proelite
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Does this have any medium to long term geopolitical implications?
Chinese semiconductor thread II
- Thread starter vincent
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Does this have any medium to long term geopolitical implications?
If you meant Skydio potentially putting it in one of their kamikaze drones and selling them for half a million dollars a piece, then yes.
Weichong Semiconductor received tens of millions of yuan in A+ round financing, and is a semiconductor testing equipment manufacturer
Wei Chong Semiconductor officially announced the completion of a tens of millions of yuan A+ round of financing, jointly invested by Jinyu Maowu, Optics Valley Semiconductor Investment, and Sena Capital. Wei Chong Semiconductor's current round of financing funds will be used for research and development, market expansion and team building.
Wei Chong Semiconductor was founded in 2021 and focuses on wafer inspection technology. It has a team of overseas returnees and senior domestic scientists, and is committed to becoming the world's advanced semiconductor inspection equipment R&D and manufacturer. Wei Chong Semiconductor's independently developed second harmonic, thermal wave and other equipment can realize non-contact, non-destructive, online, fast, and internal inspection of wafers, accurately identify and locate wafer defects, and bring huge value to customers at all stages of research and development, ramp-up, and mass production. It also provides new impetus for the huge innovation of the semiconductor front-end inspection industry.
The first Loongson development board "ATK-DL2K0300" released: LS2K0300 chip + 1GB RAM + 8GB eMMC storage priced at 349 yuan
According to the official WeChat account of "Zhengdian Atom", Zhengdian Atom and Loongson officially released the first Loongson development board "ATK-DL2K0300 development board", which is based on the Loongson LS2K0300 chip and priced at 349 yuan.
According to the official WeChat account of "Zhengdian Atom", Zhengdian Atom and Loongson officially released the first Loongson development board "ATK-DL2K0300 development board", which is based on the Loongson LS2K0300 chip and priced at 349 yuan.
The Institute of Microelectronics of the Chinese Academy of Sciences has made new progress in the research of chiplet thermal simulation tools
The multi-physics simulation research group of the EDA Center of the Institute of Microelectronics has built a three-dimensional grid transient heat flow simulation model for chiplet integration, which can realize efficient and accurate simulation of transient heat flow of chiplet integrated chips, laying a core technical foundation for temperature hotspot detection and temperature sensing layout optimization of chiplet heterogeneous integration. At the same time, the research group has made arrangements in the multi-physics simulation of integrated chip electrothermal force, and carried out research work such as DC voltage drop, thermal stress and wafer warpage simulation.
The multi-physics simulation research group of the EDA Center of the Institute of Microelectronics has built a three-dimensional grid transient heat flow simulation model for chiplet integration, which can realize efficient and accurate simulation of transient heat flow of chiplet integrated chips, laying a core technical foundation for temperature hotspot detection and temperature sensing layout optimization of chiplet heterogeneous integration. At the same time, the research group has made arrangements in the multi-physics simulation of integrated chip electrothermal force, and carried out research work such as DC voltage drop, thermal stress and wafer warpage simulation.
The paper on storage and computing integrated chip of the Institute of Microelectronics of the Chinese Academy of Sciences was selected for the ISSCC 2025 conference
The team led by Researcher Zhang Feng from the National Key Laboratory of Integrated Circuit Manufacturing Technology has designed a transposable approximate and precise dual-mode floating-point storage and computation integrated macro chip. Through the proposed cyclic weight mapping SRAM scheme, the chip can reuse the multiplication and addition units during forward and backward propagation, and while realizing the transposition function, it greatly improves the energy efficiency and computing power density compared to the previous transposition storage and computation integrated macro unit. Through the proposed signed fixed-point mantissa encoding method and vector granularity pre-alignment scheme, the chip achieves compatible support for multiple floating-point and fixed-point number systems, and has a smaller precision loss than the traditional coarse-grained floating-point pre-alignment scheme. Through the proposed approximate and precise dual-mode multiplication and addition circuit design, the chip can turn on the approximate mode in the inference link with low precision requirements, thereby obtaining a 12% speed increase and a 45% energy consumption reduction, and can turn on the precise mode in the training link with high precision requirements to ensure no precision loss.
The team led by Researcher Zhang Feng from the National Key Laboratory of Integrated Circuit Manufacturing Technology has designed a transposable approximate and precise dual-mode floating-point storage and computation integrated macro chip. Through the proposed cyclic weight mapping SRAM scheme, the chip can reuse the multiplication and addition units during forward and backward propagation, and while realizing the transposition function, it greatly improves the energy efficiency and computing power density compared to the previous transposition storage and computation integrated macro unit. Through the proposed signed fixed-point mantissa encoding method and vector granularity pre-alignment scheme, the chip achieves compatible support for multiple floating-point and fixed-point number systems, and has a smaller precision loss than the traditional coarse-grained floating-point pre-alignment scheme. Through the proposed approximate and precise dual-mode multiplication and addition circuit design, the chip can turn on the approximate mode in the inference link with low precision requirements, thereby obtaining a 12% speed increase and a 45% energy consumption reduction, and can turn on the precise mode in the training link with high precision requirements to ensure no precision loss.
New breakthrough by Professor Yu Linwei's team at Nanjing University: High-performance GAA-FET device based on growth-integrated nanowire channel is developed
Professor Yu Linwei's team from the School of Electronic Science and Engineering at Nanjing University has made important progress in the field of gate-all-around field-effect transistors (GAA-FETs), and has successfully developed high-performance GAA-FET devices based on growth-integrated nanowire channels. This breakthrough provides a new technical path for the development of future integrated circuits.
Professor Yu Linwei's team from the School of Electronic Science and Engineering at Nanjing University has made important progress in the field of gate-all-around field-effect transistors (GAA-FETs), and has successfully developed high-performance GAA-FET devices based on growth-integrated nanowire channels. This breakthrough provides a new technical path for the development of future integrated circuits.
China Advances in AI Chips: Huawei Reportedly Boosts Yield to 40%, Making Ascend Line Profitable
According to the , Huawei has boosted the yield of its latest AI chips to nearly 40%, doubling from 20% a year ago.
That should not take more than 3000-4000 wafers.
Super Micro plans to invest 1 billion yuan to build electron beam and optical measurement equipment project
According to Shanghai Lingang, on the afternoon of February 24, the Lingang New Area Management Committee and Supermicro Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "Supermicro") signed a strategic cooperation agreement. Supermicro is mainly engaged in the research and development and industrialization of electron beam and optical measurement equipment. It plans to invest 1 billion yuan to build an electron beam and optical measurement equipment research and development and manufacturing base project in Lingang, focusing on the development of major integrated circuit equipment technology and product marketization, and exploring the application of artificial intelligence in image processing and equipment intelligence
According to Shanghai Lingang, on the afternoon of February 24, the Lingang New Area Management Committee and Supermicro Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "Supermicro") signed a strategic cooperation agreement. Supermicro is mainly engaged in the research and development and industrialization of electron beam and optical measurement equipment. It plans to invest 1 billion yuan to build an electron beam and optical measurement equipment research and development and manufacturing base project in Lingang, focusing on the development of major integrated circuit equipment technology and product marketization, and exploring the application of artificial intelligence in image processing and equipment intelligence