Chinese semiconductor thread II

gelgoog

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"China's domestic chip equipment sector has grown alongside its imports, with the top five domestic players all reporting record-high revenue last year, according to Nikkei Asia's analysis. Four of them also delivered their highest-ever net profits last year. Naura Technology, for example, saw its net profit surge more than 44% and its revenue climb 35%. It broke into the global top six of equipment makers by revenue in 2024, a space that has always been dominated by U.S., European and Japanese players.

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"We've also noticed increasing talent outflows from Japanese and South Korean suppliers to China, including retired senior engineers," the executive said. "In the longer term, three to five years, Chinese homegrown tool suppliers' technological breakthroughs will meaningfully affect foreign suppliers' market share and cause greater pressure.""
 

tokenanalyst

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Eswin Computing's RISC-V core obtains TÜV Rheinland ASIL-B certification, opening a new chapter in functional safety.​

Recently, Eswi Computing's RISC-V core R500A passed the ASIL-B functional safety certification issued by TÜV Rheinland, Germany, becoming the world's first RISC-V core to pass the TÜV Rheinland ASIL-B functional safety certification.

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As a century-old authority in the field of functional safety (established in 1872), TÜV Rheinland has established strict standards for many high-security scenarios such as automotive electronics with its profound background. Its certification process is extremely strict, covering in-depth testing of the entire process from design to finished products. It is an internationally leading provider of testing, inspection, certification, training, and consulting services. This certification marks that Eswin Computing R500A has entered the first-tier camp in the field of functional safety, providing developers with a new choice of kernel architecture that is both open and reliable.

Eswin Computing R500A is a high-performance 32-bit RISC-V automotive-grade real-time kernel product. Its CoreMark performance is as high as 5.794 CoreMarks/MHz, which means that it can achieve a computing performance of about 5.794 points per MHz, and the DMIPS in legal and best reach 2.552 and 7.297DMIPS/MHz respectively. With its streamlined and efficient architecture design, R500A excels in real-time, low latency and security isolation.

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High-security critical areas such as automotive braking systems and precision industrial control have long been dominated by closed-source technology solutions, which have formed a technical application barrier. With its open and flexible architecture design, Eswin Computing's RISC-V core R500A can adapt to the diverse needs of different customers, help automakers and industrial customers accelerate technology implementation, and bring a new choice with both customization and cost advantages to the industry.
As early as September 28, 2022, Eswi Computing obtained the ASIL-D functional safety system certification (the highest level of automotive safety integrity), which covers the entire technical process from kernel design, system development to verification tools. This certification fully proves that the technical solution built on the RISC-V architecture has the core capabilities to support "zero fault tolerance" extreme scenarios such as autonomous driving and avionics. This not only lays a solid foundation for RISC-V to enter high-barrier markets such as L4/L5 autonomous driving and medical devices in the future, but also means that the application potential of the RISC-V architecture in the fields of high security and high reliability has been fully released, and it is expected to promote the iterative upgrade of relevant industry technical standards.

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tokenanalyst

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Firstway Technology's first GaN MOCVD epitaxial equipment is officially shipped​


On June 16, 2025, the first GaN MOCVD BrillMO epitaxial equipment of Wuxi Xianwei Technology Co., Ltd. was officially shipped to the leading compound semiconductor company in China. This is an important milestone in the development of Xianwei Technology and a concentrated reflection of the company's technical strength in the field of compound semiconductor equipment. Qin Shu, Secretary General of Jiangsu Semiconductor Industry Association, Zhou Dejin, Secretary General of Wuxi Integrated Circuit Society, Ao Jinping, Professor of School of Integrated Circuits of Jiangnan University, Wang Yanqing, Chairman of Xiandao Group, and other guests attended the delivery ceremony and delivered speeches.

The GaN MOCVD BrillMO epitaxial equipment shipped by Xianwei Technology this time has reached the industry-leading level in all aspects of performance. The equipment is unique in design and uses a unique temperature field and flow field design. It can not only achieve high-quality film formation, providing a solid guarantee for GaN epitaxial manufacturing of power chips, RF chips, and Micro LED chips , but also has excellent performance , which can greatly improve production efficiency and effectively reduce the cost of use, providing customers with excellent GaN epitaxial processing solutions.

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As an innovative product of Xianwei Technology, this equipment has complete independent intellectual property rights through dedicated forward research and development, and can effectively promote the domestic independence of compound semiconductor epitaxial equipment. The delivery of GaN MOCVD epitaxial equipment is not only a major breakthrough in the development of Xianwei Technology itself, but also another important achievement of the "equipment independence" strategy of Xiandao Group in the semiconductor field.

In the future, Xianwei Technology will continue to adhere to the development concept centered on technological innovation, work hand in hand with industry partners to inject continuous innovative vitality into the upgrading and development of the industry, and contribute to the domestic independence of semiconductor equipment .

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tokenanalyst

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China's first carbon-based integrated circuit production line officially put into operation.​


the Chongqing Carbon-based Integrated Circuit Research Institute of Peking University announced in Chongqing that the first carbon-based integrated circuit production line in China has been officially put into operation and entered the mass production stage. This milestone breakthrough not only fills the gap in the field of carbon-based integrated circuit industrialization in China, but also marks that China has successfully seized a key opportunity in the track of integrated circuit technology innovation.

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Integrated circuits are the core of modern electronic devices and are widely used in computers, smartphones and various electronic products. The mainstream chips on the market are mainly based on silicon, but with the continuous advancement of technology, the performance improvement of silicon-based chips is gradually limited by Moore's Law. Against this background, researchers have begun to explore the application of new materials since the beginning of this century, among which carbon-based chips are seen as a novel and promising option.

