Comrade Chuan is making China great again!
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Of course they are on the surge , having your larger competitors excluded from your own local market is literally the definition of Living Rent Free.
1. HuaDa JiuTian
As the leading domestic EDA company in the entire analog circuit design process, it covers design tool systems for analog circuits, storage circuits, radio frequency circuits, etc. It is the only local company that can provide full-process analog solutions.
In 2023, the company's revenue will be 1.01 billion yuan, and its market share will remain the largest in the local market. It will also complete the chiplet design tool chain through the acquisition of Xinhe Semiconductor, aiming to build full-stack capabilities covering chip design, manufacturing, and packaging.
Stimulated by the news of US EDA restrictions, the stock price surged by 15.6% on May 29.
2. Prologix Electronics
It has reached the international leading level in the field of device modeling and simulation, and its SPICE simulator has passed 7nm/5nm process verification. Its customers include leading wafer fabs such as TSMC and SMIC.
In 2023, the revenue share of design EDA will increase to 30%, and through multiple mergers and acquisitions, a full EDA layout will be formed, including key links such as digital simulation verification and logic synthesis.
On May 29, the stock price hit the daily limit, with an increase of 20%.
3. Guangli Microelectronics
Focusing on improving chip yield and wafer-level testing, the testing equipment and accessories business accounts for more than 80%, and DFM (design for manufacturability) tools are widely used in production lines such as SMIC and Yangtze Memory.
By acquiring Yiruixin, it entered the design EDA field and formed a closed loop of "design-manufacturing-testing". In 2023, the software development business increased by 34.3% year-on-year.
On May 29, the stock price rose by 16.33%.
The can now invest in new products.
I've actually never heard of them before that Nikkei article. The more well known ones a Xuzhou Bokang, RA Chem and Shanghai Sinyang. Do you have more details on this company?
Anlu Technology: A domestic FPGA innovator, accelerating its rise in the automotive electronics track
After years of in-depth development, Anlu Technology has built a complete automotive electronics technology chain of "chips-solutions-terminals", providing strong support for automotive-grade innovative applications and in-depth development in the automotive electronics field.
Chip layer: Diverse product matrix to meet diverse needs
According to Yao Yang, marketing director of Shanghai Anlu Information Technology Co., Ltd., "Anlu Technology's automotive chip models have now begun to be fully deployed, currently including PH1A100GSG324A/PH1P35MEG324A (Phoenix series), DR1M90GEG484A (Flying Dragon series) and EF4L90CG324A (SALELF series). These four chips are representative models in Anlu Technology's mainstream series and can be used in scenarios such as electronic rearview mirrors, smart cockpits and vehicle electronic controls."
Specifically, the PH1A100GSG324A chip has up to 127K logic units, high-speed serial I/O, rich storage resources and IP resources, meets the automotive AEC-Q100 (Grade 2) standard, and is widely used in smart cockpits and other fields. The PH1P35MEG324A targets the lightweight embedded programmable logic market, integrates a RISC-V processor, and together with high-performance logic, DSP, BRAM, and MIPI DPHY resources, it forms a powerful processing core, supplemented by a large-capacity high-speed memory of 512Mbits to 1Gbits, matching application scenarios such as LiDAR and smart cockpits.
The Feilong series products are positioned as high-performance innovative FPGA products, realizing the cutting-edge technology of ARM/RISC-V + FPGA + specific hard-core multi-architecture integration. The EF4L90CG324A is the fourth-generation low-end FPGA product built by Anlu Technology based on automotive device standards. It adopts low-power technology, equivalent to 9K LUTs logic resources, supports up to 279 user I/Os, meets the automotive AEC-Q100 (Grade 2) standard, and meets the needs of signal fusion of increasingly complex sensors inside the vehicle with rich IO and logic resources.
The “Feilong” series stands out and has high market recognition
Among Anlu Technology's various automotive chips, the SALDRAGON® series FPSoC® devices have become the focus. After their launch, they have quickly gained recognition from the industry and the market, winning the "Innovative IC Excellent Product Award" and "Market Excellence Award".
