Chinese semiconductor thread II

tokenanalyst

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Heraeus Electronic Thick Film Heating Slurry First Batch Successfully Rolled Off Production Line​


On the morning of January 29, 2026, the first batch of Heraeus Electronics thick film heating paste samples successfully rolled off the production line at the Changshu plant. The company's global and regional management teams, along with the core project team, attended the production launch ceremony.

The successful delivery of the first batch of samples marks a significant step forward for the project. Management highly commended the team's outstanding work and close collaboration in the early stages and expressed confidence in the project's successful implementation in Changshu. All team members will take this breakthrough as a new starting point and dedicate themselves to ensuring the smooth progress of subsequent work.



Taking this as an important opportunity, Heraeus Electronics is accelerating the localization of its heater paste production, focusing on heater pastes and other paste categories urgently needed in the Chinese market, and further deepening its core strategy of "In China, For China".

In the future, the thick film product line will focus more on localized R&D and production, closely aligning with the needs of the Chinese market. By enhancing supply chain resilience and accelerating market response, we will provide customers with more agile and reliable localized products and services.

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tokenanalyst

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Guangzhou: Supporting the first phase of the Guangdong Chip Industry Development Project to increase production and efficiency, and accelerating the fourth phase of the Guangdong Chip Industry Development Project.​


At the Sixth Session of the 16th Guangzhou Municipal People's Congress on January 19, 2026, Mayor Sun Zhiyang delivered a government work report emphasizing the cultivation of emerging future industries. The city plans to launch 100 major projects exceeding 100 million yuan in investment to drive growth, specifically targeting the Guangdong Chip Industry Development Project and supporting the first phase of GAC's battery and core chip production. Additionally, the strategy includes advancing the Huaxing Optoelectronics T8 and Yuexin Phase IV projects, expanding intelligent connected vehicle applications, and developing low-altitude equipment manufacturing parks and the "Green Energy Valley."

The administration is aggressively implementing the "Artificial Intelligence+" initiative by establishing a "four-voucher linkage" mechanism involving computing power, data, scenario, and model vouchers. Guangzhou aims to optimize computing infrastructure, construct national pilot bases for AI applications, and build the Tianhe and Huangpu National Data Industry Clusters. This approach also includes creating a comprehensive "Guangzhi Intelligent" service platform and deepening the authorized operation of public data to foster new business models.

To support these technological advancements, the government plans to accelerate the legislation for AI development and promote the clustered development of commercial aerospace and green petrochemicals. Specific focus will be placed on establishing municipal-level manufacturing innovation centers, constructing the Greater Bay Area low-altitude comprehensive hub, and enriching the Haixinsha Full-Space Intelligent Experience Center. Ultimately, these efforts aim to create a dynamic development system of "6 core industries + X potential tracks" and cultivate 100 leading enterprises to enhance the city's industrial capabilities.

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tokenanalyst

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A Pole-Placement-Based Variable-Gain Observer for Precision Motion Stages: Addressing the Disturbance-Noise Trade-Off​

Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology
Key Laboratory of Ultra-Precision Intelligent Instrumentation, Ministry of Industry and Information Technology

Abstract​

Accurate pattern transfer in the lithography process demands extreme positioning accuracy. However, various external disturbances acting on the wafer stage can lead to positioning errors. To address this issue, this paper proposes a pole-placement-based Variable-Gain Extended State Observer (VGESO). First, the trade-off between disturbance rejection and noise attenuation faced by conventional Extended State Observers (ESOs) in precision motion systems is analyzed. Then, a modified ESO structure is introduced, in which two pole-related parameters are employed to adaptively adjust the observer gains. These parameters enable effective suppression of both low-frequency disturbances and high-frequency measurement noise within their designated ranges. Finally, simulation results verify the effectiveness and superior performance of the proposed method.
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Conclusions​

This paper proposed a pole-placement-based VGESO for high-precision motion control of lithography stages. By introducing two pole-related parameters, the observer gains can be adjusted in a structured and intuitive manner, enabling a flexible trade-off between low-frequency disturbance rejection and high-frequency noise attenuation. Different from conventional high-gain ESO designs, the proposed VGESO reshapes the inherent coupling between disturbance suppression and noise amplification without increasing the observer order. Theoretical analysis and comparative simulations demonstrate that the proposed method achieves improved disturbance estimation accuracy and enhanced noise immunity over the conventional LESO, particularly under bandwidth-limited conditions. Future work will focus on experimental validation on a multi-degree-of-freedom motion stage and further investigation of the proposed observer in the presence of nonlinear effects and time-varying uncertainties.​

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tphuang

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Big if true..

