I mean if they confused it with 7nm, it might be understandable but I highly doubt they will be so wrong with their information that the actual chip is in 12-14nm, which is 2 nodes back.It's actually just a 14-12nm process...
I mean if they confused it with 7nm, it might be understandable but I highly doubt they will be so wrong with their information that the actual chip is in 12-14nm, which is 2 nodes back.It's actually just a 14-12nm process...
We should keep the quality of the discussions up and not state random things like this. SMIC N+2 already has feature sizes and transistor densities between TSMC or Samsung 7nm and 8nm. In fact, N+2 has a transistor density almost 3x of any 14nm chip so there is no possibility of mixing them up.It's actually just a 14-12nm process...
Has there been any updates on Chinese EUV machines yet? Last time I heard was that they were "close". Some were saying it's just right around the corner, I'm not really knowledgeable on this subject so I can't tell how legit their claim is
Sorry Sir I don't, being busy now a days I don't have the time to do some research, plus @WTAN, @Oldschool and some of my contacts seems busy as well. Well to be honest sir I do expect the slowness of news cause we had already discuss the chip tech development since 2022 like the SMEE 800A, the 2025 timetable and the emergence of SMIC N+4 or Huawei Kirin 9040 3nm chip with conjunction of the Chinese EUV in 2026. All we had to do is wait and it had become boring as patience is least of my virtue and knowing China all the things that we had discussed had become a reality cause she never disappoint.There are so many news recently about Huawei is currently testing EUV machine in its Dongguan facility and it will be "mass" produced in 2026 ... I am not sure whether it is true or just a rumour .. but heyy, there is no smoke if there is no fire
@ansy1968 ... any update from you ?
From what I observed and learn from this forumWe should keep the quality of the discussions up and not state random things like this. SMIC N+2 already has feature sizes and transistor densities between TSMC or Samsung 7nm and 8nm. In fact, N+2 has a transistor density almost 3x of any 14nm chip so there is no possibility of mixing them up.
yeah and you gradually increase performance and density of process.Some observers believe that although SMIC's N+3 process is "5nm", but improvement compared to N+2 is not that great. It is actually closer to Samsung's "5nm" and TSMC's N6, still cannot compete with TSMC’s N5
Hello bro, nice to hear from you again, do you think SMIC or Huawei may used their Chinese EUV exclusively for their 3nm nodes only while concentrate their 5nm production solely on their DUV?yeah and you gradually increase performance and density of process.
N+3 development completed last year. it was pretty quick from N+2 to N+3.. in next 10-12 months SMIC will increase its density to 150 MTr/mm2.
what i have heard from my source is, 5nm is the last process with DUVi.. for 3nm they are waiting for EUV. SMIC continue to improve N+3 in coming months to increase performance and density..Hello bro, nice to hear from you again, do you think SMIC or Huawei may used their Chinese EUV exclusively for their 3nm nodes only while concentrate their 5nm production solely on their DUV?
I want your opinion cause for China, the urgency is there for them to have a parallel program to kept in pace with TSMC and stay ahead of Samsung, while maintaining a 2 generation gap with Intel (who is still stuck, having problem with their 7nm nodes).