Chinese semiconductor thread II
- Thread starter vincent
- Start date
So, its not really 5NM. Just 7NM with packaging. So much for keeping hopes up.
Without EUV China will not move forward much. It will be all these workarounds that cost more and more.
It syas "Industry analysts suggest ...". That's just speculation by someone. The laptops haven't been shipped yet and no one has looked at the chip yet. May be it's true, may be it's not. Real info will come out after they start shipping.
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Maybe it just a 7nm with packaging that give the same performance as a 5nm chip.
I think this is the tipping point for packaging. In order to get to 3nm, they really need EUV.
If China does get a domestic EUV in hand. I think it is game over for everyone.
China is very good at packaging. You can see the results for cloudmatrix 384. By combining 384 chips together, the result is better than nvda most advanced, gb200.
Unis has come out with a SSD using YMTC die that's designed for AI market and is using fully domestic tech stack. This is basically where they are going now. Trying to have fully domestic AI stack across the board.
To be honest all the chip really has to do is perform like a 5nm chip. Hence why the analyst are probably using the term "5nm-equivalent"...
Major EDA companies—Siemens EDA, Synopsys, and Cadence maybe blocked in China
This is big if true.
I was always puzzled why US EDA toolmakers survived the export bans of the last few years....maybe their time is finally arrived now....definitely too late, but it will cause some headache for sure.
Ironically one firm that will NOT be affected by this US last shot is Huawei: they already have localized their full EDA stack.
Shares of Empyrean, Xpeedic, X-EPIC, Primarius and their other many brothers will skyrocket now!
This is big if true.
I was always puzzled why US EDA toolmakers survived the export bans of the last few years....maybe their time is finally arrived now....definitely too late, but it will cause some headache for sure.
Ironically one firm that will NOT be affected by this US last shot is Huawei: they already have localized their full EDA stack.
Shares of Empyrean, Xpeedic, X-EPIC, Primarius and their other many brothers will skyrocket now!
Probably is equivalent in price or cheaper than with EUV.
For Low-NA EUV multi-patterning is unavoidable and with the low throughput is not far away from ArF immersion. High-NA EUV is so expensive that unless ASML finds a way to cut the machine price companies are going to be stuck with multipatterning and advance packaging solutions for some time.
Chipsea Technology CS32F090: Large-capacity, cost-effective MCU
Today, with the explosive growth of the Internet of Things and smart devices, the wave of interconnection of all things is profoundly changing people's production and lifestyle, and has put forward higher requirements for embedded systems: MCU must not only have the ability to support complex tasks such as edge computing and machine learning, but also have to have larger storage space to accommodate the ever-expanding firmware and data, while also achieving breakthroughs in power consumption to extend the service life of battery-powered devices.
With the advantages of the "analog + MCU" dual technology platform, Xinhai Technology (stock code: 688595) continues to deepen its presence in the general MCU market and launches the CS32F090 series of microcontrollers. Relying on the domestic supply chain, the chip provides efficient solutions for consumer electronics, industrial automation, medical equipment and other fields with the four major features of "large-capacity storage, high-integration analog, ultra-low power consumption, and wide voltage".
CS32F090 is equipped with a high-performance 32-bit ARM Cortex-M0+ core with a main frequency of up to 48MHz, built-in 256KB Flash and 32KB SRAM. At the same time, the chip provides rich peripheral resources to cover mainstream application scenarios.
- Analog signal chain: 12-bit SAR ADC (QFN32 supports 14 channels, QFN48/LQFP48 supports 23 channels, and LQFP64 expands to 29 channels), 1 12-bit DAC, 1 operational amplifier (OPA) and analog comparator (COMP) to achieve sensor signal conditioning and excitation;
- Communication interface: 5×USART, 2×SPI, 2×I2C, compatible with industrial bus and wireless module expansion;
- Timing and control: 1 16-bit advanced control timer (supports motor control), 3 16-bit general-purpose timers;
- Display driver: Built-in Segment LCD controller, supports 4×40 to 8×36 segment code screens, adapting to diverse interaction needs.
In terms of energy efficiency design, CS32F090 adopts an industrial-grade temperature range of -40℃~85℃ and an ultra-wide voltage design of 1.7V~3.6V, and provides a low-power mode with a standby current of 2.1μA, which significantly extends the life of battery-powered devices.
The CS32F090 series provides a range of power operating modes to meet different low-power applications, making it a preferred solution in embedded system design and suitable for application scenarios such as battery protection, alarm systems, mobile phones and tablets, and medical blood pressure monitors.