PC Makers Eye Chinese Memory Chip Suppliers Amid Global Supply Crunch.

Leading PC manufacturers, including HP, Dell, Acer, and Asus, are exploring sourcing memory chips from Chinese suppliers like ChangXin Memory Technologies (CXMT) due to a global supply shortage. HP has begun qualifying CXMT's DRAM products for potential use in non-U.S. markets, while Dell is also testing its chips as prices continue to rise.

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I have my doubts about this. It seems like negotiating tactics by foreign PC OEMs to try to secure lower cost DRAMs from the big 3.
 

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新易盛/Eoptolink's 1.6T optical module has been validated on Nvidia's H100/GH200 platform and entered mass production. It is also in Google's 800G supply chain. It's 1.6T product use LPO & Si tech. 70% of orders from North America. It is now working on 3.2T end point for Nvidia's Quantum-X CPO.

Just today, Eoptolink says 1.6T will be a much higher % of its revenue for 2026.
 

tokenanalyst

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Bolainarun Quzhou Recognized as National High-Tech Enterprise


Zhejiang Bolainarun Electronic Materials Co., Ltd. (Bolainarun) has achieved a significant milestone as its Quzhou subsidiary has been officially certified as a National High-Tech Enterprise by China’s Ministry of Science and Technology.

A leading provider of semiconductor planarization solutions, Bolainarun specializes in the R&D and industrialization of advanced CMP (Chemical Mechanical Planarization) materials including nano-silica slurries, polishing pads, and silica sols for silicon, silicon carbide, and integrated circuit substrates. With over a decade of expertise, the company boasts a world-class R&D team of 60+ PhDs and Master’s graduates (20% PhD, 60% Master’s), over 10 patents under substantive examination, and dozens of intellectual property rights.

Bolainarun operates a robust innovation ecosystem through long-term collaborations with top institutions including Fudan University, Shanghai University, and the Shanghai Integrated Circuit Research Institute. Its Shanghai-based subsidiary, Yingzhi Abrasive Materials, hosts a recognized Academician and Expert Workstation, whose breakthrough in localized silicon carbide CMP material technology was honored as a 2025 “Excellent Case” by Shanghai authorities.
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The company has previously received multiple provincial honors, including Zhejiang Provincial Specialized and Innovative SME. Its products have garnered national recognition: its SiC CMP slurry won the Excellent Product Award at the 23rd China International Industry Fair, and its non-woven polishing pad was listed in Shanghai’s Innovative Product Recommendation Catalog.

This National High-Tech Enterprise certification marks a strategic leap in Bolainarun’s qualification ladder bridging provincial and national recognition and reinforces its position as a key domestic player in securing China’s semiconductor supply chain through independent innovation.

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tokenanalyst

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Huayu Transformation and Upgrading Fund completes investment in Hengfeng New Materials​


Founded in 2018, Hengfeng New Materials boasts a core team comprised of graduates from prestigious universities such as East China University of Science and Technology. With two decades of experience in the phenolic and epoxy resin industries, the company encompasses technology, production, and sales. Based on its two major production bases in Anhui and Taixing, the company has established a professional R&D center, creating an integrated support system from R&D to production. Hengfeng is committed to providing superior solutions for the sustainable development of the electronics industry. Leveraging its excellent product performance and stable quality assurance, the company has established long-term strategic partnerships with numerous leading companies in the industry. Its product portfolio is widely used in various applications including copper-clad laminates, epoxy molding compounds, photoresists, electronic adhesives, and other composite materials.

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tokenanalyst

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XingSi Semiconductor, a 5G/6G baseband chip developer, has completed a strategic financing round totaling nearly 1.5 billion yuan.​


Shanghai XingSi Semiconductor Co., Ltd., a leading developer of 5G/6G baseband chips, has successfully completed multiple rounds of strategic financing, raising nearly 1.5 billion yuan among the largest funding milestones in China’s commercial aerospace sector since early 2026. The round attracted prominent investors including Ceyuan Capital, Hengqin Shenhe Industrial Investment, Fujian Industrial Investment, New Momentum Capital, and several other state-backed and market-driven institutions. This substantial financial support underscores strong confidence in the company’s technological trajectory and its pivotal role in advancing next-generation communication infrastructure.

