Chinese semiconductor thread II

tokenanalyst

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FlipFET technology opens a new era of 3D integration.​


The FlipFET proposed by the Peking University team is not a "partial improvement" to the CFET, but a fundamental reconstruction of the technical path of three-dimensional integration through a new design of "double-sided active area + flip chip + back-to-back self-alignment". Its core advantage is reflected in the precise solution to the pain points of the four major industries.

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FlipFET abandons the "vertical stacking of the same wafer" idea of CFET and adopts the "dual wafer bonding + flip thinning" process .

First, n-type transistors are manufactured on the front wafer , and then the back wafer is bonded, flipped, and thinned to manufacture p-type transistors on the back.

Through "planar distribution + double-sided layout", high-density integration of n/p transistors is achieved while avoiding the leakage current and alignment problems caused by vertical stacking.

FlipFET uses "self-aligned active area" technology to achieve "automatic alignment" of key transistor structures, significantly reducing dependence on photolithography accuracy;

At the same time, the introduction of "back-side lithography correction" can correct manufacturing deviations in real time and control the critical alignment error within 10 nanometers (far lower than the 5-nanometer requirement of CFET), with significant potential for yield improvement.

The entire manufacturing process of FlipFET adopts a low-temperature process below 400°C, which is perfectly compatible with the current mainstream copper interconnection technology and does not require changing materials or rebuilding production lines.

This means that manufacturers can achieve technological iteration without incurring huge upgrade costs, greatly lowering the threshold for commercialization.

Unlike the "fixed stack structure" of CFET, FlipFET supports "on-demand adjustment" and can adapt to both the fin structure of FinFET and the next-generation GAA nanosheet.

It is suitable for both high-density AI chips and low-power mobile chips. This versatility makes it a more viable technology solution than CFET.

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tokenanalyst

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Yitang Semiconductor's patent for "heating component for heat treatment equipment" is published​


Tianyancha shows that Beijing Yitong Semiconductor Technology Co., Ltd.’s patent for “heat treatment equipment heating component” has been announced. The application publication date is March 21, 2025, and the application publication number is CN119673811A.

The embodiment of the present disclosure provides a heating assembly for heat treatment equipment, wherein the heating assembly comprises: a lamp holder, the lamp holder comprises a first heating zone and a second heating zone, the first heating zone being surrounded by the second heating zone; a first heating lamp, a plurality of first heating lamps being arranged in the first heating zone; a second heating lamp, a plurality of second heating lamps being arranged in the second heating zone; wherein the first heating lamp is a circular lamp and the second heating lamp is a linear lamp. The technical solution of the embodiment of the present disclosure can perform heat treatment on the wafer by using two types of heating lamps, thereby improving the adjustability of the thermal power; heating the edge portion of the wafer by the second heating lamp can effectively reduce the temperature gradient of different areas of the substrate, optimize and improve the temperature uniformity and film formation uniformity; the second heating zone is arranged around the first heating zone, thereby reducing the thermal overlap area and facilitating the installation, commissioning and maintenance of the equipment.

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tokenanalyst

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Diankesi Instrument launches the new 3681B/BU handheld and modular antenna and feeder teste​


Recently, DES Instruments launched the 3681B/BU handheld and modular antenna and feeder testers. Covering a frequency range of 300kHz to 9GHz, these products offer measurement capabilities, including return loss, VSWR, cable loss, fault location, and TDR. Weighing just 1.6kg/0.4kg, they enable rapid evaluation of transmission line and antenna performance in on-site antenna and feeder systems.

The 3681B handheld antenna and cable tester features a 10.1-inch high-definition touchscreen display, intuitive test curve display, and a user-friendly interface. Its lightweight design allows users to easily handle multi-scenario field testing. The 3681BU, a USB bus module, is compact, efficient, and flexible. It can be used for parallel testing of multiple channels of S11 parameters on production lines, effectively improving test efficiency and providing users with a low-cost, multi-channel S11 parameter test system integration solution.

The 3681B/BU antenna and feeder tester integrates an embedded electronic calibration function, enabling one-click calibration without the need for external calibration components, effectively improving the efficiency of field antenna and feeder system testing and assurance. It supports DTF fault location and TDR testing, helping customers analyze cable fault locations and types. It can also measure time-domain impedance and is applicable to fields such as material testing and soil analysis.

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tokenanalyst

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Dianke Eastcom releases the new generation of public network intercom terminal C8200​


Dianke Dongxin launched the new generation C8200 public network intercom terminal, a professional intercom equipment that integrates high-performance communication, strong endurance, intelligent operation experience and industry safety standards.