In November 2023, Anlu Technology released the SALDRAGON® Feilong series FPSoC® device, which integrates a hard-core processor system dual-core ARM Cortex-A35 or 64-bit RISC-V, FPGA programmable logic, and integrated NPU, forming two product series of hard-core high-performance ARM v8 processor products or high-performance RISC-V 64bit processors, and has the advantages of Anlu FPGA's flexibility, low power consumption, software and hardware programmability, and scalable SoC platform. In addition, the ARM or RISC-V processor is combined with on-chip RAM, and supports multiple types of memory interfaces and rich peripheral ports, providing more abundant adaptation scenarios for the application side.
Yao Yang said that the Feilong series FPSoC® devices have been popular among customers and industry users for more than a year since they were launched. "The reason why the Feilong series has achieved such success is that we focus on learning advanced industry experience, staying close to customers, listening carefully to customer needs and feedback, planning products from the customer's perspective, and maximizing optimization and fine-tuning products, so as to help customers significantly improve system performance and meet diverse needs."
Strengthening layout, the prospect of domestic "core" optical fiber is promising
At present, Anlu Technology has carefully built five major product matrices with programmable devices as the core, covering a wide range of application needs from high performance to low power consumption, including the high-performance SALPHOENIX® series, the high-performance SALDRAGON® series , the high-efficiency SALEAGLE® series, the low-power SALELF® series, and the SALSWIFT® system-on-chip series FPSoC® , which are widely used in industrial control, consumer electronics, medical equipment, network communications, automotive electronics and other fields, and are committed to continuously providing a full set of cost-effective solutions to help complete the layout of domestic FPGAs.
Anlu Technology is committed to providing customers with end-to-end rapid response and technical support, including providing a complete development and design toolkit, striving to enable users to quickly get started and design efficiently. It provides comprehensive and layout routing for the entire ecosystem, embedded debugging tool set FutureDynasty® , SoC development environment and SDK, and also provides various IP resources and software driver packages. Relying on the original ecosystem of ARM and RISC-V, it supports a variety of OS, stacks and IP ecosystems, and promotes customers to quickly achieve product design and market launch.
With the accelerated arrival of edge computing technology innovation, the Internet of Vehicles and autonomous driving continue to develop. FPGA, as an important "adhesive", is suitable for assisting the realization of products with high real-time requirements with its highly parallel internal structure, and even adapts to neural network acceleration. Anlu Technology will continue to increase its R&D investment and technological innovation in related vehicle-mounted chips. In the second half of this year, it will release new car-specification models of the SALPHOENIX® series, and will continue to release related products in the future to meet the diverse specification requirements of the entire automotive industry.
Investment exceeds 3 billion! Changsha Huike builds IGZO project with monthly production capacity of 15,000 pieces.
the Management Committee of Liuyang Economic and Technological Development Zone recently disclosed that Changsha HKC Optoelectronics Co., Ltd. plans to invest 300,007.36 million yuan to build the Changsha Oxide R&D and industrialization project .
The project is planned to be built on the east side of the main plant of HKC in Changsha, covering an area of 15,486m2 and a total construction area of 60,000m2 . The project mainly includes production plants and supporting waste gas treatment facilities. The product is indium gallium zinc oxide (IGZO) process array glass substrate, with a production plan and scale of 15,000 pieces/month.
The project is planned to be built on the east side of the main plant of HKC in Changsha, covering an area of 15,486m2 and a total construction area of 60,000m2 . The project mainly includes production plants and supporting waste gas treatment facilities. The product is indium gallium zinc oxide (IGZO) process array glass substrate, with a production plan and scale of 15,000 pieces/month.
Han's Semiconductor's SiC ingot laser stripping technology reduces the wafer consumption to 470μm in 15 minutes!
Silicon carbide (SiC) chips have shown extremely broad application prospects in many cutting-edge fields such as new energy vehicles, radar base stations, 5G communications, and smart grids, becoming the core driving force to push these industries to a higher level and achieve transformation and upgrading. However, the high hardness characteristics of SiC materials have brought unprecedented challenges to the traditional multi-wire cutting substrate processing method. Pain points such as severe material loss, low processing efficiency, and high processing costs have become key bottlenecks restricting the development of the industry. As the wafer size gradually expands from 6 inches to 12 inches, the difficulties faced by traditional wire cutting in dealing with larger wafers are becoming more severe. In this industry context, SiC ingot laser stripping technology came into being. With its huge advantages such as low material loss, high chip output rate, and high efficiency, it has gradually become the mainstream technology in the field of large-size SiC ingot cutting.