Founded in 2020 by a team with deep roots in Huawei's chip R&D and industry applications, XingSi Semiconductor has rapidly established itself as a key player in integrated air-space-ground communications. The company focuses on three core product lines: eMBB (enhanced mobile broadband), RedCap (reduced capability), and NTN (non-terrestrial network) baseband chips. Within its first month of operation, it secured 100 million yuan from Hillhouse Capital and achieved a milestone with the successful one-time tape-out of its 5G eMBB chip. By 2024, after raising 530 million yuan in Series B funding, its pre-investment valuation reached 3 billion yuan, reflecting growing industry recognition.

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XingSi Semiconductor has carved out a competitive edge by targeting the low-Earth orbit (LEO) satellite internet market with cutting-edge 5G/6G NTN technology. In 2025, it achieved global firsts by enabling the world’s first direct satellite high-definition video call using its self-developed chip under the 5G NTN standard a landmark validation of its innovation. The company has also contributed to international standards by integrating its core tech into the 3GPP NTN framework and completed system integration with major domestic LEO constellations. Commercially, it has secured certifications from two of the world’s top six smartphone makers, leading automakers, and telecom equipment firms, positioning itself as a key supplier in mobile phones, vehicles, drones, and low-altitude aircraft accelerating the rollout of seamless air-space-ground connectivity solutions.​

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tokenanalyst

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Xinhuazhang Advances EDA 2.0 with AI-Driven Innovation and Strategic Market Expansion


Since its founding, Xinhuazhang has been a pioneer in digital verification within the electronic design automation (EDA) ecosystem, focusing on agile, platform-based, intelligent, and cloud-native solutions. With over 200 patent applications and more than a dozen commercial-grade products, the company offers end-to-end EDA tools tailored for chip-to-system verification. In response to global semiconductor shifts particularly the push toward domestic self-reliance and fueled by rapid advancements in artificial intelligence, Xinhuazhang has strategically prioritized system-level verification for high-performance AI chips, high-performance computing (HPC), and advanced RISC-V architectures. This focus positions the company as a key enabler of China’s independent, secure, and scalable semiconductor design ecosystem.

The year 2025 marked Xinhuazhang's "Year of Technology Implementation and Market Acceleration," driven by strong demand for domestic EDA solutions amid global supply chain restructuring. The company achieved nearly 50% revenue growth, expanded its customer base significantly, and shipped over 100 hardware emulators nearly 40 deployed in large-scale cascaded configurations to verify ultra-large AI chips.

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Its formal verification tools surpassed international benchmarks in performance for intelligent computing chip verification, closing a critical gap in high-end EDA capabilities. These achievements were powered by a “scenario-driven innovation” strategy that embedded deep collaboration with industry leaders like Phytium and ZTE Microelectronics delivering breakthrough efficiency gains such as ninefold increases in operator proofs without additional manpower..
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Xinhuazhang embraced EDA 2.0 a paradigm shift from “following” global standards to “leading” technological innovation. The company implemented three core pillars: automation & intelligence, leveraging AI to transform verification from a manual task into an autonomous process (e.g., SVAEval reduced debugging time from days to hours); openness & standardization, opening APIs and supporting domestic server architectures to enable seamless integration with open-source projects like the “Xiangshan” processor; and platformization & service orientation, advancing its EDaaS model via the upgraded FusionFlex cloud platform, which now manages not just CPUs and emulators but also AI-capable GPUs. This allowed customers to access scalable verification power on demand, dramatically lowering entry barriers.

The company has harnessed generative AI to democratize high-end formal verification enabling junior engineers to master complex tasks in days rather than months via tools like GalaxEC-HEC and RV-APP. Its LLM-powered SVA generation tool, co-developed with ZTE Microelectronics, boosted development efficiency by 40%. The launch of ChatDV a large language model for digital verification further strengthens supply chain security. At the architectural level, GalaxFV’s AI-driven scheduling system intelligently optimizes massive verification tasks, outperforming traditional tools in throughput and scalability.

Driving Growth Through Ecosystem Synergy and Strategic Leadership

Looking ahead to 2026, Xinhuazhang has set a bold target of over 50% growth by accelerating the commercialization of AI-native solutions and deepening ecosystem collaboration. The company aims to expand beyond digital verification into backend design and IP integration, creating comprehensive ecosystems with partners across HPC, autonomous driving, and AI chip markets. It will further strengthen supply chain security through mutual verification initiatives and its “inclusive benefit for startups” program making mass-production-grade emulators freely available to accelerate innovation.

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