Chinese semiconductor thread II

J

JPaladin32

New Member
Registered Member
Legume7 said:
What Xiaomi did is not "wrong," but their "Jai Hind" tactics are becoming more and more extreme. They and their influencers are misleading the public by claiming the chip is completely "self-developed" and directly comparing Xuanjie to Kirin, while neglecting to mention that their chips are fabbed at TSMC.

This appeal to patriotism is particularly two-faced given than Xiaomi executives were publically celebrating when Huawei got sanctioned for the first time. And this is on top of Xiaomi's other high-profile incidents in the last few months: SU7 crashes, SU7 Ultra false marketing, mobilizing their influencers and internet army to defame their competitors, stealing IP from competitors, etc.

Also, there is a regional rivalry aspect to this as Beijing's tech giants (Baidu, Xiaomi, Lenovo) have failed to become world leaders in the same way their Hangzhou and Shenzhen counterparts have, hence the Beijing governments eagerness to promote Xiaomi's "3 nm breakthrough."
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Although I do agree with you that it has crossed the line a bit when some of their recent social media presence started to label XRing O1 as far as 'domestically manufactured' while in fact it is not, on this forum what people care most are insights and technological progress rather than what's happening on social media. We should leave non-technical stuff outside our discussions.

What interests me the most is the 10-core configuration on O1. Mediatek has concluded A520 little cores are useless which I agree but O1 added two of them to an otherwise normal 8-core setup. Even Kirin 9020 with its SMIC 7nm process has abandoned A5XX in favor of its Taishan little cores for better efficiency, so I'm not sure why O1 with TSMC 3nm and plenty of transistor budget for larger cores thinks there is a need for these.
 
T

tokenanalyst

Brigadier
Registered Member
ACM Research is planning to build a pilot line. Pretty much the same as Naura, SMEE and others had since 2021, SMEE interacted their lithography scanners including the immersion lithography scanner in those pilot lines.​

Shengmei Shanghai adjusts the fundraising quota for investment projects, and the investment amount of the test platform is reduced to 922 million yuan​


On May 21, Shengmei Shanghai issued an announcement stating that on May 20, the company reviewed and approved the "Proposal on Adjusting the Company's 2024 A-share Stock Issuance Plan to Specific Objects". The total amount of funds raised was changed from 450,000 million yuan to 448,200 million yuan, and the amount of funds to be invested in the "R&D and Process Testing Platform Construction Project" was changed from 94,034.85 million yuan to 92,234.85 million yuan. In addition, there are no other changes to the content of the company's issuance plan.
Previously, Shengmei Shanghai planned to raise 4.5 billion yuan in a private placement to be used for R&D and process testing platform construction projects, high-end semiconductor equipment iterative R&D project construction, and to supplement working capital.
Among them, the R&D and process testing platform construction project is the project for which the investment amount has been reduced. This project will draw on the experience of international leading semiconductor equipment companies in setting up their own process testing lines, use the company's existing process testing clean rooms to simulate the production environment of a wafer manufacturing plant, configure necessary R&D testing instruments and purchased equipment such as lithography machines, CMP machines, and ion implanters, and combine it with a variety of self-made process equipment to create an integrated circuit equipment R&D and process testing platform to improve the company's industrial layout in the R&D and testing links.
The estimated construction period of this project is 4 years, with a total planned investment of RMB 940.3485 million, of which RMB 922.3485 million will be raised funds.

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