and machining software, it has formed a complete closed loop encompassing equipment R&D, complete machine manufacturing, and process services. Haipu Ultra Precision focuses on high-end fields such as aerospace, precision optics, and semiconductors, deeply cultivating the R&D and production of high-precision machine tools and complete sets of equipment. Adhering to independent innovation and leveraging its full-chain manufacturing advantages, it aims to create a benchmark for domestically produced ultra-precision equipment, contributing to the development of high-end manufacturing in China.
Harbin Bozhong Taida Optics & Precision Co., Ltd. , relying on the professional research team of Harbin Institute of Technology, is deeply engaged in the field of ultra-precision machining. Based on the achievements of national-level scientific research projects, the company focuses on the R&D, production, and technical services of high-end precision equipment. It possesses nanometer-level core technologies, and its core products cover ultra-precision diamond single-point lathes, roller mold processing machine tools, freeform surface measuring machines, and vertical mills such as the UPG650. These products achieve nanometer-level precision, enabling import substitution of key equipment and are widely used in optics, semiconductors, aerospace, and other fields.
Huacui Intelligent Equipment Co., Ltd. specializes in nanometer-level ultra-precision turning/grinding equipment. It has independently developed a liquid hydrostatic guideway + air hydrostatic spindle + high-precision motion control system, focusing on the UPC series of ultra-precision single-point diamond lathes and five-axis ultra-precision machining centers. These machines can perform optical-grade machining of planar, spherical, aspherical, off-axis curved, and free-form surfaces from materials such as copper, aluminum, single-crystal germanium, zinc selenide, and resin. Surface accuracy reaches the nanometer level, and roughness can reach the sub-nanometer level. They can also process micro-lens arrays, Fresnel lenses, and other micro-structured components, widely serving the fields of optics, semiconductors, aerospace, and infrared imaging.
Sichuan Shenggong Technology (a platform for the transformation of scientific research institute achievements) has been deeply involved in the field of ultra-precision optical processing equipment for 30 years. It has independently developed three core series: ultra-precision single-point diamond lathes, magnetorheological polishing machines, and high-precision CNC grinding machines, coupled with its own ultra-precision motion and control system. Its magnetorheological polishing equipment is specifically designed for high-steepness curved optical components, achieving a surface profile RMS≤2 nm and Ra≤0.3 nm. Its high-precision grinding machines can stably achieve a roundness better than 0.5 μm, meeting international embargo-level equipment standards. Products cover large-diameter optical components, semiconductor wafers, and infrared optical components. As a core supplier of domestically produced ultra-precision equipment, it has been showcased at the China International Optoelectronic Exposition for many consecutive years.
Jiangsu Youpuna has been deeply committed to the independent research and development of core technologies, integrating hydrostatic shaft systems, air-bearing spindles, and nanometer-level intelligent CNC systems to create high-end optical aspherical composite grinding machines. Its products focus on ultra-precision mold processing scenarios in the fields of optics, optical communication, and semiconductors, achieving excellent key processing accuracy with a workpiece surface PV value ≤0.15μm and a surface roughness Ra＜5nm, placing its technology at the forefront of international standards.
Haipu Ultra Precision (Beijing Haipu Ruisen) focuses on the manufacturing of ultra-precision high-end equipment, overcoming key challenges in hydrostatic technology and achieving independent production of core components such as hydrostatic spindles, rotary tables, and guideways. Equipped with self-developed CNC systems and machining software, it has formed a complete closed loop encompassing equipment R&D, complete machine manufacturing, and process services. Haipu Ultra Precision focuses on high-end fields such as aerospace, precision optics, and semiconductors, deeply cultivating the R&D and production of high-precision machine tools and complete sets of equipment. Adhering to independent innovation and leveraging its full-chain manufacturing advantages, it aims to create a benchmark for domestically produced ultra-precision equipment, contributing to the development of high-end manufacturing in China.
Harbin Bozhong Taida Optics & Precision Co., Ltd. , relying on the professional research team of Harbin Institute of Technology, is deeply engaged in the field of ultra-precision machining. Based on the achievements of national-level scientific research projects, the company focuses on the R&D, production, and technical services of high-end precision equipment. It possesses nanometer-level core technologies, and its core products cover ultra-precision diamond single-point lathes, roller mold processing machine tools, freeform surface measuring machines, and vertical mills such as the UPG650. These products achieve nanometer-level precision, enabling import substitution of key equipment and are widely used in optics, semiconductors, aerospace, and other fields.
Huacui Intelligent Equipment Co., Ltd. specializes in nanometer-level ultra-precision turning/grinding equipment. It has independently developed a liquid hydrostatic guideway + air hydrostatic spindle + high-precision motion control system, focusing on the UPC series of ultra-precision single-point diamond lathes and five-axis ultra-precision machining centers. These machines can perform optical-grade machining of planar, spherical, aspherical, off-axis curved, and free-form surfaces from materials such as copper, aluminum, single-crystal germanium, zinc selenide, and resin. Surface accuracy reaches the nanometer level, and roughness can reach the sub-nanometer level. They can also process micro-lens arrays, Fresnel lenses, and other micro-structured components, widely serving the fields of optics, semiconductors, aerospace, and infrared imaging.
Sichuan Shenggong Technology (a platform for the transformation of scientific research institute achievements) has been deeply involved in the field of ultra-precision optical processing equipment for 30 years. It has independently developed three core series: ultra-precision single-point diamond lathes, magnetorheological polishing machines, and high-precision CNC grinding machines, coupled with its own ultra-precision motion and control system. Its magnetorheological polishing equipment is specifically designed for high-steepness curved optical components, achieving a surface profile RMS≤2 nm and Ra≤0.3 nm. Its high-precision grinding machines can stably achieve a roundness better than 0.5 μm, meeting international embargo-level equipment standards. Products cover large-diameter optical components, semiconductor wafers, and infrared optical components. As a core supplier of domestically produced ultra-precision equipment, it has been showcased at the China International Optoelectronic Exposition for many consecutive years.