With the acceleration of digital transformation, users are no longer satisfied with simply being able to intercom, but are increasingly focused on the stability, information capabilities, and intelligence of devices in multi-scenario, multi-network, and multi-task environments. To meet the communication habits and task requirements of users in key industries, Dianke Eastcom has innovatively developed the next-generation C8200 public network intercom terminal. This powerful product features a 2.8-inch HD touchscreen, a large 6700mAh battery, and IP68-rated water and dustproof technology. It operates stably in harsh environments such as rain, dust, and mud. Its 3W high-power sound cavity and noise reduction algorithm ensure clear voice calls even in high-noise environments such as airports, docks, and construction sites, eliminating the need for repeated calls and improving communication efficiency.

The product supports an independent Beidou positioning module, enabling precise positioning even in the absence of external system signals without additional interference, making it suitable for scenarios requiring the highest security. In an emergency, users can quickly initiate a one-touch alarm using the dedicated SOS physical button, automatically reporting their location for rapid response. The product seamlessly integrates and adapts to multiple industries, interoperating with traditional PDT systems. It supports simultaneous uploading of video intercom and on-site footage, and, combined with high-definition front and rear cameras and a stable video stream, helps command centers instantly grasp the actual situation on site and achieve precise dispatch.

In the future, Dianke Dongxin will continue to innovate and make breakthroughs, continue to increase its innovation efforts around the converged communication needs of multiple industries and multiple scenarios, and assist in the intelligent transformation of digital government and enterprise

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sunnymaxi

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Peking University team develops optoelectronic chips, laying the hardware foundation for "AI native network"

Recently, a team from Peking University and City University of Hong Kong proposed a new concept for a "universal optoelectronic fusion wireless transceiver engine." They developed an ultra-wideband optoelectronic fusion integrated chip, barely the size of a fingernail. This chip, capable of adaptively reconfigurable high-speed wireless communication with a coverage range exceeding 110GHz, boasts a single-channel real-time rate of 120Gbps. This means 1,000 8K ultra-high-definition movies can be simultaneously loaded in less than one second. This represents a significant leap in network speed, resolving the challenge of balancing bandwidth, noise performance, and reconfigurability.


This technology removes a key obstacle to the development of terahertz frequencies for 6G communications and may even facilitate the development of higher-frequency spectrum resources. A Peking University press release stated, "This breakthrough is expected to reshape the wireless communications landscape, becoming a technological engine for the wireless communications industry ecosystem and propelling China's leapfrogging from lagging behind to catching up to leading in this field."

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gotodistance

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SMIC's AI semiconductor yields plummet 30%, sales forecast halved.

SMIC, China's largest foundry (semiconductor contract manufacturing company), is facing a red flag for its plans to produce artificial intelligence (AI) chips. With yields at key processes hovering around 30% due to US sanctions on advanced equipment, global investment bank Morgan Stanley has effectively halved SMIC's AI chip-related revenue forecast. China's semiconductor boom has hit a snag due to technological limitations and external sanctions.

The biggest challenge facing SMIC is the low yield of its AI graphics processing units (GPUs). According to a Morgan Stanley report on the 7th (local time), SMIC's AI GPU yield is projected to remain at 30% by the end of 2025. This is a significant improvement compared to its competitor, Taiwan Semiconductor Manufacturing Company (TSMC), which boasts a yield of over 90% for its 5nm process.

US sanctions are cited as the fundamental cause of this low yield. SMIC is unable to secure cutting-edge extreme ultraviolet (EUV) lithography equipment from ASML in the Netherlands, forcing it to rely on older deep ultraviolet (DUV) equipment. Implementing 7nm-level fine processes using DUV equipment requires the use of "multi-patterning," a technique that involves repeatedly drawing circuits. This process is technically complex and increases production steps, leading to increased costs and lower yields. This is compounded by the lack of precision maintenance technology for Western manufacturers' equipment. In fact, SMIC suffered approximately 6% yield and production losses due to equipment inspection failures in the second quarter of 2025.

