I mean if they confused it with 7nm, it might be understandable but I highly doubt they will be so wrong with their information that the actual chip is in 12-14nm, which is 2 nodes back.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
We should keep the quality of the discussions up and not state random things like this. SMIC N+2 already has feature sizes and transistor densities between TSMC or Samsung 7nm and 8nm. In fact, N+2 has a transistor density almost 3x of any 14nm chip so there is no possibility of mixing them up.
antiterror13
Brigadier
There are so many news recently about Huawei is currently testing EUV machine in its Dongguan facility and it will be "mass" produced in 2026 ... I am not sure whether it is true or just a rumour .. but heyy, there is no smoke if there is no fire
@ansy1968 ... any update from you ?
Sorry Sir I don't, being busy now a days I don't have the time to do some research, plus @WTAN, @Oldschool and some of my contacts seems busy as well. Well to be honest sir I do expect the slowness of news cause we had already discuss the chip tech development since 2022 like the SMEE 800A, the 2025 timetable and the emergence of SMIC N+4 or Huawei Kirin 9040 3nm chip with conjunction of the Chinese EUV in 2026. All we had to do is wait and it had become boring as patience is least of my virtue and knowing China all the things that we had discussed had become a reality cause she never disappoint.
From what I observed and learn from this forum
SMIC product line and comparison
N+1 = Samsung 8nm
N+2 = TSMC N7 first gen 7nm duv
N+2 plus =TSMC N7P
N+3 (5nm duv)? since we don't know the spec, maybe around the same performance with TSMC N6 6nm
So what about SMIC N+4 3NM? from what we know it will only be produced using EUV and since Liang Mog Song had already finished the development of both 5nm and 3nm nodes since April 2021 while waiting for the necessary equipment, I expect from the get go it will have the same performance with TSMC 3nm.
Liang Mong Song: SMIC's 7nm node has already completed full development, and is preparing for mass production in April 2021. Designs and most of the development for 5nm and 3nm nodes have also already been completed, only awaiting EUVL delivery at this point.
I for one will be sad that in 2026 when SMIC N+4 3nm appeared, we may see Liang Mong Song official retire after seeing his precious baby being born.
yeah and you gradually increase performance and density of process.
N+3 development completed last year. it was pretty quick from N+2 to N+3.. in next 10-12 months SMIC will increase its density to 150 MTr/mm2.
Hello bro, nice to hear from you again, do you think SMIC or Huawei may used their Chinese EUV exclusively for their 3nm nodes only while concentrate their 5nm production solely on their DUV?
I want your opinion cause for China, the urgency is there for them to have a parallel program to kept in pace with TSMC and stay ahead of Samsung, while maintaining a 2 generation gap with Intel (who is still stuck, having problem with their 7nm nodes).
what i have heard from my source is, 5nm is the last process with DUVi.. for 3nm they are waiting for EUV. SMIC continue to improve N+3 in coming months to increase performance and density..
Huawei has already set its target date for 3nm.
soon SMIC 7nm capacity will be available for Non-Huawei customers too.
SMIC and Huawei both running their advanced nodes programs in parallel.