Chinese semiconductor thread II

[tokenanalyst]

AMEC establishes private equity fund to invest in the industry chain​

Shanghai Zhiwei Private Equity Fund Management Co., Ltd. was established with a registered capital of RMB 10 million. The legal representative is Liu Xiaoyu. The business scope includes private equity investment fund management and venture capital fund management services. The new fund is registered in the Lingang New Area.

The shareholders of Shanghai Zhiwei Private Equity Fund Management Co., Ltd. include Liu Xiaoyu (shareholding 45% and subscribed capital of 4.5 million yuan), China Micro Semiconductor (Shanghai) Co., Ltd. (shareholding 45% and subscribed capital of 4.5 million yuan), and Jiaxing Furenheng Enterprise Management Partnership (Limited Partnership) (shareholding 10% and subscribed capital of 1 million yuan).

On January 14 this year, AMEC issued an "Announcement on Joint Investment with Related Parties to Establish a Private Equity Fund Manager and Related Transactions". The announcement shows that in order to further strengthen the upstream and downstream collaboration of the industrial chain, the company's wholly-owned subsidiary AMEC (Shanghai) Co., Ltd. (hereinafter referred to as "AMEC Shanghai") intends to jointly invest with Liu Xiaoyu and Jiaxing Furenheng Enterprise Management Partnership (Limited Partnership) (hereinafter referred to as "Furenheng") to establish Shanghai Zhiwei Private Equity Fund Management Co., Ltd. (hereinafter referred to as "Zhiwei Company"). Zhiwei Company has a registered capital of 10 million yuan, of which Liu Xiaoyu subscribed 4.5 million yuan and held 45% of the shares; AMEC Shanghai subscribed 4.5 million yuan and held 45% of the shares; Furenheng subscribed 1 million yuan and held 10% of the shares.

In addition, the announcement shows that Liu Xiaoyu has worked in SMIC and AMEC for more than 20 years. He has accumulated rich work experience in these two leading semiconductor companies, established extensive semiconductor industry connections, and has a deep understanding of the semiconductor industry and capital markets. During his tenure at AMEC, he was responsible for AMEC's investment business and participated in more than 30 projects, involving an investment amount of more than 2 billion yuan. Investment cases include Tuojing Technology, SMIC, Tianyue Advanced, Huahong Company, Delong Laser, Jingsheng Shares, Kema Technology, Pioneer Precision, etc., with outstanding performance. The cooperation with Liu Xiaoyu as a private equity fund manager can give full play to the company's financial and industry advantages and further strengthen the upstream and downstream collaboration of the company's industrial chain. Furenheng is a partnership established by Liu Xiaoyu and Xu Jing. The company and Liu Xiaoyu and Xu Jing, who have rich investment experience in the semiconductor field, jointly invested in the establishment of a private equity fund manager, which can provide value judgment for future investment projects and help enhance the market competitiveness of the invested enterprises .

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[LanceD23]

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[gelgoog]

sanctions on CXMT was expected ever since they broke the 16nm DRAM barrier and news came for 15nm DRAM next year.
plant 2 of CXMT coming online. they have been working with domestic players.. NAURA/AMEC/Piotech tools are now mature enough to take the lead from US tools.
NAURA/AMEC broke top10 list of Semi equipment companies in 2024.. two more companies will join the list this year.

CXMT and YMTC's Fab 2 shells are actually two shells 2A and 2B. One has to wonder why they made them like that unlike the original plan for a single large shell for Fab 2 in both cases.

My suspicion is they run two separate production lines with different processes and/or tools and this way they can work in isolation.

CXMT Fabs A1 and A2A, A2B at Hefei. Coordinates: N 31.96785 E 117.02013

Recent Sentinel-2 picture:

Original architect design:

 

[tphuang]

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Unisoc with T8300 SoC displayed. Still low end 6nm SoC btw. No NPU. 2 A78 + 6 A55, so low cost core design also. uses LPDDR4x

 

[OptimusLion]

Quanxin Micro Integrated Circuit Packaging and Testing Project will start trial production in April

The first chip packaging and testing project in Yanbian Prefecture, the all-core micro-integrated circuit packaging and testing project located in Yanji High-tech Industrial Development Zone, is being built in an intensive and orderly manner. It is expected that some production lines will be debugged and trial production will be carried out in April this year.

The project covers an area of 22,000 square meters. At present, the production area and office area have been completed, and workers are currently working on infrastructure improvement, interior decoration, equipment installation, etc. 38 precision equipment were in place in January, waiting for online commissioning.

"The project is mainly engaged in chip packaging and testing, which are used in various fields such as smartphones, home appliances, and LED lights. After reaching full production, the annual output value is expected to be 225 million yuan, and the annual tax payment is 25.8 million yuan." Luo Cong, deputy director of the High-tech Zone Enterprise Service Bureau, introduced that the project has a total investment of 320 million yuan and commenced construction in the first half of 2024. After the trial production was put into operation in April, through the school-enterprise cooperation, the industry-university-research cooperation was carried out with colleges and universities in Yanbian Prefecture. The first phase of the project provided employment for about 200 people.

