Chinese semiconductor thread II

[tokenanalyst]

Kunheng Shunwei: Focusing on the R&D of core testing instruments and new products in 2026​

Recently, Kunheng Shunwei stated during an institutional survey that in 2026, the company will focus on continuously upgrading and iterating its existing core test instrument products, such as wireless channel simulators, signal generators, spectrum analyzers, and wireless communication test platforms. On the other hand, it will also actively carry out the research and development of multiple new products to continuously strengthen its core competitiveness in the field of high-end radio test and simulation instruments through product innovation.

Kunheng Shunwei's core products have been widely used in mobile communications, satellite communications and other fields. It can also provide overall solutions such as satellite communication RF testing and terminal conformance testing. Its product matrix has covered downstream users in multiple links of the satellite industry chain.



The company's previously released wireless communication test platform is compatible with multi-system integrated test scenarios such as NTN satellite communication, becoming an important tool for deploying next-generation mobile communication terminal testing.

To ensure the smooth progress of product upgrades and new product development, the company will maintain a high level of R&D investment while continuously expanding its product portfolio and customer coverage. The company will optimize its sales team configuration based on business needs, simultaneously expanding its distribution network and market reach to ensure that upgraded core products and newly developed products reach the market more quickly, fully matching the ever-increasing testing and simulation demands from downstream industries.

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[tokenanalyst]

Semitronix working with Maxscend as a EDA supplier.

Guangli Microelectronics and Zhuosheng Microelectronics jointly build a yield protection line, earning the title of "Strategic Supplier".​

Guangli Microelectronics has been awarded the title of "Strategic Supplier of the Year" by Zhuosheng Microelectronics, recognizing its three years of consistent delivery of high-quality EDA software and wafer-level testing solutions. The partnership focuses on addressing semiconductor yield challenges through a collaborative quality defense line.

Key products in the collaboration include:

DE-Alarm: An intelligent anomaly monitoring system using AI to detect real-time defects across critical processes (CP, FT), with over 20 monitoring rules. It integrates with MES/CIM systems for end-to-end quality control and closed-loop management.


YMS+AutoInk: An automated chip marking system with high-precision screening capabilities (DPAT, SPAT, ZPAT). It reduces human error, improves efficiency, and supports automotive-grade chips through accurate defect identification and real-time alarm alerts.


INF-ADC: An AI-powered automatic defect classification system achieving up to 98.5% accuracy and classifying defects in just 20ms per frame, with zero-code operation for easy deployment—boosting detection speed, consistency, and production efficiency.


This recognition highlights the strategic synergy between Guangli Microelectronics and Zhuosheng Microelectronics, reinforcing their commitment to advancing China’s semiconductor industry through innovation, reliability, and customer-centric solutions.

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[tokenanalyst]

Heyan Technology 2025 Achievements.​

In 2025, Heyan Technology emerged as a leading force in China's semiconductor packaging equipment sector, achieving transformative growth. By strategically focusing on core competencies in cutting, grinding, and polishing, the company expanded Jigsaw product applications, commercialized grinding equipment, and penetrated advanced packaging and wafer foundry markets. Annual Jigsaw shipments exceeded 100 units, cutting equipment surpassed 1,000 units, and it rose to second globally in wafer dicing machine market share. Successfully entering South Korea and partnering with top international wafer foundries, Heyan transitioned from packaging-focused operations to a comprehensive "all-rounder" serving semiconductor testing, manufacturing, and AI infrastructure sectors.

Technological innovation drove systemic breakthroughs across Heyan's portfolio. The company launched China's first mass-production laser ring-cutting equipment, addressing critical challenges in power semiconductor back-metal processes. Its high-precision wafer dicing machines enabled edge trimming and half-cutting for advanced packaging, while grinding machines achieved ±2.5μm precision. Additionally, it developed the world's first single-station dual-lamination vacuum laminator for HBM and 3D packaging applications. By collaborating deeply with clients to solve process-specific challenges, Heyan evolved from single-device improvements to offering full-stack solutions, positioning itself as a strategic partner in customers' process iterations.



Facing three key challenges R&D talent shortages, supply chain disruptions, and international market trust barriers Heyan implemented targeted strategies. It expanded high-end talent through university partnerships and global recruitment, built a new 30,000㎡ factory, and diversified supply chains to ensure stability. Strict adherence to ISO/CE/SEMI certifications, coupled with production data validation and on-site customer testing, helped avoid price wars while building credibility. In 2025, products successfully exported to South Korea, Southeast Asia, and Europe, establishing Heyan as a benchmark for Chinese equipment entering global markets.