◇ Huawei Hit by Direct Hit: AI Chip Production Costs 'Snowballing'

US EUV Equipment Sanctions Hit Directly… Limitations of DUV Multi-Patterning Process Revealed
Huawei's AI Chip Production Costs Soar… Technology Gap with TSMC Widens
SMIC, China's largest semiconductor foundry, is facing disruptions in AI chip production due to US sanctions on advanced equipment. The inability to secure EUV equipment has led to yields dropping to around 30%, causing production costs for customers like Huawei to skyrocket and widening the technological gap with TSMC. Photo = Technetbook View larger image
SMIC, China's largest semiconductor foundry, is facing disruptions in its AI chip production due to US sanctions on advanced equipment. The inability to secure EUV equipment has led to yields dropping to around 30%, causing production costs for customers like Huawei to skyrocket and widening the technological gap with TSMC. Photo = Technetbook

China's largest foundry (semiconductor contract manufacturing) company SMIC's plans for artificial intelligence (AI) chip production are facing a red flag. With yields in key processes remaining at around 30% due to US sanctions on advanced equipment, global investment bank Morgan Stanley has effectively halved its forecast for SMIC's AI chip-related revenue. China's semiconductor growth is now facing challenges due to technological limitations and external sanctions.

The biggest challenge facing SMIC is the low yield of its AI graphics processing units (GPUs). According to a Morgan Stanley report on the 7th (local time), SMIC's AI GPU yield is projected to remain at 30% by the end of 2025. This is a very serious situation, compared to its competitor, Taiwan's TSMC, which boasts a 5nm process yield of over 90%.

The fundamental cause of this low yield is attributed to US sanctions. SMIC, unable to secure cutting-edge extreme ultraviolet (EUV) lithography equipment from ASML in the Netherlands, relies on older deep ultraviolet (DUV) equipment. To achieve 7nm-level fine processes using DUV equipment, it is necessary to use "multi-patterning," a technique that repeatedly draws circuits. This process is technically complex and requires multiple production steps, leading to higher costs and lower yields. Furthermore, the lack of precision maintenance skills for Western manufacturers' equipment has compounded the problem. In fact, SMIC suffered approximately 6% yield and production losses due to equipment inspection failures in the second quarter of 2025.

◇ Huawei Takes a Direct Hit, AI Chip Production Costs 'Snowball'

The production disruption has dealt a direct blow to Huawei, China's largest information and communications technology (IT) company. SMIC planned to produce Huawei's AI chip, the "Ascend 910B," at a monthly rate of 7,000 wafers this year, and transition to the high-performance "Ascend 910C," a chip combining two 910B dies, starting in 2026. However, this structure is bound to further increase yield and cost burdens. The low yield has led to a surge in chip production costs. This year, the production cost of a single Ascend 910B chip is expected to reach 50,000 yuan (approximately 9.74 million won), while the next-generation 910C chip is expected to cost 110,000 yuan (approximately 21.42 million won).

◇ Sales Forecast 'Halved'… Widening Technology Gap

Morgan Stanley has significantly lowered its revenue forecast for SMIC's AI chip division. The 2025 revenue forecast was lowered by nearly 50%: from 146 million yuan (approximately 28.4 billion won) to 58.5 million yuan (approximately 11.3 billion won), from 212 million yuan (approximately 41.3 billion won) to 94 million yuan (approximately 18.3 billion won) in 2026, and from 286.5 million yuan (approximately 55.8 billion won) to 136 million yuan (approximately 26.4 billion won) in 2027.

The report projects that SMIC's 910B chip yield will recover to 70% by 2027, but short-term production disruptions and financial impacts are unavoidable. Accordingly, SMIC is urgently investing an R&D budget of 30 to 75 million dollars (approximately 41.6 to 104.1 billion won) and is staking everything on securing yields by rapidly increasing production facilities, but it is assessed that the technological gap with Samsung Electronics and TSMC still remains.


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tokenanalyst

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SMIC's AI semiconductor yields plummet 30%, sales forecast halved.

SMIC, China's largest foundry (semiconductor contract manufacturing company), is facing a red flag for its plans to produce artificial intelligence (AI) chips. With yields at key processes hovering around 30% due to US sanctions on advanced equipment, global investment bank Morgan Stanley has effectively halved SMIC's AI chip-related revenue forecast. China's semiconductor boom has hit a snag due to technological limitations and external sanctions.

The biggest challenge facing SMIC is the low yield of its AI graphics processing units (GPUs). According to a Morgan Stanley report on the 7th (local time), SMIC's AI GPU yield is projected to remain at 30% by the end of 2025. This is a significant improvement compared to its competitor, Taiwan Semiconductor Manufacturing Company (TSMC), which boasts a yield of over 90% for its 5nm process.

US sanctions are cited as the fundamental cause of this low yield. SMIC is unable to secure cutting-edge extreme ultraviolet (EUV) lithography equipment from ASML in the Netherlands, forcing it to rely on older deep ultraviolet (DUV) equipment. Implementing 7nm-level fine processes using DUV equipment requires the use of "multi-patterning," a technique that involves repeatedly drawing circuits. This process is technically complex and increases production steps, leading to increased costs and lower yields. This is compounded by the lack of precision maintenance technology for Western manufacturers' equipment. In fact, SMIC suffered approximately 6% yield and production losses due to equipment inspection failures in the second quarter of 2025.