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[tokenanalyst]

The groundbreaking ceremony for the Xinyuan Micro high-end wafer processing equipment industrialization innovation road project were grandly held.​

March 2, the mobilization meeting for the resumption of work of key spring projects in Hunnan District, Shenyang City and the groundbreaking ceremony for the Xinyuanwei high-end wafer processing equipment industrialization innovation road project were held at the Xinyuanwei Innovation Road plot. Lv Zhicheng, deputy secretary of the Shenyang Municipal Party Committee and mayor, Yan Zhanfeng, secretary of the Hunnan District Party Committee, Ren Lihui, district mayor, shareholder guests, representatives of cooperative units, company leaders and employee representatives witnessed the new starting point of Xinyuanwei's rapid development at the scene.

The development process of Xinyuan Micro, especially the planning and construction of the two plant projects, has received strong support from various departments of the municipal government. The growth process of Xinyuan Micro is also a microcosm of the vigorous development of high-tech industries in Hunan District, Shenyang. The new Xinyuan plant will be oriented towards artificial intelligence and three-dimensional packaging, and will build a first-class domestic advanced semiconductor equipment R&D center to ensure national industrial security!

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[tphuang]

Xuantie's first server-level RISC-V processor C930 will be delivered next month

On February 28, the reporter learned from the 2025 Xuantie RISC-V Ecological Conference held by the DAMO Academy that Xuantie's highest-performance processor C930 will start delivery in March. The general computing power performance of C930 reaches 15/GHz in the SPECint2006 benchmark test, and is aimed at server-level high-performance application scenarios. At the same time, C930 is equipped with 512 bits RVV1.0 and 8 TOPS Matrix dual engines, which natively combines general high-performance computing power with AI computing power, and opens the DSA expansion interface to support more feature requirements

View attachment 146616

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This is actually a nice breakthrough. Each core can perform 8 TOPS matrix compute. So if you put it in an octal-core cpu, it can do 40 TOPS + the 15 SpecInt2K6/GHz score. So if operating at 3GHz, it can do 45 SpecInt2K6.

40 TOPS, you can run probably 14B parameter AI model locally.

64 core AI server would be able to run 70B parameter model pretty easily.

 

[tokenanalyst]

 

[tokenanalyst]

Design and analysis of a 0.36 NA central obscuration extreme ultraviolet objective system​

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Abstract​

The prevalent 0.33 NA unobstructed extreme ultraviolet lithography (EUVL) six-mirror objective system is characterized by a large average incidence angle at M5, which adversely affects imaging performance and energy transmission following coating. In order to improve the system performance of coated EUVL objectives, this paper presents an innovative 0.36 NA EUVL objective system, to our knowledge, designed to mitigate these issues by reducing the average incidence angle. Meanwhile, the genetic adaptive particle swarm hybrid effective set algorithm (GA-APSO-Aset), which does not need to provide a starting point, is proposed to search the initial structure of the new system, and further optimized. It achieves comprehensive wavefront aberration across the full field-of-view (FOV), exceeding the benchmark of 1/60λ (λ=13.5nm). In comparison to a conventional 0.33 NA unobstructed EUVL system, the new system exhibits an enhanced average light transmission of over 26% post-coating, providing a strategic approach for the integrated design of EUVL coatings and objective systems.

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[tokenanalyst]

Numerical Investigation of Particle Transport and Deposition Mechanisms Driven by Multiphase Explosion Coupling with Buffer Gas Stream​

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Abstract​

Debris suppression is an important problem in designing light source system of extreme ultraviolet lithography (EUVL). The study of this problem involves compressible gas-particle multiphase fluid dynamics. The transport, position distribution characteristics of debris particles, and the wall deposition mechanism within a rectangular cavity were examined from the multiphase flow perspective by employing the compressible multiphase particle-in-cell (CMP-PIC) method. Analysis indicates that particle transport can be classified into the following processes. Firstly, particle jets are triggered due to shock-driven multiphase instability. Subsequently, the bending and coalescing process of particle jets are observed under the influence of vortex and buffer gas stream. Simultaneously, particles aggregate near the center of the explosion and are transported by the buffer gas stream. Moreover, our analysis has, for the first time, disclosed three distinct deposition mechanisms, namely: Particle-buffer gas stream velocity-induced separation, high-velocity particle jet impact, and particle cluster transport driven by the buffer gas stream. Additionally, parametric study is conducted to evaluate the effect of particle diameter on the debris transport and deposition mechanism. Owing to the variation of inertia and relaxation time, there are considerable differences in the evolution, position distribution, and coalescing process with diverse diameters, which in turn affects the deposition momentum distribution and emission ratio. The research has revealed that smaller particles (dp<1μm) exhibit shorter relaxation times, enhanced expulsion via buffer gas stream, and lower deposition momentum. Whereas larger particles (dp≥1μm) lag in evolution, weaken particle jet coalescing, and increase deposition momentum due to its large inertia.

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