For 2026, Heyan aims to deepen domestic market penetration while accelerating global expansion. Plans include upgrading production capacity with smart manufacturing systems, advancing "equipment + process" solutions, and prioritizing advanced packaging R&D to significantly boost overseas revenue. Leveraging Japan-based R&D labs and Southeast Asia service centers, the company will strengthen localized support networks. Supported by growth in AI, new energy vehicles, and national policy initiatives, Heyan is poised to become a global semiconductor equipment leader, propelling China's semiconductor industry toward the center of the world stage.

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[tokenanalyst]

Tesstech Semiconductor's TGV precision planar machining equipment has been selected for Beijing's list of the first (set) of major technical equipment.​

The first (set) of major technical equipment refers to equipment products that have achieved major technological breakthroughs in China, possess intellectual property rights, and have yet achieved market performance in Beijing. This includes the first three (sets) or batches of complete sets of equipment, complete machines and core components, control systems, basic materials, software systems, etc.



The identification of the first (set) of major technical equipment in Beijing is organized and implemented by the Beijing Municipal Development and Reform Commission. The district development and reform commissions coordinate and explore the innovation potential of their respective jurisdictions, focus on tackling key core technologies in the field of high-end equipment, and promote the engineering and industrialization of major technological achievements. It is an important identification for cultivating new productive forces and empowering the intelligent upgrading of industries.

"Behind the selection of these nine products lies the commitment of companies in the park to continuously cultivate core areas, and it is also the result of the continuous optimization of the park's innovation ecosystem. It fully reflects our innovation agglomeration effect and quality improvement trend in the field of high-end equipment manufacturing," said Song Weiguo, director of the Enterprise Service Center of Zhongguancun Shunyi Park Management Committee. He cited two representative products as examples: the large-size board-level CMP polishing equipment from Beijing Tesidi Semiconductor Equipment Co., Ltd., and the mechatronics solar panel drive device from Beijing Xuanyu Space Technology Co., Ltd.

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[tphuang]

https://twitter.com/i/web/status/2021183510183092699

SMIC reports on Q4 and the numbers are kind of what you would expect. The capex number continues to grow. Up to $8.1B in 2025 (vs $7.5 in 2024 iirc). They say they expect capex to be about the same in 2026, but I feel like this is something they often say because they don't want to unveil that they will grow moderately. Overall, the capex is still vastly higher than other fabs of similar size.

Although, they don't grow as fast as CXMT and YMTC

 

[sunnymaxi]

https://twitter.com/i/web/status/2021183510183092699

SMIC reports on Q4 and the numbers are kind of what you would expect. The capex number continues to grow. Up to $8.1B in 2025 (vs $7.5 in 2024 iirc). They say they expect capex to be about the same in 2026, but I feel like this is something they often say because they don't want to unveil that they will grow moderately. Overall, the capex is still vastly higher than other fabs of similar size.

Although, they don't grow as fast as CXMT and YMTC

sir, even you said this is not the actual revenue of SMIC as their flagship Shanghai fab doesn't count 100 percent.

but yeah can't be compare with YMTC/CXMT expansion.

 

[tokenanalyst]

Changchuan Technology: Advancing its Southwest Production Capacity Layout, Phase II Construction of its Neijiang Base Officially Commences​

On February 10, according to the Daily Economic News, Changchuan Technology responded on the investor interaction platform, clarifying that the company has started the construction of the second phase of the Neijiang base project in the second half of 2025. The base will undertake the core functions of the company's production base in Southwest China. At the same time, it disclosed that the reduction of shares by relevant shareholders is due to their own capital planning and will not affect the company's control and operational stability.

Changchuan Technology is primarily engaged in the R&D, production, and sales of testing machines, sorting machines, and AOI optical inspection equipment. Its products have entered the supply chain of leading domestic packaging and testing companies. The company's operating performance in 2025 was outstanding, with revenue and net profit attributable to shareholders increasing by 41.80% and 98.73% year-on-year in the first half of the year, respectively. Net profit attributable to shareholders for the first three quarters reached 865 million yuan.