◇ Huawei Hit by Direct Hit: AI Chip Production Costs 'Snowballing'

US EUV Equipment Sanctions Hit Directly… Limitations of DUV Multi-Patterning Process Revealed
Huawei's AI Chip Production Costs Soar… Technology Gap with TSMC Widens
SMIC, China's largest semiconductor foundry, is facing disruptions in AI chip production due to US sanctions on advanced equipment. The inability to secure EUV equipment has led to yields dropping to around 30%, causing production costs for customers like Huawei to skyrocket and widening the technological gap with TSMC. Photo = Technetbook View larger image
SMIC, China's largest semiconductor foundry, is facing disruptions in its AI chip production due to US sanctions on advanced equipment. The inability to secure EUV equipment has led to yields dropping to around 30%, causing production costs for customers like Huawei to skyrocket and widening the technological gap with TSMC. Photo = Technetbook

China's largest foundry (semiconductor contract manufacturing) company SMIC's plans for artificial intelligence (AI) chip production are facing a red flag. With yields in key processes remaining at around 30% due to US sanctions on advanced equipment, global investment bank Morgan Stanley has effectively halved its forecast for SMIC's AI chip-related revenue. China's semiconductor growth is now facing challenges due to technological limitations and external sanctions.

The biggest challenge facing SMIC is the low yield of its AI graphics processing units (GPUs). According to a Morgan Stanley report on the 7th (local time), SMIC's AI GPU yield is projected to remain at 30% by the end of 2025. This is a very serious situation, compared to its competitor, Taiwan's TSMC, which boasts a 5nm process yield of over 90%.

The fundamental cause of this low yield is attributed to US sanctions. SMIC, unable to secure cutting-edge extreme ultraviolet (EUV) lithography equipment from ASML in the Netherlands, relies on older deep ultraviolet (DUV) equipment. To achieve 7nm-level fine processes using DUV equipment, it is necessary to use "multi-patterning," a technique that repeatedly draws circuits. This process is technically complex and requires multiple production steps, leading to higher costs and lower yields. Furthermore, the lack of precision maintenance skills for Western manufacturers' equipment has compounded the problem. In fact, SMIC suffered approximately 6% yield and production losses due to equipment inspection failures in the second quarter of 2025.

◇ Huawei Takes a Direct Hit, AI Chip Production Costs 'Snowball'

The production disruption has dealt a direct blow to Huawei, China's largest information and communications technology (IT) company. SMIC planned to produce Huawei's AI chip, the "Ascend 910B," at a monthly rate of 7,000 wafers this year, and transition to the high-performance "Ascend 910C," a chip combining two 910B dies, starting in 2026. However, this structure is bound to further increase yield and cost burdens. The low yield has led to a surge in chip production costs. This year, the production cost of a single Ascend 910B chip is expected to reach 50,000 yuan (approximately 9.74 million won), while the next-generation 910C chip is expected to cost 110,000 yuan (approximately 21.42 million won).

◇ Sales Forecast 'Halved'… Widening Technology Gap

Morgan Stanley has significantly lowered its revenue forecast for SMIC's AI chip division. The 2025 revenue forecast was lowered by nearly 50%: from 146 million yuan (approximately 28.4 billion won) to 58.5 million yuan (approximately 11.3 billion won), from 212 million yuan (approximately 41.3 billion won) to 94 million yuan (approximately 18.3 billion won) in 2026, and from 286.5 million yuan (approximately 55.8 billion won) to 136 million yuan (approximately 26.4 billion won) in 2027.

The report projects that SMIC's 910B chip yield will recover to 70% by 2027, but short-term production disruptions and financial impacts are unavoidable. Accordingly, SMIC is urgently investing an R&D budget of 30 to 75 million dollars (approximately 41.6 to 104.1 billion won) and is staking everything on securing yields by rapidly increasing production facilities, but it is assessed that the technological gap with Samsung Electronics and TSMC still remains.


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Source: The Super Duper Ninja Spy that they have inside SMIC. ;)

-Revenue in the double digits.
-Fab utilization above 90%
-Huawei selling smartphones like there is no tomorrow.
- Ren Zhengfei stating that the chip situation has stabilized.
- Cambricon another sanctioned company achieving 1000% revenue.
-Self-sufficient above 45%
-And so on.
 
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