However, it is not easy for laser wafer technology to achieve excellent process quality while achieving efficient operation of production efficiency. At the 5th Automotive 8-inch SiC Mass Production Technology and Automotive & Digital Energy Application Conference held on May 15, 2025 , Mr. Wu Lijie, General Manager of the Product Line of Han's Semiconductor, specifically pointed out that the core goal of this technology is to significantly reduce manufacturing costs for customers. To achieve this goal, it is necessary to focus on the following key points: high wafer output rate, high processing efficiency, high automation level, high processing yield, and low production consumables. Han's Semiconductor, with its strong R&D strength and innovative spirit, has made further breakthroughs in technological achievements based on the laser stripping QCB (Qian Ceng Bing) technology: in terms of cutting loss, it has achieved 8-inch 350μm conductive substrate cutting, with a single-piece total loss of <70-80μm and a unit loss of <450-470μm (unit loss = last ingot thickness - ingot thickness after stripping one wafer), that is, 20mm crystal rod, and the number of wafers output has increased to 42-44 pcs ; in terms of processing efficiency, it has achieved 8-inch 350μm conductive substrate cutting, and the single-piece operation time has been shortened to less than 15min/pcs ; in terms of processing consumables, the stripping surface is flat, the roughness is good, the TTV is small, and the damage to the grinding wheel is reduced. Under the same conditions, the wear is 40% lower than the industry average , reducing the grinding wheel loss; the above technological breakthroughs provide guarantees for achieving lower loss, high efficiency, intelligent and automated ingot stripping, and further reduce the SiC ingot cutting manufacturing costs in all aspects.
However, it is not easy for laser wafer technology to achieve excellent process quality while achieving efficient operation of production efficiency. At the 5th Automotive 8-inch SiC Mass Production Technology and Automotive & Digital Energy Application Conference held on May 15, 2025 , Mr. Wu Lijie, General Manager of the Product Line of Han's Semiconductor, specifically pointed out that the core goal of this technology is to significantly reduce manufacturing costs for customers. To achieve this goal, it is necessary to focus on the following key points: high wafer output rate, high processing efficiency, high automation level, high processing yield, and low production consumables. Han's Semiconductor, with its strong R&D strength and innovative spirit, has made further breakthroughs in technological achievements based on the laser stripping QCB (Qian Ceng Bing) technology: in terms of cutting loss, it has achieved 8-inch 350μm conductive substrate cutting, with a single-piece total loss of <70-80μm and a unit loss of <450-470μm (unit loss = last ingot thickness - ingot thickness after stripping one wafer), that is, 20mm crystal rod, and the number of wafers output has increased to 42-44 pcs ; in terms of processing efficiency, it has achieved 8-inch 350μm conductive substrate cutting, and the single-piece operation time has been shortened to less than 15min/pcs ; in terms of processing consumables, the stripping surface is flat, the roughness is good, the TTV is small, and the damage to the grinding wheel is reduced. Under the same conditions, the wear is 40% lower than the industry average , reducing the grinding wheel loss; the above technological breakthroughs provide guarantees for achieving lower loss, high efficiency, intelligent and automated ingot stripping, and further reduce the SiC ingot cutting manufacturing costs in all aspects.
Guona Semiconductor's "Wafer Defect Detection Equipment" patent is authorized
Tianyancha shows that Shanghai Guona Semiconductor Technology Co., Ltd. recently obtained a patent called "Wafer Defect Detection Equipment", with the authorization announcement number CN112466787B, the authorization announcement date is March 14, 2025, and the application date is November 25, 2020.
A wafer defect detection device includes: a wafer stage for fixing a wafer to be detected; an immersion liquid providing module for providing an immersion liquid to immerse the wafer to be detected on the wafer stage in the immersion liquid, wherein the refractive index of the immersion liquid is greater than the refractive index of air; an image acquisition module, wherein the image acquisition module includes a camera array, wherein the image acquisition module obtains a detection image corresponding to the entire surface of the wafer to be detected by shooting with the camera array at one time, and when shooting, at least part of the camera array is immersed in the immersion liquid; and a defect judgment module, wherein the defect judgment module judges whether there is a defect on the surface of the wafer to be detected based on the detection image obtained by the image acquisition module. The wafer defect detection device of the present invention improves the defect detection accuracy.