Since its establishment in the local high-tech zone in 2021, the Neijiang base has achieved remarkable development results. The first phase of the project was successfully put into production in 2023, achieving an output value of over 700 million yuan in 2024, and is expected to exceed 1 billion yuan in 2025, becoming an important hub for semiconductor equipment manufacturing in Southwest China. The second phase of the project, which has now been launched, has a construction area of approximately 142,000 square meters and plans to build R&D and manufacturing plants, R&D buildings, and other facilities. It is expected to be completed and put into operation in February 2027. Upon completion, it will become a first-class intelligent manufacturing base for semiconductor testing equipment in China, with annual sales revenue expected to exceed 2 billion yuan.

The advancement of the second phase of the Neijiang base project will further improve Changchuan Technology's production capacity layout, strengthen the company's market reach in Southwest China, provide solid production capacity support for subsequent business expansion, further enhance market competitiveness, and contribute to the development of the domestic semiconductor equipment industry.

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[tokenanalyst]

Moore's Threads open-sources TileLang-MUSA, significantly lowering the development threshold for domestically produced GPUs.​

On February 10th, Moore Threads open-sourced TileLang-MUSA, a high-performance programming framework that enables developers to build AI operators with minimal code and maximum performance on its domestically produced GPUs.​

• TileLang-MUSA is a high-level language based on tensor block abstraction, using a Python-like syntax for clear, mathematically intuitive expressions. It automates complex optimizations (loop unrolling, memory scheduling, thread mapping) to reduce programming complexity while maintaining low-level performance.​
• The project supports multiple generations of Moore Threads GPUs (e.g., MTT S5000, MTT S4000), offering near-zero development cost for migrating operator logic from other platforms.​
• In practice:​
  • Code volume is reduced by ~90% compared to hand-written MUSA C++.​
  • Performance reaches up to 95% (GEMM) and 85% (FlashAttention-3) of manually optimized versions.​
  • Auto-tuning features allow rapid optimization of tile size and pipeline stages, enabling performance surpassing benchmarks without deep expertise.​
• Benefits:​
  • Lowers the barrier for AI engineers unfamiliar with MUSA architecture.​
  • Accelerates deployment of large language models and other AI applications on domestic hardware.​
  • Enables integration with major frameworks (e.g., SGLang) for global optimization in complex architectures like Transformers or MoE models.​

Moore Threads aims to build a unified, open, and accessible ecosystem for domestic AI computing—making it easier to develop, deploy, and optimize large-scale AI models on Chinese-designed GPUs.​

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[tokenanalyst]

Biren Technology's Biren™ 166M ultra-fast support for MOSS-TTS Family​

On February 10, the MOSS Intelligence and OpenMOSS team (incubated by the Shanghai Innovation Academy) open-sourced the MOSS-TTS family, a suite of high-fidelity, expressive speech generation models supporting multilingual, long-audio, and real-time dialogue. Biren Technology (06082.HK), a leading domestic GPU chip provider, became the first local computing vendor to successfully deploy its flagship Biren™ 166M chip for high-performance inference of the MOSS-TTS platform.

The Biren™ 166M, a 4U OAM V1.1 air-cooled data center chip designed for both training and inference, enables efficient support for trillion-parameter AI models across LLMs, AIGC, and speech processing. Its integrated hardware-software stack (BIRENSUPA™) significantly reduces model adaptation costs and strengthens the foundation for AI innovation.


The MOSS-TTS family includes five core models:
​

• MOSS-TTS: Multilingual, long-form, precise-duration speech synthesis​
• MOSS-TTSD: Multi-speaker TTS for realistic conversations (podcasts, dialogues)​
• MOSS-VoiceGenerator: Voice character design via text commands​
• MOSS-SoundEffect: Ambient and sound effect generation​
• MOSS-TTS-Realtime: Real-time streaming speech output​

These models form a closed-loop ecosystem enabling tasks like speaker cloning, emotional voice design, dynamic dialogue creation, ambient sound addition, and live interaction. Biren Technology successfully synthesized audio from sample dialogues using the foundational MOSS-TTS model—demonstrating stable, expressive voice generation in complex scenarios.

This collaboration lowers the technical barrier for small teams and creators to adopt advanced speech synthesis technology, accelerating voice content innovation across media, entertainment, and AI-driven applications.

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[tphuang]

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深圳平湖实验室/Shenzhen Pinghu Lab made progress in SiC junction field-effect transistor (JFET) Ics. It can operate normally at power supply voltage level of ±5V and below. Can be used in extreme high-temperature scenarios (of up to 500 C). Does not use precious metals like Platinum and Gold.