Professor Zhang Zhiyong is a professor at the School of Electronics of Peking University and also serves as the dean of the Chongqing Carbon-based Institute of Peking University. In an interview, he said: "Carbon-based integrated circuit technology is considered to be one of the most promising future directions to replace silicon-based technology." Silicon-based chips have been developed in the United States for more than 60 years. In the research and development of silicon-based chips, China lags behind a lot. Whether it is materials, equipment, software, manufacturing processes, etc., they are all purchased from others. It is not realistic to "overtake" on the silicon-based road, and we need to "change lanes." Carbon-based chips are a brand new track for the world, not to mention that we are currently in a relatively leading position, and we may even be able to "change lanes and overtake" with this. "If we want to be free from being controlled by others, we must develop our own integrated circuit technology." Professor Zhang Zhiyong said frankly. This shows that carbon materials have great potential in improving the performance of integrated circuits .

The superior electrical properties, thermal properties and chemical stability of carbon-based materials give them unique advantages in high-frequency, high-power and low-power applications. Carbon is a "close relative" of silicon. Carbon nanotubes, as the core material of carbon-based chips, are tiny tubular structures composed of carbon atoms with ultra-thin structures, excellent electrical properties and chemical stability. Using it to make carbon-based chips can improve the comprehensive performance by hundreds or thousands of times compared to silicon-based integrated circuits, and has the advantages of low cost and low power consumption . At the same time, carbon-based chips can bypass the "bottleneck" problem brought by lithography machines to China's chip manufacturing. In addition, the application potential of carbon-based materials in flexible electronic products, sensors and other new electronic devices has also attracted widespread attention.

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tokenanalyst

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Domestic SiC is used in aircraft! This company joins hands with GAC​


On June 13, according to the official microblog of Junlian Electronics, the eVTOL SiC controller jointly developed by it and GAC Goland has been applied to GOVY AirCab. As the world's first mass-produced unmanned multi-rotor eVTOL (electric vertical take-off and landing) aircraft, GAC Goland GOVY AirCab was officially released a few days ago.

In this regard, Junlian Electronics stated that as a partner of GAC Go-Universal's electric engine controller, Junlian Electronics and GAC Go-Universal jointly developed the GOVY AirCab model electric engine SiC controller, and is the only supplier of the AirCab airworthy mass-produced model electric engine SiC controller.

It is understood that Junlian Electronics and GAC High-tech have been conducting technical exchanges and docking on eVTOL aircraft electric engine controller products since the end of 2023, and have successively experienced the development, trial production and verification cooperation of principle prototypes. With its development and mass production application experience in 800V high-voltage technology and SiC power modules, as well as its comprehensive advantages in technical solutions, R&D strength, experimental testing, production capacity and supporting services, Junlian Electronics successfully obtained the designated order of AirCab's airworthy mass-produced electric engine SiC controller at the end of 2024. Both parties are accelerating the work of airworthiness and mass production delivery of electric engine controllers.

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24 hours after the release of GOVY AirCab, the number of pre-orders was nearly 1,000. GAC Goland revealed that the price of GOVY AirCab products will not exceed 1.68 million yuan, and plans to gradually launch demonstration operations, establish a demonstration operation area in Guangdong, Hong Kong and Macao by the end of 2025, and officially start delivery by the end of 2026.

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tokenanalyst

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Source Optimization Based on the Partially Coherent Imaging Model.​

Abstract:​

Extreme Ultraviolet Lithography (EUVL) has been utilized in the manufacturing of integrated circuit with 5nm node and beyond. Free Electron Laser (FEL) has the potential to substitute traditional Laser Produced Plasma (LPP) source in the EUV scanners for its high power ability. However, FEL has the characteristic of high spatial coherence, which would affect the results of computational lithography. This paper proposes source optimization (SO) method for EUVL, which takes into account the coherence of the light source. After considering the coherence among the source points in the "effective source", the partially coherent imaging model is firstly established. Then, an efficient SO method is discussed based on the gradient-based algorithm. Finally, the effectiveness of SO method is demonstrated from the simulation. Results illustrate that the proposed SO can reduce the lithographic pattern errors caused by the spatial coherence.​

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tokenanalyst

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A Wafer Temperature Control System for Advanced Technology Node Manufacturing​


Advanced Micro-Fabrication Equipment Inc. China (AMEC)​

Abstract:​

Precise temperature control plays a crucial role of whole wafer uniformity in the manufacturing processes of advanced technology node. This paper presents AMEC’s wafer- temperature-control system, Durga II, which features adjustable local temperature fine tuning capabilities enabled by a separately controllable multi-zones electrostatic-chuck (ESC). The system demonstrates significant performance enhancements, achieving over 60% improvement in temperature distribution 3-sigma and range value on 300-mm wafer compared to traditional ESC. Additionally, Durga II enables post-etch amorphous-silicon thickness uniformity (TKU) of <10Å (3sigma) when plasma is involved, outperforming traditional CMP process and gas cluster ion beam (GCIB) methods as reported in prior studies. Beyond TKU, the system also supports critical dimension uniformity (CDU) tuning. Unlike traditional "feed-back" uniformity improvement relies on post etch performance, Durga II introduces a "feed-forward" tuning capability based on incoming film stack and CD/lithograph data. This system can be applied to both logic and memory chips etch manufacturing, which will greatly improve the accuracy and reliability in mass production by precise temperature control.​

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